Core shell structure powder and method for preparing polymer-based dielectric composite material thereof

Abstract

The invention discloses core shell structure powder and a method for preparing a polymer-based dielectric composite material thereof and belongs to the technical field of composite materials. Silicon carbide undergoes thermal oxidation treatment to generate SiC@SiO2 core shell structure powder coated with a silicon dioxide shell layer, the SiC@SiO2 core shell structure powder is added into PVDF resin diluent, a solvent is heated and evaporated to dryness, and the polymer-based dielectric composite material of the SiC@SiO2 core shell structure powder is obtained. The composite material is low in dielectric loss, leakage conductance caused by mutual contact of semiconductor functional phases is effectively avoided, and the core shell structure powder has high dielectric constant and mechanical strength and toughness. The preparation method is low in cost and simple to operate.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a silicon carbide@silicon dioxide (SiC@SiO 2 ) The preparation method of the core-shell structure powder and the polymer-based dielectric composite material thereof. Background technique [0002] In recent years, polymer-based dielectric composites have attracted extensive attention due to their high dielectric constant, low dielectric loss and excellent mechanical properties. High dielectric constant polymer-based composites combine the advantages of traditional dielectric materials and polymers, and have the characteristics of low cost, easy processing, light weight and excellent mechanical properties, which have attracted widespread attention and research in the world. High dielectric constant polymer-based composite materials have been widely used in the preparation of embedded multilayer film capacitors and high energy storage capacitors; application. [0003]...

AI Technical Summary

Problems solved by technology

The dielectric properties of the conductor functional phase / polymer composite with high dielectric constant are very sensitive to its influencing factors (especially the relevant parameters of the conductor). For example, a slight change in the amount of functional phase near the percolation threshold will cause the conductivity The rapid change of the high dielectric constant conductor functional phase / polymer composite material has brought great difficulties and challenges to the production control and stability of material properties.

[0006] In addition, when the dielectric constant of the conductive functional phase / polymer composite reaches the highest value near the percolation threshold of the conductive filler, the dielectric loss is particularly large, which reduces the breakdown voltage and performance of the conductive functional phase / polymer composite

[0007] 2) When the volume fraction of the ferroelectric ceramic functional phase is ≥ 40%, the ferroelectric ceramic functional phase / polymer composite can obtain a high dielectric constant, which seriously reduces the mechanical strength and toughness of the ferroelectric ceramic functional phase / polymer composite , increasing the dielectric loss

[0008] Due to the decrease of tensile strength, impact toughness and increase of dielectric loss, polymer matrix composites are difficult for practical engineering applications

Polymer-based dielectric composites with stable dielectric constant and low dielectric loss cannot be obtained solely by metal and carbon nanoconductor particles or ferroelectric particles

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