Non-cyanide alkaline copper plating agent and using method thereof

A technology of cyanide-free copper plating and cyanide copper plating agent, which is applied in the field of alkaline cyanide-free copper plating agent, can solve the problems of poor anode solubility, poor solution stability, and difficult wastewater treatment, and achieve good cathode polarization ability, Good binding force, fine coating without brittle effect

Inactive Publication Date: 2015-12-16
钱宏彬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, although some cyanide-free copper plating processes have appeared at home and abroad, they all have defects of varying degrees, mainly poor bonding force, poor anode solubility, long burrs in the coating, narrow process range, poor solution stability and waste water treatment. difficulty

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Prepare 1000kg alkaline cyanide-free copper plating agent, get sodium carbonate 30kg, salt of wormwood 40kg, potassium chloride 500kg, sodium chloride 300kg, sodium tartrate 15kg, glycolic acid 15kg, sodium gluconate 100kg, above each composition is fully mixed, obtains Alkaline cyanide-free copper plating agent; according to the amount of sodium cyanide that needs to be added after the analysis of the cyanide copper plating solution, the alkaline cyanide-free copper plating agent is weighed, and the measured alkaline cyanide-free zinc plating agent is mixed with the plating solution It is fully dissolved, then added to the plating tank, stirred evenly, and the current density is set to 2A / dm 2 , the pH value of the plating solution is 9, the temperature is 30 ℃, the deposition rate and deep plating ability of electroplating are significantly improved, and the plated product is uniform and meticulous, semi-bright, non-brittle, high-temperature baking does not bubble, and...

Embodiment 2

[0036] Prepare 1000kg alkaline cyanide-free copper plating agent, get sodium carbonate 30kg, salt of wormwood 40kg, potassium chloride 500kg, sodium chloride 300kg, sodium tartrate 15kg, glycolic acid 15kg, sodium gluconate 100kg, above each composition is fully mixed, obtains Alkaline cyanide-free copper plating agent; according to the amount of sodium cyanide that needs to be added after the analysis of the cyanide copper plating solution, the alkaline cyanide-free copper plating agent is weighed, and the measured alkaline cyanide-free zinc plating agent is mixed with the plating solution It is fully dissolved, then added to the plating tank, stirred evenly, and the current density is set to 2A / dm 2 , the pH value of the plating solution is 10, and the temperature is 35°C. The deposition rate and deep plating ability of electroplating are significantly improved. The plated product coating is uniform and meticulous, semi-bright, non-brittle, high-temperature baking does not bu...

Embodiment 3

[0038] Prepare 1000kg alkaline cyanide-free copper plating agent, get sodium carbonate 30kg, salt of wormwood 40kg, potassium chloride 500kg, sodium chloride 300kg, sodium tartrate 15kg, glycolic acid 15kg, sodium gluconate 100kg, above each composition is fully mixed, obtains Alkaline cyanide-free copper plating agent; according to the amount of sodium cyanide that needs to be added after the analysis of the cyanide copper plating solution, the alkaline cyanide-free copper plating agent is weighed, and the measured alkaline cyanide-free zinc plating agent is mixed with the plating solution It is fully dissolved, then added to the plating tank, stirred evenly, and the current density is set to 2A / dm 2 , the pH value of the plating solution is 11, and the temperature is 40°C. The deposition rate and deep plating ability of electroplating are significantly improved. The plated product coating is uniform and meticulous, semi-bright, non-brittle, high-temperature baking does not bu...

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PUM

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Abstract

The invention discloses a non-cyanide alkaline copper plating agent and a using method thereof. The non-cyanide alkaline copper plating agent comprises the following substances: a pH regulator, a current stabilizer, a change agent and a complexing agent. By using the non-cyanide alkaline copper plating agent, sodium cyanide in the conventional cyanide copper plating solution can be replaced without changing the original process, and the totally non-cyanide alkaline copper plating process can be used to solve the multiple disadvantages existing in the conventional non-cyanide alkaline copper plating processes at home and abroad, thereby allowing the non-cyanide alkaline copper plating process to reach a cyanide copper plating level. The non-cyanide alkaline copper plating agent and the using method have the characteristics that the current efficiency and the deposition velocity are high; the cathode polarization capability and a binding force are good; a coating layer is exquisite, tamping-resistant and scratch-resistant, and has no brittleness; no bubble is generated under high temperature baking; the non-cyanide alkaline copper plating agent can be directly used for barrel plating and rack plating of steel and brass, and used for copper plating of zinc die castings, zinc alloys and aluminium alloys; the treatment on waste water is easy; the requirements of cleaning production are met; the long-standing worldwide problems of harms to persons, and damage and pollution to the ecological environment caused by cyanide are solved; and an international blank is filled.

Description

technical field [0001] The invention relates to an alkaline cyanide-free copper plating agent and a using method thereof. Background technique [0002] Electroplating copper occupies a large proportion in electroplating. The copper plating layer is uniform, meticulous, and widely used. It is mainly used as the base layer or intermediate layer of nickel plating, tin plating, silver plating and gold plating to improve the bonding force between the base metal and the surface coating, and can also reduce the pores of the coating and improve the corrosion resistance of the coating. Performance; in decorative chrome plating, thick copper and thin nickel plating are often used to save metal nickel. Copper plating has several other uses as well. [0003] At present, the copper plating processes for industrial applications mainly include cyanide copper plating, acid copper plating and pyrophosphate copper plating. [0004] Cyanide copper plating can be directly used as a primer co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 钱宏彬
Owner 钱宏彬
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