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Flake alumina porous ceramic used for high-power LED lamp chip heat dissipation, and preparation method thereof

A technology of flaky alumina and porous ceramics, which is applied in the field of porous heat dissipation ceramics, can solve problems such as inhomogeneous alumina dispersion, uneven ceramic structure, and poor compatibility, so as to reduce cracking failure problems, improve thermal conductivity, and transition good effect

Inactive Publication Date: 2015-12-02
合肥凯士新材料贸易有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method cannot disperse the alumina uniformly, it is easy to agglomerate, and the ceramic structure is not uniform, and if the ceramic sheet is applied to the LED heat sink, it is necessary to improve the toughness, thermal conductivity, crack resistance, and heat resistance of the ceramic.
The compatibility between the ceramic sheet and metal is relatively poor and needs to be improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] A sheet-shaped alumina porous ceramic for heat dissipation of high-power LED lamp chips, made of the following raw materials in parts by weight (kg): α-Al 2 o 3 (Particle size is 2-8μm) 35, deionized water 103, sodium polyacrylate 0.3, methyl cellulose 2.2, glycerol 1.7, LiSbO 3 1.5, potassium sodium niobate 2.5, CaF 2 0.5, reduced iron powder 1.7, nano aluminum hydroxide 4.5, nano copper 1.3, PVA binder 1.

[0016] The production method of the sheet-shaped alumina porous ceramics for heat dissipation of the high-power LED lamp chip is characterized in that:

[0017] (1) Add α-Al 2 o 32 , reduced iron powder, deionized water, and sodium polyacrylate are mixed to obtain a suspension, and the suspension is ball milled for 5.5 hours, and LiSbO 3 , Potassium Sodium Niobate, and CaF, mix evenly, then add PVA binder, mix evenly, then add nano-aluminum hydroxide, ball mill for 0.7h, and stand for 50min to obtain a slurry;

[0018] (2) Add methylcellulose and glycerol to ...

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Abstract

The invention discloses a flake alumina porous ceramic used for high-power LED lamp chip heat dissipation. The flake alumina porous ceramic is prepared from, by weight, 34 to 36 parts of alpha-Al2O3 (particle size ranging from 2 to 8<mu>m), 100 to 105 parts of deionized water, 0.2 to 0.3 part of sodium polyacrylate, 2 to 2.3 parts of methylcellulose, 1.6 to 1.8 parts of glycerin, 1.4 to 1.6 parts of LiSbO3, 2 to 3 parts of potassium-sodium niobate, 0.4 to 0.6 part of CaF2, 1.5 to 1.8 parts of reductive iron powder, 4 to 5 parts of nano-aluminium hydroxide, 1.2 to 1.5 parts of nano-copper, and 0.9 to 1.1 parts of PVA binder. Compatibility of ceramic with metal is improved via adding nano-copper into the flake alumina porous ceramic; ceramic thermal conductivity and recombination property with metal are improved greatly via adding of LiSbO3, potassium-sodium niobate, CaF2, and reductive iron powder; and the flake alumina porous ceramic is suitable for high-power LED chip heat dispersion.

Description

technical field [0001] The invention relates to the field of porous heat dissipation ceramics, in particular to a sheet-shaped alumina porous ceramic for heat dissipation of high-power LED lamp chips and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is a type of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has strong market potential, and high-power LEDs are considered by the industry to be the main direction of the lighting source market1. At the current level, high-power LEDs can only convert 10% to 20% of the input power into light energy, and the remaining 80% to 90% are converted into heat energy. In order to ensure its normal operation, it is necessary to ensure that the operating temperature of the LED is within the allowable range through an effective heat dissipation design. Therefore, the heat dissipation problem of high-power LED chips has become an obstacle to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B38/06
Inventor 董照海
Owner 合肥凯士新材料贸易有限公司
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