Halogen-free and non-phosphorus flame-retardant epoxy resin composition and preparation method thereof

Abstract

The invention discloses a halogen-free and non-phosphorus flame-retardant epoxy resin composition and its preparation method. According to the preparation method, 10-15 parts by weight of polyphenol borate, 20-50 parts by weight of bisphenol-S epoxy resin, 0.5-15 parts by weight of a-methacrylic acid deactivated imidazole and 0.5-10 parts by weight of gamma-glycidoxypropyltrimethoxysilane are dissolved in acetone or an anhydrous ethanol solvent, and after the solution become transparent, the halogen-free and non-phosphorus flame-retardant epoxy resin composition is prepared. The product has good insulativity, flame resistance, heat resistance, wet fastness and good drilling performance, and is green and environmentally friendly.

Description

technical field [0001] The invention relates to an environment-friendly flame-retardant material, in particular to an ingredient that can be used to manufacture printed circuit board substrates. Background technique [0002] Traditional flame-retardant printed circuit board (PCB) substrates use halogen-based flame retardants. When such halogen-containing compounds are incompletely burned, they will produce dioxin substances that are extremely harmful to the human body and the environment. Many countries in the world have Substrate regulations that restrict or ban halogen-containing flame retardants have been formulated and promulgated. Therefore, halogen-free substrates have become a hot spot in the development of the PCB field. The currently used halogen-free flame-retardant PCB base material is added with phosphorus-containing compounds. Although it can be well flame-retardant, it has the problems of low heat resistance, low moisture resistance, and poor interlayer adhesio...

AI Technical Summary

Problems solved by technology

Although flame retardancy is improved, heat resistance and moisture resistance are insufficient

Japanese Patent Laid-Open No. 11-60689 proposes a technical route of reacting epoxy resin with phenyl phosphate compound, but the improvement of moisture resistance is not obvious

Benzoxazine was used to prepare halogen-free and phosphorus-free flame-retardant PCB boards in the 4th base PP14-15 of the "Copper Clad Laminate Information" magazine published in 2005. Although it has a high carbon formation rate, it has certain flame retardancy and mechanical properties. , but the flame retardancy cannot meet the requirements of UL94-V0 level

This kind of high thermal conductivity, halogen-free and phosphorus-free flame retardant resin does not have phosphorus-containing flame retardants, so it will not cause environmental pollution problems due to hydrolysis. The disadvantage is that inorganic powder and metal powder reduce the insulation and drilling performance of PCB boards.

Chinese patent application 200410039268 (publication date is 20050817) uses a halogen-free, phosphorus-free and high-nitrogen content polycyclic compound as a flame retardant. Oxygen resin undergoes a chemical bond reaction to form a reactive flame-retardant semi-cured epoxy resin, and then this flame-retardant semi-cured epoxy resin is added to the epoxy resin with inorganic additives to prepare an environmentally friendly halogen-free product that can be used for PCB or semiconductor packaging. Phosphorus-free flame retardant epoxy resin composition, the disadvantage is that inorganic additives bring poor moisture resistance of PCB

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