Two-dimensional electrode of crystalline silicon solar cell and preparation method of two-dimensional electrode
A technology of solar cells and crystalline silicon cells, which is applied in the field of solar cells, can solve the problems of limited reduction of electrode light-shielding area, complicated process, and inability to realize mass production, etc., and achieve good local ohmic contact, increase of light-receiving area, and balance dilemma problem effect
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[0035] The method for preparing the two-dimensional electrode of the crystalline silicon solar cell includes the following steps:
[0036] The crystalline silicon wafer 4 is processed by texturing, diffusion, etching, deposition of passivation film and anti-reflection film 3, etc. The crystalline silicon wafer 4 can be a P-type or N-type monocrystalline silicon wafer, polycrystalline silicon wafer, and then a crystalline silicon cell The electrode production is as follows.
[0037] Fabricate local contact metal electrodes 2 in arrays that are in partial contact with the silicon substrate on the front and / or back of the crystalline silicon cell according to a specific pattern. The production can be made by screen printing, and laser or chemical corrosion combined with vapor deposition, light Methods of induction plating, electroplating, etc. The metal electrode pattern can be one-dimensional, two-dimensional geometric figures or a combination of one-dimensional and two-dimensional ...
Example Embodiment
[0044] Example 1:
[0045] (1) P-type monocrystalline silicon wafers are processed by texturing, diffusion, etching, deposition of passivation film and anti-reflection film;
[0046] (2) Using screen printing method to make dot-shaped silver electrodes on the front, the diameter of a single dot is 50um, and the distance between dots is 0.8mm;
[0047] (3) Sintering in the furnace body at 300-900°C, the front-side dot-shaped silver paste penetrates the anti-reflection film and the passivation film, forming a good ohmic contact with the silicon substrate;
[0048] (4) Sputtering is used to prepare 100nm AZO transparent conductive film on the spot-shaped local contact silver electrode;
[0049] (5) The silver grid line electrode is prepared by screen printing on the AZO transparent conductive film. The electrode pattern is composed of a group of equidistant parallel grid lines, the number of grid lines is 20, and the grid line width is 20um. After that, heat treatment is performed.
[0050...
Example Embodiment
[0051] Example 2:
[0052] (1) P-type monocrystalline silicon wafers are processed by texturing, diffusion, etching, deposition of passivation film and anti-reflection film;
[0053] (2) Using screen printing method to make dot-shaped silver electrodes on the front and back respectively, the diameter of a single dot is 100um, and the distance between dots is 1.5mm;
[0054] (3) Sintering in a furnace at 300-900°C, the dot-shaped silver paste on the front and back of the battery penetrates the anti-reflection film and the passivation film, forming a good ohmic contact with the silicon substrate;
[0055] (4) Sputtering is used to prepare a 110nm transparent conductive film of ITO on the dot-shaped local contact electrode;
[0056] (5) The silver electrode is prepared by ink-jet method on the ITO transparent conductive film. The electrode pattern is composed of a group of equidistant parallel thin grid lines and a group of equidistant parallel main grid lines, and the thin grid lines are ...
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