The invention provides a silver conductive
adhesive, comprising a basic resin, a curing agent, a curing accelerator, a conductive material and a
solvent, wherein the basic resin is an
epoxy resin including a
bisphenol A
epoxy resin and a gamma-butyrolactone modified
epoxy resin, the curing agent is binary aliphatic
ether amine and versamid, the curing accelerator is 2,4,6-tri-(dimethylaminomethyl)-
phenol, and the conductive material is silver
powder. The invention further provides a preparation method of the silver conductive
adhesive. In the invention, the gamma-butyrolactone modified epoxy resin is introduced into the epoxy
system silver conductive
adhesive, and when the modified epoxy resin is cured, a polycyclic structure is subjected to ring-opening
polymerization to result in volumetric expansion, by jointly applying the modified epoxy resin and the epoxy resin to the silver conductive adhesive, the prepared silver conductive adhesive has
low shrinkage rate and low
expansion rate as well as
low volume resistance. The silver conductive adhesive prepared in the invention can be widely applied to various environments.