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Low hygroscopicity anti-aging epoxy resin-based encapsulant and its preparation process

A technology of epoxy resin and preparation process, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of reduced light transmittance of packaging materials, easy emission of yellowing, and difficult packaging to corrode electrical insulation and other problems , to achieve the effect of good light transmittance

Active Publication Date: 2017-12-12
佛山市顺德区威豪科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy resin material itself has strong hygroscopicity, and it is difficult for packaging to resist external erosion for a long time and maintain good electrical insulation
In addition, since the chip in the LED component will continuously emit ultraviolet light, the packaging material is also prone to yellowing after long-term exposure to ultraviolet light, resulting in a decrease in the light transmittance of the packaging material, thereby reducing the luminous efficiency and luminous brightness of the LED. Therefore, it is particularly important to improve the hygroscopicity and aging resistance of epoxy resin-based packaging materials.

Method used

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  • Low hygroscopicity anti-aging epoxy resin-based encapsulant and its preparation process

Examples

Experimental program
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Effect test

Embodiment 1

[0019] A low-humidity anti-aging epoxy resin-based encapsulant, comprising the following raw materials in parts by weight: 56 parts of hydrogenated bisphenol A epoxy resin, 3 parts of nylon 610, 2 parts of poly-4-methyl-1-pentene, 1 part of hydroxy silicone oil, 2 parts of vinyl tert-carbonate, 1 part of zirconia, 1 part of magnesium oxide, 2 parts of 2-hydroxy-4-N-octyloxybenzophenone, 3 parts of maleic anhydride grafted polypropylene , 9 parts of diphenol diphenyl and 2 parts of dimethylimidazole.

[0020] The preparation process of the above-mentioned low-humidity anti-aging epoxy resin-based encapsulant comprises the following steps:

[0021] Weigh the raw materials of the above-mentioned parts by mass;

[0022] Heat and stir nylon 610, poly-4-methyl-1-pentene, vinyl tert-carbonate, zirconia, magnesium oxide, maleic anhydride grafted polypropylene, diphenol diphenyl and dimethylimidazole in the raw materials ;

[0023] Then add hydrogenated bisphenol A type epoxy resin,...

Embodiment 2

[0027] A low-humidity anti-aging epoxy resin-based encapsulant, comprising the following raw materials in parts by weight: 70 parts of hydrogenated bisphenol A epoxy resin, 6 parts of nylon 610, 5 parts of poly-4-methyl-1-pentene, 3 parts of hydroxyl silicone oil, 4 parts of vinyl tertiary carbonate, 2 parts of zirconia, 3 parts of magnesium oxide, 3 parts of 2-hydroxy-4-N-octyloxybenzophenone, 5 parts of maleic anhydride grafted polypropylene , 15 parts of m-phenylenediamine and 5 parts of dimethylimidazole.

[0028] The preparation process of the above-mentioned low-humidity anti-aging epoxy resin-based encapsulant comprises the following steps:

[0029] Weigh the raw materials of the above-mentioned parts by mass;

[0030] Heat and stir nylon 610, poly-4-methyl-1-pentene, vinyl tertiary carbonate, zirconia, magnesium oxide, maleic anhydride grafted polypropylene, m-phenylenediamine and dimethylimidazole in the raw materials ;

[0031] Then add hydrogenated bisphenol A ty...

Embodiment 3

[0035] A low-humidity anti-aging epoxy resin-based encapsulant, comprising the following raw materials in parts by weight: 85 parts of hydrogenated bisphenol A epoxy resin, 10 parts of nylon 610, 8 parts of poly-4-methyl-1-pentene, 5 parts of hydroxyl silicone oil, 6 parts of vinyl tertiary carbonate, 3 parts of zirconia, 4 parts of magnesium oxide, 5 parts of 2-hydroxy-4-N-octyloxybenzophenone, 8 parts of maleic anhydride grafted polypropylene , 20 parts of m-phenylenediamine and 8 parts of dimethylimidazole.

[0036] The preparation process of the above-mentioned low-humidity anti-aging epoxy resin-based encapsulant comprises the following steps:

[0037] Weigh the raw materials of the above-mentioned parts by mass;

[0038] Heat and stir nylon 610, poly-4-methyl-1-pentene, vinyl tertiary carbonate, zirconia, magnesium oxide, maleic anhydride grafted polypropylene, m-phenylenediamine and dimethylimidazole in the raw materials ;

[0039] Then add hydrogenated bisphenol A t...

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Abstract

The invention discloses a low-hygroscopic anti-aging epoxy resin-based encapsulant, which comprises the following raw materials in parts by weight: 56-85 parts of hydrogenated bisphenol A epoxy resin, 3-10 parts of nylon 610, poly-4-formaldehyde 2-8 parts of 1-pentene, 1-5 parts of hydroxy silicone oil, 2-6 parts of vinyl tertiary carbonic acid ester, 1-3 parts of zirconia, 1-4 parts of magnesium oxide, 2-hydroxy-4-N- 2~5 parts of octyloxybenzophenone, 3~8 parts of maleic anhydride grafted polypropylene, 9~20 parts of curing agent and 2~8 parts of curing accelerator. The invention also discloses a preparation process of the low-hygroscopic anti-aging epoxy resin-based encapsulation glue. The water absorption rate of the epoxy resin-based encapsulant prepared by the present invention is low, and the 1000h yellowing index is also low, showing good aging resistance, and at the same time, the prepared epoxy resin-based encapsulant also has good light transmittance , suitable for electronic packaging materials, especially for LED packaging materials.

Description

technical field [0001] The invention belongs to the field of packaging materials, and in particular relates to a low-hygroscopic anti-aging epoxy resin-based packaging glue and a preparation process thereof. Background technique [0002] Packaging material is one of the important components of LED components. Its main function is to seal and protect the chip, to prevent the chip from being affected by the temperature and humidity in the surrounding environment, and to prevent the chip from being affected by external mechanical vibration and impact. destroy. The packaging materials used today include transparent materials such as epoxy resin, polycarbonate, glass, and silicone. Among them, epoxy resin has become one of the main packaging materials due to its good connectivity, sealing, electrical insulation, low production cost, and easy processing and molding. However, the epoxy resin material itself has strong hygroscopicity, and it is difficult for packaging to resist ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J177/02C09J123/20C09J183/06C09J151/06C09J11/04C09J11/06H01L33/56
Inventor 翁宇飞李力南
Owner 佛山市顺德区威豪科技发展有限公司