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Heat-conducting electronic packaging composite and preparation method thereof

A composite material and electronic packaging technology, applied in the field of materials, can solve the problems of high density, insufficient thermal conductivity, and high cost, and achieve good thermal conductivity, excellent thermal stability, and good heat dissipation

Active Publication Date: 2016-07-13
深圳市锦昊辉实业发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional electronic packaging materials mainly use ceramic packaging materials, but they have disadvantages such as insufficient thermal conductivity, high density and high cost. Therefore, research and development of electronic packaging materials with high thermal conductivity, low density, good electrical insulation performance and low cost are important for The development of the electronics industry plays a key role and also has broad market prospects

Method used

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  • Heat-conducting electronic packaging composite and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A heat-conducting electronic packaging composite material, prepared from the following components in parts by weight: 30 parts of bisphenol A epoxy resin, 10 parts of nano-alumina, 5 parts of nano-silicon dioxide, 1 part of neodymium acetylacetonate, 3,5- 1 part of diaminobenzoic acid, 1 part of silane coupling agent KH-5511, 1 part of γ-aminopropyltriethoxysilane, 1 part of lithium chloride, 0.2 part of N-methylpyrrolidone, 0.5 part of pyridine, triphosphite 0.1 part of phenyl ester, 0.5 part of N-aminoethylpiperazine, 40 parts of N,N-dimethylformamide, 1 part of trimethylhexamethylenediamine, 50-70 parts of acetone, 80 parts of methanol, water 80 servings.

[0026] The preparation method of the above-mentioned heat-conducting electronic packaging composite material is as follows: first mix nano-alumina, nano-silicon dioxide, silane coupling agent KH-551, γ-aminopropyltriethoxysilane and water, and use a magnetic stirrer at a temperature of 70 ℃, stirred for 3 hours a...

Embodiment 2

[0028] A heat-conducting electronic packaging composite material, prepared from the following components in parts by weight: 35 parts of bisphenol A epoxy resin, 12 parts of nano-alumina, 6 parts of nano-silicon dioxide, 1.5 parts of neodymium acetylacetonate, 3,5- 1.2 parts of diaminobenzoic acid, 1.3 parts of silane coupling agent KH-5511, 1.5 parts of γ-aminopropyl triethoxysilane, 1.2 parts of lithium chloride, 0.3 parts of N-methylpyrrolidone, 0.6 parts of pyridine, triphosphite 0.15 parts of phenyl ester, 0.6 parts of N-aminoethylpiperazine, 45 parts of N,N-dimethylformamide, 1.5 parts of trimethylhexamethylenediamine, 55 parts of acetone, 85 parts of methanol, and 85 parts of water .

[0029] The preparation method of the above-mentioned heat-conducting electronic packaging composite material is as follows: first mix nano-alumina, nano-silicon dioxide, silane coupling agent KH-551, γ-aminopropyltriethoxysilane and water, and use a magnetic stirrer at a temperature of 80...

Embodiment 3

[0031] A heat-conducting electronic packaging composite material, prepared from the following components in parts by weight: 40 parts of bisphenol A epoxy resin, 15 parts of nano-alumina, 7.5 parts of nano-silicon dioxide, 2 parts of neodymium acetylacetonate, 3,5- 1.5 parts of diaminobenzoic acid, 1.5 parts of silane coupling agent KH-5511, 2 parts of γ-aminopropyltriethoxysilane, 1.5 parts of lithium chloride, 0.35 parts of N-methylpyrrolidone, 0.75 parts of pyridine, triphosphite 0.2 parts of phenyl ester, 0.75 parts of N-aminoethylpiperazine, 50 parts of N,N-dimethylformamide, 2 parts of trimethylhexamethylenediamine, 60 parts of acetone, 90 parts of methanol, 90 parts of water .

[0032] The preparation method of the above-mentioned heat-conducting electronic packaging composite material is as follows: first mix nano-alumina, nano-silicon dioxide, silane coupling agent KH-551, γ-aminopropyltriethoxysilane and water, and use a magnetic stirrer at a temperature of 85 ℃, st...

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Abstract

The invention provides a heat-conducting electronic packaging composite and a preparation method thereof. The preparation method comprises the following steps: mixing nano-alumina, nano-silica, a silane coupling agent KH-551, a gamma-aminopropyltriethoxysilane and water at first, and stirring; drying after filtering; mixing with N-methyl pyrrolidone, pyridine and triphenyl phosphate for reaction; adding lithium chloride and methyl alcohol for further reaction; filtering, flushing with N-dimethyl formamide and drying; re-adding acetone for ultrasonic dispersion; mixing bisphenol A epoxy resin, Neodymium(III) 2,4-pentanedionate and water, heating, and stirring for dissolution; mixing the two mixtures, and stirring while performing ultrasonic treatment; performing water bathing, adding 3,5-diaminobenzoic acid, N-aminoethylpiperazine and trimethyl hexamethylene diamine, stirring, and then conducting vacuum degassing; finally, pouring the mixture into a die for curing to obtain the heat-conducting electronic packaging composite. The heat-conducting electronic packaging composite has excellent heat stability, and meanwhile, has very good heat conductivity and a good heat dissipation effect.

Description

technical field [0001] The invention relates to the field of materials, in particular to a heat-conducting electronic packaging composite material and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, the development of electronic integration and assembly technology is also very rapid, and the electronic devices and circuits are developing towards miniaturization and shrinking continuously. At the same time, its workload is getting bigger and bigger, the frequency is getting higher and higher, and the heat generated is also increasing. In order to make the electronic device work effectively for a long time, it must solve its heat dissipation problem and prevent the temperature from continuously increasing. Increase and reduce its working efficiency and service life. Traditional electronic packaging materials mainly use ceramic packaging materials, but they have disadvantages such as insufficient thermal conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K3/22C08K3/36C08K5/526
CPCC08K3/22C08K3/36C08K5/526C08K9/06C08K13/06C08K2003/2227C08K2201/011C08L2201/08C08L2203/206C08L63/00
Inventor 陈昌
Owner 深圳市锦昊辉实业发展有限公司
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