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A kind of nano heat insulation material and the preparation method of nano heat insulation board

A nano-insulation material and heat insulation board technology, which is applied in the medium and high temperature field, can solve the problems of limited application, large specific surface area, and low overall cost, and achieve the effect of improving thermal energy efficiency, low thermal conductivity, and good thermal stability

Active Publication Date: 2018-06-19
天津健威泽节能环保科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because silica in microsilica is an amorphous substance, it has high activity, small particles, large specific surface area, and excellent physical and chemical properties. It was considered an industrial waste in the past, and now it can be widely used in concrete used in special projects. , refractory materials, cement and other important fields, but due to market reasons, the application is limited, and in the field of thermal insulation, there is still a lot of room for utilization, and the overall cost is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] After crushing 16.7 parts by weight of aluminum silicate fibers, mix them with 83.3 parts by weight of ordinary micro-silica powder and stir them. After stirring for 20 to 30 minutes, inject them into a mold and form a compact to make a nano-insulation board. The length, width and thickness are 180 ×200×60mm; Mix 0.5 parts by weight of vinyl acetate copolymer adhesive DA102H with 1.5 parts by weight of water to form a glue solution; spray the glue solution on the outer surface of the nano-insulation board, and dry and cool it at 70°C After packaging, make nano insulation board A.

[0026] The density of nano insulation board A is 600kg / m 3 , The compressive strength at room temperature is 1.4MPa, the linear shrinkage rate is 1.1% (1000°C), and the thermal conductivity is 0.029W / m. K(600℃), 0.04W / m﹒ K(800℃), 0.048W / m﹒ K (1000°C).

[0027] The nano-insulation board provided by this example is applied to the high-temperature tertiary air duct of the cement plant. The i...

Embodiment 2

[0029] 11.5 parts by weight of aluminum silicate fibers and 5 parts by weight of polycrystalline mullite fibers are crushed, mixed with 68.5 parts by weight of ordinary micro silica fume and 15 parts by weight of fumed silica, and stirred for 20 to 30 minutes After that, it is injected into the mold to form a briquette to form a nano-insulation board with a length, width, and thickness of 180×200×40mm; mix 0.5 parts by weight of vinyl acetate copolymer adhesive DA102H with 1.5 parts by weight of water to form a glue; mix the glue It is sprayed onto the outer surface of the nano-insulation board, dried and cooled at 90°C, and then packaged to make the nano-insulation board B.

[0030] The density of nano insulation board B is 400kg / m 3 , The compressive strength at room temperature is 1.2MPa, the linear shrinkage rate is 1.1% (1000°C), and the thermal conductivity is 0.022W / m. K(600℃), 0.25W / m﹒ K(800℃), 0.028W / m﹒ K (1000°C).

[0031] The nano-insulation board provided by th...

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PUM

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Abstract

The invention relates to a nano heat-insulating material and a preparation method of a nano heat-insulating board. The nano heat-insulating material has the characteristics of high temperature resistance, high heat stability in the medium / high-temperature state, low thermal conductivity and low cost. The preparation method provided by the invention has the advantages of accessible raw materials, simple technique and convenient preparation process. The technical scheme is as follows: the nano heat-insulating material is prepared from common silicon micropowder, white carbon black, refractory fibers, an organic adhesive and water. The preparation method of the nano heat-insulating board sequentially comprises the following steps: preparing the following raw materials: common silicon micropowder, white carbon black, refractory fibers, organic adhesive and water; 1. crushing the refractory fibers for later use; 2. preparing the organic adhesive liquid for later use; 3. mixing the crushed refractory fibers, common silicon micropowder and white carbon black, and stirring for 20-30 minutes to obtain a mixture; 4. preparing the nano heat-insulating board with different specifications; 5. spraying the organic adhesive liquid onto the external surface of the nano heat-insulating board; 6. drying; and 7. cooling and packaging.

Description

technical field [0001] The invention relates to the medium and high temperature fields of metallurgy, building materials, chemical industry, thermal power and other industrial industries, in particular to a high temperature resistant thermal insulation material and a preparation method thereof. Background technique [0002] High-performance thermal insulation materials are of great significance to energy saving and consumption reduction in industrial fields, especially in metallurgy, building materials, chemical industry, thermal power and other medium-high temperature (500-1000°C) high-energy-consuming fields. The use of high-performance thermal insulation materials in the medium and high temperature field will effectively improve energy utilization. However, in addition to ultra-low thermal conductivity, this thermal insulation material should also have certain mechanical strength and long-term use stability at high temperatures. , and lower cost. The thermal insulation m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/14C04B35/622C04B35/66
CPCC04B35/14C04B35/62204C04B35/66C04B2235/5224C04B2235/5228C04B2235/5232C04B2235/5454C04B2235/96
Inventor 于海唐金泉
Owner 天津健威泽节能环保科技股份有限公司
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