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Ultrathin CCL (copper clad laminate) and production method thereof

A production method and technology of copper clad laminates, applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve the problems of warpage appearance, slight unevenness and unevenness of tension, and achieve good comprehensive performance, Effect of improving heat resistance and solving warpage

Inactive Publication Date: 2016-03-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When glass fiber cloth is applied to printed circuit boards, the existing process is to glue and cure the glass fiber cloth to form a bonding sheet, which can be made into a copper clad laminate by covering the bonding sheet with copper foil; process, after sizing and weaving the glass filaments, the glass fiber cloth obtained by desizing and sintering the glass fiber cloth blank, especially the thin glass fiber cloth, has the following defects when it is applied to the printed circuit board: the glass fiber cloth is due to Its own weaving structure, when gluing, the glass fiber in it is easy to suffer from the slight unevenness of the tension, resulting in weft skew phenomenon after gluing the glass fiber cloth, which makes the dimensional stability of the glass fiber cloth after gluing poor. , serious warping and uneven appearance, the above defects have brought great difficulties to the production of thin PCB and ultra-fine circuit PCB; and when glass fiber cloth is used to prepare copper clad laminates, in order to improve the ion migration resistance (CAF) of copper clad laminates Performance requires sufficient resin glue filling, which increases the difficulty of preparing ultra-thin PCB and ultra-fine line PCB

Method used

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  • Ultrathin CCL (copper clad laminate) and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] An ultra-thin copper clad laminate with high dielectric constant, and its manufacturing method includes the following steps:

[0048] First, prepare resin glue and copper foil. The resin glue includes 100 parts by weight of epoxy resin, 10 parts of cross-linking curing agent, 2 parts of cross-linking curing accelerator, 50 parts of barium titanate filler and appropriate amount of solvent. ; The copper foil is a 9μm electrolytic copper foil;

[0049] Then make the styling cloth and the resin-coated copper foil: the styling cloth is made by the first method mentioned above; the resin glue is coated on the rough surface of the copper foil, dried and then semi-cured to obtain the copper-coated resin , The thickness of the resin layer is controlled within the range of 10~70μm;

[0050] Pressing and curing: the copper-coated resin and the styling cloth are pressed together at a temperature of 80-160℃ by lamination, and then cured. The laminating curing pressure is 300-500PSI, and t...

Embodiment 2

[0052] An ultra-thin copper clad laminate with high dielectric constant, and its manufacturing method includes the following steps:

[0053] First, prepare resin glue and copper foil. The resin glue includes 80 parts by weight of epoxy resin, 15 parts of cross-linking curing agent, 60 parts of barium strontium titanate and appropriate amount of solvent; copper foil is 12μm rolled copper Foil

[0054] Then make the styling cloth and resin-coated copper foil: the styling cloth is made by the second method mentioned above; the resin glue is coated on the rough surface of the copper foil, dried and semi-cured to obtain the copper-coated resin , The thickness of the resin layer is controlled within the range of 10~68μm;

[0055] Pressing and curing: The copper-coated resin and the styling cloth are rolled together at a temperature of 80-160℃ and cured by a roller pressing method. The curing pressure of the roller pressing is 29-290PSI. After the roller pressing, the baking and curing tim...

Embodiment 3

[0057] An ultra-thin copper clad laminate with high dielectric constant, and its manufacturing method includes the following steps:

[0058] First, prepare resin glue and copper foil. The resin glue includes 50 parts by weight of epoxy resin, 10 parts of cross-linking curing agent, 1 part of cross-linking curing accelerator, 70 parts of titanium dioxide and ceramics, and an appropriate amount of solvent; The copper foil is 12μm rolled copper foil;

[0059] Then make the styling cloth and resin-coated copper foil: the styling cloth is made by the second method mentioned above; the resin glue is coated on the rough surface of the copper foil, dried and semi-cured to obtain the copper-coated resin , The thickness of the resin layer is controlled within the range of 10~68μm;

[0060] Pressing and curing: Laminate the copper-coated resin and the styling cloth together at a temperature of 80-160℃ and then be cured. The laminating curing pressure is 300-500PSI, and the laminating curing te...

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Abstract

The invention relates to the technical field of CCLs (copper clad laminates) and particularly relates to an ultrathin CCL with high dielectric constant. The ultrathin CCL comprises a copper foil, a piece of setting cloth and an insulating layer which is arranged between the copper foil and the setting cloth and formed by curing resin glue liquid, wherein the resin glue liquid comprises the following components in parts by weight: 50-100 parts of epoxy resin, 1-35 parts of a cross-linking curing agent, 0-5 parts of a cross-linking curing accelerator and 50-100 parts of filler with high dielectric constant; and the filler with high dielectric constant refers to one or more of titanium dioxide, ceramic, barium titanate, lead titanate andbarium strontium titanate. According to the invention, on one hand, by adopting the setting cloth as a reinforcing material, the defects such as warping and instable size frequently occurring in an ultrathin CCL are solved; and on the other hand, by combining the setting cloth with the resin glue liquid with high dielectric constant, the produced ultrathin CCL has good comprehensive performance, and particularly the dielectric performance of CCL is improved; and the invention also relates to a production method of the ultrathin CCL.

Description

Technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to an ultra-thin copper clad laminate with high dielectric constant and a manufacturing method thereof. Background technique [0002] Glass fiber (glassfiber or fiberglass), also known as glass fiber, is a kind of inorganic non-metallic material with excellent performance. The composition is silica, alumina, calcium oxide, boron oxide, magnesium oxide, sodium oxide, etc. It uses glass balls or waste glass as raw materials to produce glass fiber cloth through high-temperature melting, drawing, winding, weaving and other processes, and finally form various products. Among them, the diameter of glass fiber monofilament ranges from a few microns to Twenty-odd microns, which is equivalent to 1 / 20 to 1 / 5 of a hair strand, and each bundle of fiber strands consists of hundreds or even thousands of monofilaments. Fiberglass cloth is generally used as a reinforcing material, electri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/04B32B27/04B32B17/06B32B15/14B32B15/20B32B38/08B32B38/00B32B37/24B32B37/10B32B37/06
CPCB32B17/04B32B15/14B32B15/20B32B17/061B32B37/06B32B37/10B32B37/24B32B38/00B32B38/08B32B2037/243B32B2038/0076B32B2260/021B32B2260/046B32B2262/101
Inventor 胡启彬伍宏奎茹敬宏刘东亮王克峰
Owner GUANGDONG SHENGYI SCI TECH