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Heat convertible resin, heat convertible resin composition with heat convertible resin, cured material, prepreg, laminated board and printed circuit board

A technology of thermosetting and resin, which is applied in the field of thermosetting resin composition and thermosetting resin, can solve the problems of low dielectric constant, poor flame retardancy and high cost of epoxy resin, and achieve excellent heat resistance, good electrical characteristics and improved brittleness Effect

Active Publication Date: 2016-02-24
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many deficiencies in these thermosetting resins: as phenolic resins will produce volatile by-products in the curing reaction, the flame retardancy of epoxy resins is poor, and the cost of bismaleimide resins is higher.
For example, for the resin material of the multilayer substrate of the IC package (ICpackage) such as the memory or the theoretical processor, the required dielectric constant of 100MHz and 1GHz at an ambient temperature of 23°C is less than 3.5, and the dielectric constant under the same conditions If the electrical loss factor is less than 0.015, it is difficult for existing benzoxazine resins to satisfy
[0007] CN102584884A discloses a silicon-containing benzoxazine resin, which has low dielectric constant, high heat resistance, and due to the introduction of a large number of flexible units in the molecular chain, this type of material has good toughness, but this silicon-containing The synthesis method of benzoxazine resin is complicated, and the cost is high, and it is difficult to obtain industrial application
However, due to the presence of free OH groups in this benzoxazine product, it is not very ideal in terms of hygroscopicity and electrical properties.

Method used

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  • Heat convertible resin, heat convertible resin composition with heat convertible resin, cured material, prepreg, laminated board and printed circuit board
  • Heat convertible resin, heat convertible resin composition with heat convertible resin, cured material, prepreg, laminated board and printed circuit board
  • Heat convertible resin, heat convertible resin composition with heat convertible resin, cured material, prepreg, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] (1) Preparation of benzoxazine resin

[0067] 26.21 g of the mixture of multifunctional phenolic compounds represented by formula (I) and (II) represented by formula (I) and (II) in input mass ratio in chloroform is totally 26.21 g, and mass ratio is represented by formula (a) and (b) of 1 / 1 30.13 g of a mixture of diamine compounds and 8.05 g (0.25 mol) of paraformaldehyde (manufactured by Wako Pure Chemical Industries, Ltd., 94%) were reacted under reflux for 6 hours while removing generated moisture. Put the reacted solution into a large amount of methanol to precipitate the product. The product was then isolated by filtration and washed with methanol. The washed product was dried under reduced pressure to obtain 50.78 g of a thermosetting resin mainly composed of a benzoxazine compound having the following structure. Its molecular weight measured by GPC is 20500.

[0068] (2) Preparation of cured product

[0069] The polymer obtained in step (1) was kept at 220°...

Embodiment 2

[0071] (1) Preparation of benzoxazine resin

[0072]21.5 g of the mixture of polyfunctional phenolic compounds represented by formulas (I) and (II) represented by formula (I) and (II) are dropped in chloroform, and mass ratio is 2 / 1 represented by formulas (a) and (b) 66.68 g of a mixture of diamine compounds and 7.36 g (0.22 mol) of paraformaldehyde (manufactured by Wako Pure Chemical Industries, Ltd., 94%) were reacted under reflux for 6 hours while removing generated moisture. Put the reacted solution into a large amount of methanol to precipitate the product. The product was then isolated by filtration and washed with methanol. The washed product was dried under reduced pressure to obtain 91.10 g of a thermosetting resin mainly composed of a benzoxazine compound having the following structure. Its molecular weight measured by GPC is 16600.

[0073] (2) Preparation of cured product

[0074] The polymer obtained in step (1) was kept at 220° C. for 3 hours by hot pressing...

Embodiment 3

[0076] (1) Preparation of benzoxazine resin

[0077] 16.12 g of the mixture of multifunctional phenolic compounds represented by formula (I) and (II) in chloroform, 49.77 g of diamine compounds represented by formula (a), paraformaldehyde (manufactured by Wako Pure Chemical Industries, 94%) 10.64 g (0.32 mol), and reacted under reflux for 6 hours while removing the generated moisture. Put the reacted solution into a large amount of methanol to precipitate the product. The product was then isolated by filtration and washed with methanol. The washed product was dried under reduced pressure to obtain 62.32 g of a thermosetting resin mainly composed of a benzoxazine compound having the following structure. Its molecular weight measured by GPC is 17800.

[0078] (2) Preparation of cured product

[0079] The polymer obtained in step (1) was kept at 220° C. for 3 hours by hot pressing method to obtain a sheet-shaped cured product with a thickness of 0.5 mm. The obtained cured bo...

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Abstract

The invention provides heat convertible resin of a dihydro-benzoxazine ring structure, a heat convertible resin composition with the heat convertible resin, a cured material, prepreg, a laminated board and a printed circuit board. The heat convertible resin of the dihydro-benzoxazine ring structure is mainly prepared from multifunctional phenol compounds shown by the general formula (I) and / or the general formula (II) and diamines compounds and aldehyde compounds (c) shown by the general formula (a) and / or the general formula (b) in a reaction mode. The heat convertible resin of the dihydro-benzoxazine ring structure is compounded through two different multifunctional phenol compounds and diamines compounds, the advantages of the two kinds of monomers are effectively combined, the disadvantages of the two kinds of monomers are overcome, and the obtained benzoxazine resin has the excellent combination performances of low dielectric performance and water-absorbing performance, high heat resistance and tenacity and the like.

Description

technical field [0001] The present invention relates to a thermosetting resin, a thermosetting resin composition containing it, a cured product, a prepreg, a laminate and a printed circuit board. Background technique [0002] The rapid development of electronic information technology and consumer electronics has put forward new requirements for multi-functional integrated circuits - reducing their feature size and higher integration. This demand must have stricter requirements for electronic packaging materials: Such as the development of raw material resins with lower dielectric constant and low dielectric loss. [0003] Thermosetting resins such as epoxy resins, phenolic resins, bismaleimide resins, and unsaturated polyester resins have a series of advantages such as excellent water resistance, chemical resistance, heat resistance, and mechanical strength, so they are widely used in electronic materials. has been widely applied. However, these thermosetting resins have m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/06C08L79/04C08J5/24B32B27/28H05K1/02
CPCB32B27/28C08J5/24C08G73/06C08L79/04H05K1/02
Inventor 周应先何岳山许永静
Owner GUANGDONG SHENGYI SCI TECH