Epoxy resin microsphere and preparation method thereof

A technology for curing epoxy resin and epoxy resin, which is applied in the field of epoxy resin microspheres and its preparation, can solve the problems of low yield of epoxy resin microspheres, low recycling rate of waste liquid, environmental pollution, etc., and achieve The effect of uniform particle size, low cost and high product yield

Active Publication Date: 2015-12-30
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the defects existing in the existing preparation technology of epoxy resin microspheres, the object of the present invention is to provide a novel preparation method of epoxy resin microspheres, which is a novel phase separation method, which effectively solves the problem

Method used

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  • Epoxy resin microsphere and preparation method thereof
  • Epoxy resin microsphere and preparation method thereof
  • Epoxy resin microsphere and preparation method thereof

Examples

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Effect test

Embodiment 1

[0031] The preparation method of the epoxy resin microsphere that the present embodiment provides comprises the steps:

[0032] (1) At 30°C, mix 22g of polyethylene oxide diol (molecular weight: 1000) and 19.8g of bisphenol A epoxy resin (E-55) and ultrasonically disperse for 10min to obtain a transparent liquid mixture A;

[0033] (2) Add 2g of triethylenetetramine to the transparent liquid mixture A, and perform ultrasonic dispersion at 35°C for 10 minutes to obtain a uniform transparent mixture liquid B. For its digital photos, see the attached figure 1 As shown in Figure A.

[0034] (3) The mixture liquid B was solidified at 65°C for 1.5h, and cooled naturally to obtain a white emulsion C containing epoxy resin microspheres. For its digital photos, see the attached figure 1 Figure B.

[0035] (4) Filter the white emulsion C, wash with deionized water, and dry to obtain epoxy resin microspheres with a yield of 100%. The average particle size of the microspheres is 800nm. ...

Embodiment 2

[0044] (1) At 35°C, mix 42g of polytetrahydrofuran diol (molecular weight: 1000) and 36g of bisphenol A epoxy resin (E-55) and ultrasonically disperse for 12min to obtain a transparent liquid mixture A;

[0045] (2) Add 3g of ethylenediamine to the transparent liquid mixture A, and carry out ultrasonic dispersion at 35°C for 12 minutes to obtain a uniform transparent mixture liquid B.

[0046] (3) The mixture liquid B was solidified at 65°C for 1.5h, and cooled naturally to obtain a white emulsion containing epoxy resin microspheres.

[0047] (4) Filter the white emulsion, wash with deionized water, and dry to obtain the product epoxy resin microspheres, with a yield of 100% and an average particle size of 850 nm.

[0048] The filtrate can be dehydrated under the conditions of 95° C. and a vacuum of 0.1 MPa, and polytetrahydrofuran diol can be recovered. The recyclables can be recycled, do not pollute the environment, and improve economic benefits.

Embodiment 3

[0050] (1) At 30°C, mix 24g of polyethylene glycol (molecular weight: 1000) and 20g of bisphenol A epoxy resin (E-55) and ultrasonically disperse for 14min to obtain a transparent liquid mixture A;

[0051] (2) Add 2.5g of tetraethylene trian to the transparent liquid mixture A, and carry out ultrasonic dispersion at 35°C for 15 minutes to obtain a uniform transparent mixture liquid B.

[0052] (3) The mixture liquid B was solidified at 65°C for 1.5h, and cooled naturally to obtain a white emulsion containing epoxy resin microspheres.

[0053] (4) Filter the white emulsion, wash with deionized water, and dry to obtain the product epoxy resin microspheres with a yield of 100% and an average particle size of 900 nm.

[0054] The filtrate can be dehydrated under the conditions of 95°C and a vacuum of 0.1MPa, and polyethylene glycol can be recovered. The recyclables can be recycled, do not pollute the environment, and improve economic benefits.

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Abstract

The invention discloses an epoxy resin microsphere and a preparation method thereof. The preparation method comprises the following steps: uniformly mixing 120-150 parts by weight of dispersed emulsifier polyether dibasic alcohol and 100 parts by weight of bisphenol A epoxy resin with the softening point of lower than 30 DEG C, adding ethylenediamine and other epoxy resin curing agents, curing, and naturally cooling to obtain an epoxy resin microsphere white emulsion; and cleaning the white emulsion, filtering and drying to obtain the epoxy resin microsphere. The particle size of the epoxy microsphere can be adjusted within the range of 800nm to 5 mu m according to different proportions of raw materials, and the obtained product has uniform particle size. Since no organic solvent is used and the raw materials and waste in the preparation process can be recovered and reutilized, the epoxy resin microsphere is green and environment-friendly. Meanwhile, the preparation method has the advantages of simple preparation technique, high yield, wide raw material sources and low cost, and is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to the preparation of a polymer material, in particular to an epoxy resin microsphere and a preparation method thereof. Background technique [0002] Epoxy resin microspheres are a new type of functional material with excellent performance. They have good solvent resistance, high mechanical strength, good thermal stability, low linear expansion rate and reactive groups such as -OH on the surface. Therefore, It has good application prospects in electronic information, high performance liquid chromatography, analysis and testing, bioengineering, intelligence and information industries. [0003] There are three main methods for preparing polymer microspheres: emulsion polymerization, dispersion polymerization and seed polymerization. The particle size of polymers prepared by emulsion polymerization is generally small (usually about 0.05-0.3 μm), while the particle size distribution of microspheres is wide and the monodispersity is p...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/50
Inventor 顾嫒娟张伟梁国正袁莉
Owner SUZHOU UNIV
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