7results about How to "Reduce volume resistance" patented technology

The invention relates to the technical field of compositions of high-molecular compounds, in particular to an anti-static packing belt and a preparation method thereof. The packaging belt comprises the following components in parts by weight: 60-80 parts of polypropylene, 5-10 parts of a flexibilizer, 0.5-2 parts of a lubricant, 1-5 parts of an antioxidant and 2-5 parts of a polymer type antistatic agent. The invention also provides a preparation method of the composition. Compared with the prior art, the prepared packing belt is lasting in antistatic effect, good in antistatic effect, good in mechanical property and not prone to damage during use.

The application provides a polyether ether ketone heat shrinkage composition and application thereof. The composition comprises 100 parts of polyether ether ketone resin and 30-50 parts of carbon conductive filler composite material by weight. The carbon conductive filler composite material is obtained by in-situ polymerization of carbon conductive filler and polyether ether ketone resin, the carbon conductive filler is obtained by zero-dimensional C 60 The synergistic addition of zero-dimensional C 60 , one-dimensional single-walled carbon nanotubes and two-dimensional reduced graphene oxide improves the filling efficiency of the carbon conductive filler. Research shows that when the heat shrinkage rate of the prepared polyether ether ketone heat shrinkage pipe material is 1.6:1, the recovery rate can be as high as 92.1%, the tensile strength is high, the original volume resistance, the volume resistance after immersion in aviation kerosene for 168 hours and the volume resistance after irradiation at a dose of 1000 kGy are all small. It is shown that the prepared heat shrinkage pipe material has excellent radiation resistance, aviation kerosene resistance, antistatic function, shrinkage performance and mechanical properties.

The invention relates to a semiconductive compound composition and a preparation method thereof. In particular to a semiconductive compound composition and a preparation method thereof, the semiconductive compound composition comprises a base resin and carbon black, the base resin is formed by mixing two ethylene butyl acrylate resins with same non-melting indexes, and the volume of the carbon black in the semiconductive compound composition accounts for more than 60% of the volume of the total composition.

The invention relates to the technical field of conductive adhesives, in particular to a high-conductivity adhesive film, a preparation method and application of the high-conductivity adhesive film to an antenna module. The preparation method comprises the following steps: modifying flake silver powder with glutaric acid, and mixing with epoxy resin to prepare a component A; the preparation method comprises the following steps: synthesizing epoxy carbazole by taking N-hydroxyethyl carbazole and epoxy chloropropane as raw materials, reacting the epoxy carbazole with 2, 2-bis (hydroxymethyl) propionic acid to obtain bis (hydroxymethyl) grafted carbazole, introducing the bis (hydroxymethyl) grafted carbazole into a polyurethane prepolymer, carrying out end capping by adopting 1, 2, 4-trimesic anhydride, and mixing with a carbon nanotube to obtain a component B; mixing the component A and the component B to obtain a mixed rubber material; and adding a reactive diluent, a triethylene tetramine curing agent, absolute ethyl alcohol, nano silicon dioxide, nickel powder and copper powder into the mixed adhesive material, and drying to form the high-conductivity adhesive film. The high-conductivity adhesive film prepared by the invention is pasted on the surface of an antenna base material, and the antenna module is obtained by curing at 80-100 DEG C after die assembly.

The utility model discloses a conductive elastic connection structure, which comprises an elastic conductor and a connection assembly, the elastic conductor is used for being connected and electrically conducted with a grounding area through the connection assembly, the elastic conductor comprises a silicon rubber body and a conductive coating, the conductive coating is coated on the outer side surface of the silicon rubber body, and the conductive coating is coated on the outer side surface of the silicon rubber body. The conductive coating is formed by mixing silicone rubber and conductive filler, and the conductive filler is pure silver powder or silver-coated aluminum powder. According to the utility model, the outer side surface of the silicone rubber body is coated with the conductive coating, the conductive coating is formed by mixing the silicone rubber material and the conductive filler, and the conductive filler is the pure silver powder or the silver-coated aluminum powder, so that the manufacturing process is simpler, the cost is saved, and the low PI M conduction of a good high-frequency signal can be ensured.

The present invention discloses a low contact resistance heat-curing conductive adhesive and a preparation method thereof, and belongs to the technical field of solar cells. The heat-curing conductive adhesive of the present invention is composed as follows: (A) silver powder, silver-coated copper powder and a mixture of the two powders, (B) epoxy monomer and modified epoxy resin, (C) curing agent, (D) solvent, (E) rheological additive, and (F) phenolic hydroxyl compound. The present invention can realize a low contact resistance conductive adhesive that cures quickly at 200°C through the above composition, and can also achieve the goals of low volume resistance, moisture resistance, heat resistance, and good storage stability required for fine grid metallization electrodes for heterojunction batteries.

This invention provides a photographic paper base and photographic paper. The photographic paper base includes a base paper layer and a plastic layer, with the plastic layer disposed on at least one side of the base paper layer. The base paper layer comprises pure wood pulp, an antistatic agent, a hygroscopic agent, and an anti-bleeding agent. The antistatic agent includes a sodium salt, and the hygroscopic agent includes a lithium salt. Therefore, in the photographic paper base of this invention, sodium salt is used as the antistatic agent, and lithium salt as the hygroscopic agent. The simultaneous use of both effectively reduces the volume resistivity of the paper base, thereby preventing the generation of static spots due to charge accumulation and discharge. It also reduces moisture loss from the cut edges of the paper base, thus preventing edge bleeding. Furthermore, sodium and lithium salts have strong solubility and do not interact with the base paper fibers and the anti-bleeding agent, therefore they do not exacerbate edge bleeding or affect the effectiveness of the anti-bleeding agent. Therefore, the photographic paper base of this invention has a low volume resistivity, avoids the generation of static sparks, and is less prone to edge bleeding and bleed.