One-dimensional diamond reinforced aluminum matrix composite material and preparing method thereof

Abstract

The invention discloses a one-dimensional-diamond-reinforced aluminum matrix composite material and a preparing method. The composite material is characterized in that a diamond array composed of a plurality of one-dimensional diamond wires is distributed in an aluminum matrix, and the one-dimensional diamond wires are surface-modified diamond wires and are combined with the aluminum matrix in a metallurgical manner. The preparing method of the composite material includes the steps that after the surface-modified diamond wires are distributed in an array manner, the aluminum matrix or the aluminum matrix containing surface-modified diamond particles is compounded with the diamond wire array through one of a casting technology, an infiltration technology, a cold pressing sintering technology, a hot pressing sintering technology and a plasma sintering technology, and the one-dimensional-diamond-reinforced aluminum matrix composite material in which the one-dimensional diamond wires are combined with the aluminum matrix in the metallurgical manner is obtained. According to the one-dimensional-diamond-reinforced aluminum matrix composite material and the preparing method, the one-dimensional diamond wires are distributed in the aluminum matrix in the array manner, a series-parallel connection composite heat conduction structure is formed by adding the diamond particles, the heat conducting efficiency is further improved, the composite material can be used as an electronic packaging material, a heat sink material and the like, and packaging of high-temperature, high-frequency and high-power electronic devices is achieved.

Description

technical field [0001] The invention relates to a diamond composite material, in particular to a one-dimensional diamond-reinforced aluminum-based composite material, and also relates to a preparation method of the one-dimensional diamond-reinforced aluminum-based composite material. Background technique [0002] Electronic packaging is an operation process that rationally arranges, assembles, bonds, connects, and isolates the various components that constitute electronic devices or integrated circuits according to the specified requirements. It requires packaging materials to have high thermal conductivity and low thermal expansion coefficient. Good mechanical support, physical protection, electrical connection, heat dissipation and moisture resistance, external field shielding, size transition, and stable component parameters. With the rapid development of electronic information technology, electronic instruments are rapidly developing in the direction of high performance,...

AI Technical Summary

Problems solved by technology

As far as diamond / aluminum composite materials are concerned, Johnson et al. in the United States successfully obtained diamond / aluminum composite materials by using the pressureless infiltration diamond particle skeleton, and the thermal conductivity of the prepared composite material is 259W / (m K); Natishan et al. The metallurgical method is applied to the preparation of diamond / aluminum composite materials, hoping to optimize the composite materials, but the effect is not obvious

In 2004, O. Beffort and others used the traditional pressure infiltration method to prepare diamond particle reinforced aluminum matrix composites, but the thermal conductivity of the composites was only 130W / (m K)

As for the diamond / copper composite material, in 1995, Sun Microsystems of the United States and Lawrence Livermore National Laboratory jointly developed a diamond particle / copper composite material, which is used as a substrate for a multi-chip module, with a thermal conductivity of 420W / (m K) , the CTE at 25~200℃ is (5.48~6.5)×10 -6 K -1 , which matches the CTE of GaAs, but the preparation process is relatively complicated and the cost is high

[0005] Theoretically, the thermal conductivity of the diamond / metal matrix composite should be between the diamond and the metal matrix, which will greatly improve the thermal conductivity of the composite; but in practice, the thermal conductivity of diamond / aluminum is often less than 300W / (m· K), while the thermal conductivity of diamond / copper composites is often less than 400W / (m K)

The copper-based diamond composite material prepared by this method has good directional thermal conductivity, but due to the extremely poor wettability between the diamond rod and the base metal, the two-phase interface is not tightly combined, and the interface between the diamond rod and the base metal A large thermal resistance is formed at the place, and its thermal conductivity needs to be further optimized

Images