One-dimensional diamond reinforced aluminum matrix composite material and preparing method thereof

An aluminum-matrix composite material and diamond-reinforced technology, which is applied to the one-dimensional diamond-reinforced aluminum-matrix composite material. Combination of problems such as looseness and complex preparation process achieves the effects of corrosion-resistant machining, good directional thermal conductivity, and high thermal conductivity

Active Publication Date: 2016-01-13
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As far as diamond/aluminum composite materials are concerned, Johnson et al. in the United States successfully obtained diamond/aluminum composite materials by using the pressureless infiltration diamond particle skeleton, and the thermal conductivity of the prepared composite material is 259W/(m K); Natishan et al. The metallurgical method is applied to the preparation of diamond/aluminum composite materials, hoping to optimize the composite materials, but the effect is not obvious
In 2004, O. Beffort and others used the traditional pressure infiltration method to prepare diamond particle reinforced aluminum matrix composites, but the thermal conductivity of the composites was only 130W/(m K)
As for the diamond/copper composite material, in 1995, Sun Microsystems of the United States and Lawrence Livermore National Laboratory jointly developed a diamond particle/copper composite material, which is used as a substrate for a multi-chip module, with a thermal conductivi

Method used

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  • One-dimensional diamond reinforced aluminum matrix composite material and preparing method thereof
  • One-dimensional diamond reinforced aluminum matrix composite material and preparing method thereof
  • One-dimensional diamond reinforced aluminum matrix composite material and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0054] Example one:

[0055] Tungsten wires with diameters of 0.03mm and 0.4mm are selected as the core material respectively. First, perform pre-treatment on the surface of the core material according to step (1); then use hot wire CVD to deposit diamond film according to step (2). The deposition process parameters: hot wire The distance is 6mm, the substrate temperature is 800°C, the hot wire temperature is 2200°C, the deposition pressure is 3KPa, the deposition time is 40 hours, and the CH4 / H2 volume flow ratio is 1:99. The diamond film thickness is 60μm, and the core diamond wire is obtained; (3) Use magnetron sputtering method to sputter a metal tungsten film on the surface of cored diamond wire. Sputtering power is 150W, pressure is 0.4Pa, substrate temperature is 400℃, argon flow is 20sccm, and W film thickness is 0.2μm; Spray a layer of metallic copper film, with a sputtering power of 100W, a pressure of 0.5Pa, a substrate temperature of 300℃, an argon flow rate of 20sccm...

Example Embodiment

[0056] Embodiment two:

[0057] Choose 0.3μm copper wire and 0.3μm titanium wire as the core material respectively. First, perform the pretreatment on the surface of the core material according to step (1); then use hot wire CVD to deposit the diamond film according to step (2). The deposition process parameters: thermal The wire distance is 6mm, the substrate temperature is 850°C, the hot wire temperature is 2200°C, the deposition pressure is 3KPa, the deposition time is 50 hours, the CH4 / H2 volume flow ratio is 1:99, and the diamond film thickness is 100μm, and the core diamond wire is obtained; (3) A metal chromium film is deposited on the surface of the cored diamond wire by vacuum evaporation. The evaporation current is 36A, the pressure is 0.1Pa, the substrate temperature is 400℃, and the chromium film thickness is 0.5μm. Then a layer of metal copper film is vacuum evaporated, and the evaporation current is 30A. , The pressure is 0.1Pa, the substrate temperature is 300°C, a...

Example Embodiment

[0058] Embodiment three:

[0059] Choose a thin molybdenum wire with a diameter of 0.1mm and a thick molybdenum wire of 0.8mm as the core material. First, perform the pretreatment on the surface of the core material according to step (1); then use hot wire CVD to deposit the diamond film according to step (2). The deposition process parameters :Hot wire distance 8mm, substrate temperature 900°C, hot wire temperature 2200°C, deposition pressure 3KPa, deposition time 50 hours, CH4 / H2 volume flow ratio 2:98, get diamond film thickness 100μm, then get core diamond wire; (3) Use magnetron sputtering method to sputter a layer of metallic titanium film on the surface of cored diamond wire, sputtering power is 92W, pressure is 0.5Pa, substrate temperature is 300℃, argon flow is 20sccm, and film thickness is 500nm; 4) Arrange the Ti-plated core diamond wire uniformly in the mold in an orientation with a distance of 3mm to obtain a one-dimensional diamond array skeleton; (5) Fill the gap o...

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Abstract

The invention discloses a one-dimensional-diamond-reinforced aluminum matrix composite material and a preparing method. The composite material is characterized in that a diamond array composed of a plurality of one-dimensional diamond wires is distributed in an aluminum matrix, and the one-dimensional diamond wires are surface-modified diamond wires and are combined with the aluminum matrix in a metallurgical manner. The preparing method of the composite material includes the steps that after the surface-modified diamond wires are distributed in an array manner, the aluminum matrix or the aluminum matrix containing surface-modified diamond particles is compounded with the diamond wire array through one of a casting technology, an infiltration technology, a cold pressing sintering technology, a hot pressing sintering technology and a plasma sintering technology, and the one-dimensional-diamond-reinforced aluminum matrix composite material in which the one-dimensional diamond wires are combined with the aluminum matrix in the metallurgical manner is obtained. According to the one-dimensional-diamond-reinforced aluminum matrix composite material and the preparing method, the one-dimensional diamond wires are distributed in the aluminum matrix in the array manner, a series-parallel connection composite heat conduction structure is formed by adding the diamond particles, the heat conducting efficiency is further improved, the composite material can be used as an electronic packaging material, a heat sink material and the like, and packaging of high-temperature, high-frequency and high-power electronic devices is achieved.

Description

technical field [0001] The invention relates to a diamond composite material, in particular to a one-dimensional diamond-reinforced aluminum-based composite material, and also relates to a preparation method of the one-dimensional diamond-reinforced aluminum-based composite material. Background technique [0002] Electronic packaging is an operation process that rationally arranges, assembles, bonds, connects, and isolates the various components that constitute electronic devices or integrated circuits according to the specified requirements. It requires packaging materials to have high thermal conductivity and low thermal expansion coefficient. Good mechanical support, physical protection, electrical connection, heat dissipation and moisture resistance, external field shielding, size transition, and stable component parameters. With the rapid development of electronic information technology, electronic instruments are rapidly developing in the direction of high performance,...

Claims

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Application Information

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IPC IPC(8): C22C47/08C22C49/06C22C49/14C22C121/02
Inventor 马莉周科朝魏秋平余志明李志友
Owner CENT SOUTH UNIV
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