High-density molybdenum-niobium alloy target and preparation process thereof

Abstract

The invention discloses a high-density molybdenum-niobium alloy target and a preparation process thereof. The preparation process comprises the following steps: firstly, the following components are weighed in percentage by weight: 5-15% of niobium powder, 0.1-0.8% of zirconium hydride and the balance of molybdenum powder; the components are molded through cold isostatic pressing after grinding and uniform mixing, and are sintered in vacuum; or, the components are sintered in vacuum after presintering in a hydrogen atmosphere; and finally, the machining is performed to obtain the high-density molybdenum-niobium alloy target. The high-density molybdenum-niobium alloy target is directly prepared by using a general powder metallurgy process and an activation effect of zirconium hydride, so that the process is simple, and the cost is low; and meanwhile, the particle splashing caused by air holes is prevented, the film plating quality is guaranteed, and the defects as thick structure and nonuniform components in a smelting foundary process, carburization and high cost in a hot pressing and hot isostatic pressing process and long flow and low yield in forging or rolling are overcome.

Description

technical field [0001] The invention belongs to the technical field of rare metals, and in particular relates to a high-density molybdenum-niobium alloy target material added with zirconium hydride and a preparation process thereof. Background technique [0002] Sputtering is the use of ions generated by an ion source, which are accelerated and gathered into a high-speed ion flow in a vacuum to bombard the solid surface, so that the atoms on the solid surface leave the target and deposit on the surface of the substrate, thereby forming a nanometer (or micrometer) film. The solid is called a sputtering target. Sputtering coating is the basic method for preparing functional thin films in the fields of integrated circuits, flat panel displays (including liquid crystal displays and touch screens, etc.), thin-film solar cells and light-emitting diodes (LEDs), and sputtering targets have become indispensable basic materials in these fields . [0003] With the continuous improvem...

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Problems solved by technology

The problems of this process are: casting defects such as shrinkage cavity, shrinkage porosity, inclusions, segregation, etc. are unavoidable in the ingot, and the grains of the ingot are coarse, resulting in a decrease in coating efficiency and film quality. If further processing is performed, the yield rate is low, High cost; since molybdenum and niobium are metals with high melting points, vacuum arc melting or vacuum electron beam melting is usually required, which requires high equipment conditions and high cost; it is difficult to obtain molybdenum-niobium alloy targets with uniform composition Melting and other processes, the uniformity of the composition is also difficult to meet the requirements, resulting in a decrease in the uniformity of the composition of the film layer

However, due to the low density of the sintered compact, the processing yield is low, and the process is complicated and the preparation cost is high.

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