High-thermal conductivity resin composition and application thereof

Abstract

The invention discloses a high-thermal conductivity resin composition. The high-thermal conductivity resin composition is prepared from the following components in parts by weight: 40 to 75 parts of BMI (Bismaleimides) modified epoxy resin, 5 to 40 parts of flexible modified epoxy resin, 360 to 480 parts of thermal conducting fillers, 8 to 30 parts of curing agent, 2 to 6 parts of coupling agent, 0.05 to 0.85 part of curing accelerator and 1 to 5 parts of additive. According to the high-thermal conductivity resin composition disclosed by the invention, by introducing the BMI modified epoxy resin in a system, the advantages of epoxy resin and BMI are integrated; meanwhile, the flexible modified epoxy resin and the thermal conducting fillers are added, so that a new resin composition has excellent toughness, excellent thermal conductivity and higher Tg (Glass Transition Temperature). A metal-based copper-clad plate prepared by adopting the high-thermal conductivity resin composition disclosed by the invention has the excellent comprehensive properties such as high thermal conductivity coefficient, high breakdown voltage, high peel strength, higher Tg and good flexibility.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a high thermal conductivity resin composition. The invention also discloses a metal-based copper clad laminate made of the above high thermal conductivity resin composition. Background technique [0002] In the field of copper clad laminates, generally speaking, high thermal conductivity materials use epoxy resin with good adhesion as the matrix. Epoxy resin adhesive is a widely used adhesive with good adhesion and high cohesive strength. , Good compatibility and so on. However, it is slightly insufficient in heat resistance and electrical properties. The bismaleimide resin monomer has high activity, no molecules are released during polymerization, and polyimide (PI) with high heat resistance is formed after curing reaction. The finished product has stable performance and can maintain a relatively high temperature in a wide temperature range. High physi...

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Problems solved by technology

Among them, the Chinese patent with application number 200910189544.6 (application date: 2009.11.24, publication number: 101735611, publication date: 2011.6.16) is made by adding high thermal conductivity fillers into the BMI resin system modified by allylphenol Copper clad laminate has excellent heat resistance and electrical properties, but its thermal conductivity is less than 1.0W/m·K, even if the reinforcing material is removed, the thermal conductivity is less than 1.5W/m·K

[0004] In the BMI resin system modified by allylphenol in addition, although the t

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