High-reliability copper alloy bonding wire for microelectronic packaging and manufacturing method thereof

A microelectronic packaging and copper alloy technology, applied in the field of bonding wires, can solve the problems of corrosion resistance and cold working, wire surface corrosion, weakening of element effects, etc., to improve reliability and safety, good electrical and thermal conductivity, The effect of improving overall performance

Inactive Publication Date: 2015-12-23
NICHE TECH KAISER SHANTOU
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Copper is considered to be a suitable bonding wire material to replace gold due to its excellent thermal and electrical properties and lower price. However, copper wire has a series of disadvantages compared with gold wire: the surface of the wire is easily oxidized, resulting in reduced bonding strength, It is easy to cause corrosion on the surface of the wire during resin encapsulation, and the high hardness is easy to cause damage to the substrate during wiring, etc.
The copper wire with this alloy composition not only overcomes the problems of high hardness and poor welding performance of pure copper wire, but also has high conductivity and elongation, good weldability and low cost, but there are still two problems: (1) The content of O and S is not controlled. If the content of O is too high, the plasticity and toughness of the copper wire will be deteriorated, and the added elements will be oxidized so that the alloying effect is not obvious; (2) The casting process adopts the method of casting, ingot casting There is casting stress inside, and...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-reliability copper alloy bonding wire for microelectronic packaging and manufacturing method thereof
  • High-reliability copper alloy bonding wire for microelectronic packaging and manufacturing method thereof
  • High-reliability copper alloy bonding wire for microelectronic packaging and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] In this embodiment, the preparation method of high-reliability copper alloy bonding wire for microelectronic packaging includes the following steps in sequence:

[0034] (1) Preparation of master alloy: equipped with required Ru, Nb, Zr, Mn, Mg, Li, Dy, respectively using copper with a purity of more than 99.9999% as raw material to melt the master alloy;

[0035] In this step (1), the master alloys to be prepared include Cu-Ru master alloys, Cu-Nb master alloys, Cu-Zr master alloys, Cu-Mn master alloys, Cu-Mg master alloys, Cu-Li master alloys, Cu -Dy master alloy. Taking the Cu-Mn master alloy as an example, the method for preparing the Cu-Mn master alloy is: the copper with a purity of 99.9999% is equipped with 0.3% (weight) elemental Mn and 99.7% (weight); then the elemental Mn is put into vacuum smelting In the feeding device of the furnace, copper is then put into the crucible of the vacuum melting furnace; then the inside of the vacuum melting furnace is evacuat...

Embodiment 2

[0048] In this embodiment, the preparation method of high-reliability copper alloy bonding wire for microelectronic packaging includes the following steps in sequence:

[0049] (1) Preparation of master alloy: equipped with required Ru, Nb, Zr, Mn, Mg, Li, Dy, respectively using copper with a purity of more than 99.9999% as raw material to melt the master alloy;

[0050] In this step (1), the master alloys to be prepared include Cu-Ru master alloys, Cu-Nb master alloys, Cu-Zr master alloys, Cu-Mn master alloys, Cu-Mg master alloys, Cu-Li master alloys, Cu -Dy master alloy. Taking the Cu-Mn master alloy as an example, the method for preparing the Cu-Mn master alloy is: the copper with a purity of 99.9999% is equipped with 0.4% (weight) elemental Mn and 99.6% (weight); then the elemental Mn is put into vacuum smelting In the feeding device of the furnace, copper is then put into the crucible of the vacuum melting furnace; then the inside of the vacuum melting furnace is evacuat...

Embodiment 3

[0063] In this embodiment, the preparation method of high-reliability copper alloy bonding wire for microelectronic packaging includes the following steps in sequence:

[0064] (1) Preparation of master alloy: equipped with required Ru, Nb, Zr, Mn, Mg, Li, Dy, respectively using copper with a purity of more than 99.9999% as raw material to melt the master alloy;

[0065] In this step (1), the master alloys to be prepared include Cu-Ru master alloys, Cu-Nb master alloys, Cu-Zr master alloys, Cu-Mn master alloys, Cu-Mg master alloys, Cu-Li master alloys, Cu -Dy master alloy. Taking the Cu-Mn master alloy as an example, the method for preparing the Cu-Mn master alloy is: the copper with a purity of 99.9999% is equipped with 0.1% (weight) elemental Mn and 99.9% (weight); then the elemental Mn is put into vacuum smelting In the feeding device of the furnace, copper is then put into the crucible of the vacuum melting furnace; then the inside of the vacuum melting furnace is evacuat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Wire diameteraaaaaaaaaa
Wire diameteraaaaaaaaaa
Wire diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses a high-reliability copper alloy bonding wire for microelectronic packaging. The high-reliability copper alloy bonding wire for microelectronic packaging is characterized in that the bonding wire comprises, by weight, 0.001%-0.005% of Ru, 0.001%-0.005% of Nb, 0.001%-0.005% of Zr, 0.001%-0.005% of Mn, 0.001%-0.005% of Mg, 0.001%-0.005% of Li, 0.001%-0.003% of Dy and the balance copper and inevitable impurities, and the content of S and O in the impurities in the whole copper alloy bonding wire is less than or equal to 0.0005%. The invention further provides a manufacturing method of the high-reliability copper alloy bonding wire for microelectronic packaging. The copper alloy bonding wire has the advantages of being high in reliability, low in hardness, good in electrical conductivity and heat conductivity and the like. The manufacturing method is easy to operate.

Description

technical field [0001] The invention relates to a bonding wire for packaging, in particular to a high-reliability copper alloy bonding wire for microelectronic packaging and a preparation method thereof. Background technique [0002] Bonding wire is used as an electrical connection wire to connect the electrodes on the semiconductor element and the external terminals, mainly 4N series (purity >99.99% (weight)) gold and other trace element alloys with a wire diameter of about 20-50 μm However, because gold is expensive and the price has continued to rise in recent years, finding materials to replace gold wires has always been a research hotspot in the field of electronic packaging. [0003] Copper is considered to be a suitable bonding wire material to replace gold due to its excellent thermal and electrical properties and lower price. However, copper wire has a series of disadvantages compared with gold wire: the surface of the wire is easily oxidized, resulting in reduce...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C22C9/00C22C9/05C22C1/03C22F1/08
Inventor 周振基周博轩田首夫
Owner NICHE TECH KAISER SHANTOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap