Ultraviolet-moisture double-curing modified silicone adhesive and preparation method thereof

A technology of silicone adhesive and ultraviolet light, applied in adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problem that polysiloxane cannot be used directly, achieve good high and low temperature resistance, improve Physical and chemical properties, energy saving effect

Active Publication Date: 2018-09-28
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polysiloxanes with traditional structures cannot be directly used in UV curing systems

Method used

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  • Ultraviolet-moisture double-curing modified silicone adhesive and preparation method thereof
  • Ultraviolet-moisture double-curing modified silicone adhesive and preparation method thereof
  • Ultraviolet-moisture double-curing modified silicone adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] In this embodiment, a method for preparing a UV-moisture dual-curing modified silicone adhesive comprises the following steps:

[0044] (1) Preparation of modified polysiloxane:

[0045] At 80°C, while stirring, 15.0 g of acrylic acid and 15.0 g of acrylic acid and A mixed solution composed of 0.75g triethylamine; after the dropwise addition, the temperature was raised to 100°C, and after 4 hours of heat preservation reaction, the unreacted acrylic acid was distilled off under reduced pressure; the temperature was readjusted to 75°C, and 10.0g was added dropwise while stirring 3-isocyanatopropyltrimethoxysilane, heat preservation reaction for 3 hours, cooling to obtain modified polysiloxane. The above reactions were all carried out in a nitrogen atmosphere.

[0046] Prepare the structural formula of modified polysiloxane as follows:

[0047]

[0048] Wherein, n=400~500, n is an integer; the viscosity of the product is about 1600mPa·S.

[0049] (2) Preparation of si...

Embodiment 2

[0052] In this embodiment, a method for preparing a UV-moisture dual-curing modified silicone adhesive comprises the following steps:

[0053] (1) Preparation of modified polysiloxane:

[0054] At 80°C, while stirring, 15.0 g of acrylic acid and 15.0 g of acrylic acid and A mixed solution composed of 0.75g triethylamine; after the dropwise addition, the temperature was raised to 100°C, and after 4 hours of heat preservation reaction, the unreacted acrylic acid was distilled off under reduced pressure; the temperature was readjusted to 75°C, and 10.0g was added dropwise while stirring 3-isocyanatopropyl triethoxysilane, heat preservation reaction for 3 hours, cooling to obtain modified polysiloxane. The above reactions were all carried out in a nitrogen atmosphere.

[0055] Prepare the structural formula of modified polysiloxane as follows:

[0056]

[0057] Wherein, n=650~700, n is an integer; the viscosity of the product is about 5000mPa·S.

[0058] (2) Preparation of ...

Embodiment 3

[0061] In this embodiment, a method for preparing a UV-moisture dual-curing modified silicone adhesive comprises the following steps:

[0062] (1) Preparation of modified polysiloxane:

[0063] At 80°C, while stirring, add 15.0 g of methacrylic acid dropwise to a reactor containing 1000 g of diepoxy-terminated polydimethylsiloxane with a viscosity of 10 Pa·S and 4.0 g of hydroquinone and 0.75g triethylamine; after the dropwise addition, the temperature was raised to 100°C, and after the heat preservation reaction for 4 hours, the unreacted acrylic acid was distilled off under reduced pressure; the temperature was readjusted to 75°C, and 10.0 g 3-isocyanatopropyltriethoxysilane, heat preservation reaction for 3 hours, and cool to obtain modified polysiloxane. The above reactions were all carried out in a nitrogen atmosphere.

[0064] Prepare the structural formula of modified polysiloxane as follows:

[0065]

[0066] Wherein, n=800~900, n is an integer; the viscosity of ...

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Abstract

The invention discloses an ultraviolet-moisture dual-cured modified organosilicon adhesive and a preparation method therefor. The organosilicon adhesive is prepared from the raw materials in parts by weight: 100 parts of modified polysiloxane, 5-20 parts of alpha,omega-dihydroxyl polydimethylsiloxane, 1-10 parts of silicone oil plasticizer, 1-10 parts of gaseous white carbon black, 1-5 parts of diluent, 1-4 parts of photoinitiator and 1-3 parts of catalyst. The organosilicon adhesive disclosed by the invention can subject to fast curing and sizing under ultraviolet irradiation, and a shadow region can be completely cured through moisture; the organosilicon adhesive is green, environment-friendly, efficient and pollution-free and is in line with requirements on environmental protection; meanwhile, the organosilicon adhesive has good high- and low-temperature resistance, weather resistance, electrical insulation properties, physical and mechanical properties and adhesive property and can be extensively applied to the bonding encapsulation of a variety of materials, particularly the bonding encapsulation of fields of electronic appliances, lighting lamps and the like.

Description

technical field [0001] The invention relates to the technical field of silicone adhesive materials, in particular to a UV-moisture dual-curing modified silicone adhesive and a preparation method thereof. Background technique [0002] At present, with the development of large-scale automated continuous production and the improvement of environmental protection requirements, UV-curable materials are widely used in coatings, adhesives, inks and other fields. Ultraviolet curing technology can not only achieve efficient and rapid curing, but also has low energy consumption and no pollution during the curing process, which is convenient for the assembly line production operation of the factory and meets the requirements of environmental protection. However, during the curing process, there will be shadow areas that prevent ultraviolet light from penetrating, which affects the deep curing of the adhesive. At the same time, the existing common adhesives still have many shortcomings...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/08C09J183/06C09J11/08C09J11/04C08G77/388
CPCC08G77/388C08L2205/02C08L2205/03C09J11/04C09J11/08C09J183/08C08L83/06C08L83/04C08K3/36
Inventor 类彦辉王兵陈何国陈思斌宋立芝郑常华
Owner GUANGZHOU BAIYUN CHEM IND
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