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High-speed machining and automatic measuring integrated equipment

An automatic measurement and high-speed technology, applied in metal processing equipment, working carrier, grinding/polishing equipment, etc., can solve the problems of low production efficiency and low removal efficiency of hard and brittle materials, and achieve high processing efficiency and good chip removal effect , the effect of not easy to scratch

Inactive Publication Date: 2016-06-01
哈尔滨秋冠光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-speed processing and automatic measurement integrated equipment mainly for the low removal efficiency of hard and brittle materials and the need to detect the thickness in the middle, resulting in low production efficiency and other problems

Method used

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  • High-speed machining and automatic measuring integrated equipment

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings. combine figure 1 , the positions marked in the figure are spindle 1, grinding wheel 2, diamond layer 3 on the surface of the grinding wheel, workpiece shaft 4, porous ceramic disc 5, workpiece 6, and online thickness measuring instrument 7. The most obvious difference between the structure of this equipment and the traditional grinding and polishing equipment is that the upper and lower discs are not on the same axis. The main structure includes: main shaft 1, diamond grinding wheel 2, workpiece shaft 4 and porous ceramic disc 5. An ultrasonic vibration device is connected to the workpiece shaft 1, which can perform ultrasonic vibration along the axial direction, and the vibration is transmitted to the grinding wheel 2, which can speed up the removal rate of the material 6. The diamond layer 3 on the surface of the grinding wheel is an agglomerated structure, which is ...

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Abstract

The invention provides high-speed machining and automatic measuring integrated equipment, which comprises a main shaft, a diamond grinding wheel, a workpiece shaft and a porous ceramic plate; the workpiece shaft is connected with an ultrasonic vibration device; vibration of the ultrasonic vibration device is conducted to the diamond grinding wheel; a workpiece is fixed on the porous ceramic plate in a manner of adsorption; the main shaft and the workpiece shaft are not coaxial; the diamond grinding wheel and the porous ceramic plate are separately driven by the main shaft and the workpiece shaft to rotate in a horizontal direction; and the lower side of the workpiece shaft is connected with a guide rail, and can do reciprocating motion in the horizontal direction. The problem that production efficiency is low, and the like due to the fact that removal efficiency of a crisp and hard material is low and thickness needs to be detected during machining is mainly solved by the high-speed machining and automatic measuring integrated equipment provided by the invention.

Description

technical field [0001] The invention discloses a processing device, in particular to a high-speed processing and automatic measurement integrated device. Background technique [0002] Hard and brittle materials, especially non-metallic insulating materials and semiconductor materials, such as optical glass, single crystal silicon, sapphire, etc., have become more and more widely used in many fields such as electronics, optics, aerospace, national defense and civil use due to their unique properties. application. However, due to its high hardness and high brittleness, not only the processing efficiency is low, but also chipping or even cracking is especially prone to occur when processing thin slice products, resulting in low yield and high production cost. [0003] For example, in LED applications or consumer electronics applications, there are high requirements for the surface quality of sapphire wafers. Usually, after the sapphire wafer is ground to remove the damaged la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/30B24B49/02B24B1/04B24B37/16
CPCB24B37/107B24B1/04B24B37/16B24B37/30B24B49/02
Inventor 左洪波杨鑫宏张学军袁志勇
Owner 哈尔滨秋冠光电科技有限公司
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