A kind of conductive silver glue and preparation method thereof

A technology of conductive silver glue and metal silver powder, applied in conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of complex formulation process, degumming, increase in contact resistance, etc., to reduce volume resistance and simple preparation method. , the effect of improving the bonding strength

Active Publication Date: 2019-01-25
RIZHAO ZHONGBANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the commonly used epoxy resin system conductive adhesive will produce internal stress due to shrinkage after curing, causing internal deformation of the adhesive layer, degumming, and detachment of the resin substrate from the base, etc., resulting in a decrease in the bonding force and conductivity of the conductive silver adhesive. , device reliability decreases
In order to improve the adverse effects of curing shrinkage, some researchers have selected resin systems such as polyurethane resin, polyimide resin, silicone resin, phenolic resin, and acrylic resin to conduct research on conductive adhesives. More doses, poor repeatability
Even if there is no internal stress after curing, the device often cannot maintain its original performance under impact such as dropping, such as increased contact resistance

Method used

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  • A kind of conductive silver glue and preparation method thereof
  • A kind of conductive silver glue and preparation method thereof
  • A kind of conductive silver glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A kind of conductive silver glue, its raw material comprises following components and content (expressed in weight percent):

[0027] epoxy resin 12%,

[0028] Metallic silver powder 76%,

[0029] Curing agent 2%,

[0030] Thinner 10%.

[0031] The epoxy resin is epoxy resin E51, the epoxy equivalent (g / eq) is 182-192, and the viscosity (25°C) is 11000-14000mPa·s; the metal silver powder is obtained by ball milling process Flake powder, bulk density is 0.8g / cm3~1.5g / cm3, and its particle size distribution D50 is 2.5μm~3.5μm; The curing agent is 4,4-diaminodiphenylmethane (DDM); the dilution The agent is N-methylpyrrolidone (NMP).

[0032] The preparation method of the conductive silver paste of the present embodiment comprises the following steps:

[0033] 1) Preparation of matrix resin

[0034] Weigh the epoxy resin, curing agent and diluent in turn according to the above weight percentage, and mix them with a planetary mixer. Stirring at a revolution speed of 1...

Embodiment 2

[0040] A kind of conductive silver glue, its raw material comprises following components and content (expressed in weight percent):

[0041] Epoxy 14%,

[0042] Metallic silver powder 72%,

[0043] Curing agent 2.8%,

[0044] Thinner 11%,

[0045] Auxiliary 0.2%.

[0046] The epoxy resin is epoxy resin E51, the epoxy equivalent (g / eq) is 182-192, and the viscosity (25°C) is 11000-14000mPa·s; the metal silver powder is obtained by ball milling process Flake powder, bulk density is 0.8g / cm3~1.5g / cm3, and its particle size distribution D50 is 2.5μm~3.5μm; The curing agent is 4,4-diaminodiphenylmethane (DDM); the dilution The additive is N-methylpyrrolidone (NMP); the additive is thixotropic carbon black, which is a light, loose and extremely fine black powder.

[0047] The preparation method of the conductive silver glue of the present embodiment is the same as the operation steps in Example 1.

Embodiment 3

[0049] A kind of conductive silver glue, its raw material comprises following components and content (expressed in weight percent):

[0050] Epoxy 13%,

[0051] Metal silver powder 68.3%,

[0052] Curing agent 1%,

[0053] Curing accelerator 0.3%,

[0054] Thinner 7.4%.

[0055] Described epoxy resin is modified epoxy toughness resin Y-128R, and epoxy equivalent (g / eq) is 150~160; Described metallic silver powder is obtained by ball milling process by a kind of similar ball powder, and bulk density is 0.8g / cm3~1.5g / cm3, its particle size distribution D50 is 2.5μm~3.5μm; the curing agent is a latent curing agent dicyandiamide; the accelerator is imidazole PN series; the thinner is made of fat Alcohol diglycidyl ether and ethylene glycol ether, of which fatty alcohol diglycidyl ether is 3.05%, and ethylene glycol ether is 4.35%.

[0056] The preparation method of the conductive silver glue of the present embodiment is the same as the operation steps in Example 1.

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Abstract

The invention provides a conductive silver adhesive and a preparation method thereof. The conductive silver adhesive is prepared from the following components in percentage by weight: 10-20 percent of epoxy resin, 65-75 percent of silver powder, 1-10 percent of a curing agent, 0.1-0.5 percent of a curing accelerator, 10-20 percent of a diluting agent and 0.1-1 percent of an adjuvant. Compared with a traditional conductive silver adhesive, the conductive silver adhesive has the advantages of excellent electrical performance, remarkably reduced amount of silver powder, budget cost reduction and mechanical performance improvement. The conductive silver adhesive has excellent stability and application, and the preparation method is simple, has good controllability and is suitable for industrial production.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a low-temperature thermosetting conductive silver glue and a preparation method thereof, in particular to a conductive silver glue suitable for bonding quartz crystal resonators and other electronic components and a preparation method thereof. Background technique [0002] my country is a big country in the production and use of quartz crystal resonators, and there is a huge demand for conductive silver glue suitable for bonding quartz crystal resonators. Although the conductive adhesive prepared by the Shanghai Synthetic Resin Research Institute has partially replaced the conductive adhesive of Japan's Three-Bond, it is still mainly imported from Japan at present, and the price is expensive, and the cost of device assembly needs to be further reduced. For high-quality conductive adhesives, two major characteristics are required: first, good rheological properties during appli...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/00C09J9/02C09J11/04C09J11/00
CPCC08K3/08C08K2003/0806C08K2201/003C08L2201/08C09J9/02C09J11/00C09J11/04C09J163/00
Inventor 许文艳车龙余翠娟王宏陈菲菲陈军伟卜志杰于跃王修伟
Owner RIZHAO ZHONGBANG ELECTRONICS CO LTD
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