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Preparation method of fluorescent transparent ceramic disk for LED (Light-emitting Diode)

A technology of transparent ceramics and ceramic flakes, which is applied in the direction of circuits, semiconductor devices, electrical components, etc., to achieve the effects of high sample quality, simple process, and controllable thickness

Inactive Publication Date: 2016-04-20
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, there is no report on the preparation of fluorescent transparent ceramic sheets for LEDs directly by gel injection molding.

Method used

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  • Preparation method of fluorescent transparent ceramic disk for LED (Light-emitting Diode)
  • Preparation method of fluorescent transparent ceramic disk for LED (Light-emitting Diode)
  • Preparation method of fluorescent transparent ceramic disk for LED (Light-emitting Diode)

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preparation example Construction

[0046] In the preparation method of the present invention, the ceramic flake green body is subjected to a firing process and annealing treatment to obtain the fluorescent transparent ceramic flake. Specifically, firing can be divided into two steps, pre-firing and vacuum sintering. The technical parameters of the pre-burning include heating at a rate of 1-5° C. / minute to 600-1200° C. and keeping the temperature for 2-12 hours. The process parameters of the vacuum sintering include a heating rate of 1-5° C. / min, heating up to 1700-1900° C., and holding the temperature for 3-24 hours. The technological parameters of the annealing treatment include a heating rate of 1-5° C. / min, heating up to 1300-1600° C., and holding the temperature for 3-48 hours.

[0047] The present invention adopts one-time molding gel injection molding technology and a two-layer board combined mold to prepare a fluorescent transparent ceramic sheet for LED with controllable thickness. More specifically, ...

Embodiment 1

[0053] Weigh commercially available 65.54g high-purity Y 2 o 3 Powder, 3.44g high-purity CeO 2 Powder, 51gAl 2 o 3Put the powder and 0.15g sintering aid tetraethyl orthosilicate into a ball mill tank, add 50g deionized water and 1g dispersant ammonium polyacrylate, mix and ball mill for 1 hour to obtain a uniformly dispersed slurry, and then add 2.5g water-soluble ring Oxygen resin sorbitol glycidyl ether and 2.5 g of curing agent dipropylene triamine were ball milled for 0.5 hour and 1 hour respectively to obtain a water-based slurry with good fluidity and low viscosity. Inject the water-based slurry into the combination mold. The material of the two-layer mold is glass, and the thickness of the gasket is 0.5mm. Let it stand at room temperature and air environment, and fully solidify in situ for 3 hours to obtain a ceramic green body; the green body after demoulding The body was dried in an oven at 60°C for 12 hours, and then moved to an oven at 110°C for 12 hours to form...

Embodiment 2

[0056] Weigh commercially available 65.54g high-purity Y 2 o 3 Powder, 3.44g high-purity CeO 2 Powder, 51gAl 2 o 3 Put the powder and 0.15g sintering aid tetraethyl orthosilicate into a ball mill tank, add 50g deionized water and 1g dispersant sodium polyacrylate and mix ball mill for 1 hour to obtain a uniformly dispersed slurry, then add 2.5g water-soluble ring Oxygen resin sorbitol glycidyl ether and 2.5 g of curing agent dipropylene triamine were ball milled for 0.5 hour and 1 hour respectively to obtain a water-based slurry with good fluidity and low viscosity. Inject the water-based slurry into the combined mold. The material of the two-layer mold is glass, and the thickness of the gasket is 1.5mm. Let it stand at room temperature and air, and fully solidify in situ for 3 hours to obtain a ceramic body; the blank after demoulding The body was dried in an oven at 60°C for 24 hours, and then moved to an oven at 110°C for 24 hours to form a complete dry and uniform gree...

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Abstract

The invention relates to a preparation method of a fluorescent transparent ceramic disk for an LED (Light-emitting Diode). The preparation method comprises the following steps of adding rare-earth-doped yttrium aluminium garnet (RE:YAG) raw material powder with the mass ratio to water being 2:1 to 5:1, sintering aids and a dispersant into deionized water; mixing and performing ball milling for 0.5 to 4 hours to obtain homogeneously dispersed aqueous slurry; respectively adding water-solubility epoxy resin and a curing agent, and respectively performing ball milling for 1 to 4 hours and 0.1 to 1 hour; injecting the aqueous slurry into an assembling die formed by clamping a filler strip clamped in the middle of a two-layerbetween two layers of plates, forming to obtain a ceramic disk biscuit, and obtaining the fluorescent transparent ceramic disk through sintering procedure and annealing treatment. The ceramic disk prepared by the invention is controllable in size and thickness, high in sample quality, simple in process, high in preparation efficiency, and low in cost, and the preparation way of the RE:YAG transparent ceramic disk for the LED is greatly expanded.

Description

technical field [0001] The invention relates to a method for preparing fluorescent transparent ceramic sheets for LEDs, which adopts a simple one-time molding gel injection molding technology and a two-layer board combined mold to prepare fluorescent transparent ceramic sheets for LEDs with controllable thickness, which belongs to the preparation technology of LED fluorescent transparent materials field. Background technique [0002] White light LED, as a novel semiconductor light source, has significant advantages such as high efficiency, low power consumption, long life, solid-state energy saving, and green environmental protection. It is widely used in LCD backlight, traffic signal lights, urban lighting, square lighting, etc. Has huge market potential. [0003] The mainstream technology of traditional white LED is phosphor conversion, that is, after mixing phosphor with potting glue, it is applied on the blue LED chip by coating or dispensing. The thickness of the layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/505C04B35/50C04B35/44C04B35/622H01L33/50
CPCC04B35/44C04B35/50C04B35/622C04B2235/6022C04B2235/662H01L33/502
Inventor 孙怡覃显鹏周国红张海龙田润彭翔王士维
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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