Solar cell structure with anti-potential induced degradation (PID) effect and production method of solar cell structure

A technology of solar cells and production methods, applied in the manufacture of circuits, electrical components, final products, etc., can solve problems such as difficult control, difficult control of oxide layer growth, and not very dense oxide layer, and achieve good effect and passivation Better effect, good passivation effect

Active Publication Date: 2015-12-09
선테크파워컴퍼니리미티드
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Problems solved by technology

[0013] Using HNO 3 The solution is subjected to wet oxygen oxidation. Since the oxide layer grown by wet chemical method is not very dense, and it is not easy to control the growth of the oxide layer, it is not easy to control in actual production.
[0014] The way of

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  • Solar cell structure with anti-potential induced degradation (PID) effect and production method of solar cell structure
  • Solar cell structure with anti-potential induced degradation (PID) effect and production method of solar cell structure
  • Solar cell structure with anti-potential induced degradation (PID) effect and production method of solar cell structure

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Embodiment Construction

[0087] In order to describe the technical content of the present invention more clearly, further description will be given below in conjunction with specific embodiments.

[0088] Such as Figure 1~2 Said, the anti-PID effect solar cell structure and production method are as follows: attach P+ layer 6 on aluminum back plate 7, select traditional P-type crystal silicon substrate 5, under the environment of alkaline solution, carry out pyramid suede The preparation of the P-type crystalline silicon substrate is put into the mixed acid solution of HF / HCl for pickling to remove the residual metal impurity ions on the surface of the P-type crystalline silicon substrate; then it is placed in a high-temperature quartz diffusion furnace for high-temperature diffusion, Prepare the N-type layer diffusion layer 4; remove the edge N-type layer of the diffused P-type crystalline silicon substrate 5, and remove the surface phosphosilicate glass layer, that is, the etching process; the etche...

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Abstract

The invention relates to a solar cell structure with an anti-potential induced degradation (PID) effect and a production method of the solar cell structure. The solar cell comprises a base layer, a P+ layer, a silicon base body, a diffusion layer, a thermal oxidation SiOx layer, a dual-layer plasma enhanced chemical vapor deposition (PECVD) SiNx film and an Ag electrode, wherein the thermal oxidation SiOx layer is used for improving the anti-PID capacity of the solar cell; and the production method of the solar cell with the anti-PID effect comprises a pretreatment step, a high-temperature quartz tube cleaning saturation step, a high-temperature oxidation step, a growth step of the dual-layer PECVD SiNx film and a post-treatment step. The physical structure of SiOx is applied to the surface of the solar cell to form a stable film layer, so that the influenceon the solar cell caused by the outside iseffectively isolated; and the anti-PID effect is reached. The anti-PID effect can be realized without inputting of lot of money for equipment purchasing and gas path transformation; an oxidation layer grown by the method is good in compactness; and the anti-PID attenuation test result at an assembly end shows that the assembly power attenuation is kept at 0.5%-1.5% and bettter-than-expected anti-PID effects are achieved.

Description

technical field [0001] The present invention relates to the field of solar cell manufacturing, in particular to the field of photovoltaic solar cell manufacturing, in particular to a solar cell structure and production method resistant to PID effect. Background technique [0002] In recent years, the problem of power generation reduction of photovoltaic systems caused by the potential induced degradation (PID) phenomenon of components has attracted more and more people's attention. This phenomenon was first discovered by Sunpower in 2005. PID refers to the leakage current between the glass and the packaging material when the module is under high voltage for a long time, resulting in the performance of the module being lower than the design standard. In 2010, the US Renewable Energy Laboratory (NREL) and Solon Corporation found that the components prepared by using P-type crystalline silicon cells have potential PID phenomenon under negative bias. When the PID phenomenon is ...

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Application Information

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IPC IPC(8): H01L31/0216H01L31/18
CPCH01L31/0216Y02P70/50
Inventor 任勇何悦王在发
Owner 선테크파워컴퍼니리미티드
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