A kind of heat dissipation composition and its preparation method and application

A composition and technology of heat-dissipating coatings, which are applied in chemical instruments and methods, heat-exchange materials, adhesive additives, etc., can solve problems such as unsatisfactory heat-dissipating effect and transmission frequency bandwidth, achieve good heat-dissipating effect and improve normal emission. rate, solve the effect of complex processing technology

Active Publication Date: 2019-02-26
HISENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, oxides are mostly used as heat dissipation compositions in existing known heat dissipation coatings, for example, cheap hematite ore is used as the main raw material, supplemented with manganese oxide, copper oxide, aluminum oxide, cobalt oxide, zinc oxide, nickel oxide , titanium oxide, magnesium oxide, silicon oxide, these oxides have good thermal conductivity and can realize heat dissipation to a certain extent, however, the infrared radiation coatings containing these oxide heat dissipation compositions have a wide emission band, and the heat dissipation effect is still unsatisfactory

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  • A kind of heat dissipation composition and its preparation method and application

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Embodiment 1

[0024] An embodiment of the present invention provides a heat dissipation composition, which includes: nano-silicon carbide and nano-titanium nitride, wherein the particle size of the nano-silicon carbide and nano-titanium nitride is between 10nm and 900nm.

[0025] It should be noted that for regular spherical nano-silicon carbide and nano-titanium nitride particles, the particle size refers to its diameter; for irregular particles, the particle size can refer to the definition of particle size in the prior art, the example There are three ways to define it: projection diameter, geometric equivalent diameter or physical equivalent diameter. Among them, projected diameter: refers to the particle diameter observed under a microscope; geometric equivalent diameter: the diameter of a spherical particle when it is equal to a certain geometric quantity of the particle; physical equivalent diameter: when it is equal to a certain physical quantity of the particle The diameter of the ...

Embodiment 2

[0045] Embodiments of the present invention provide a method for preparing a heat dissipation composition, the method comprising the following steps:

[0046] S101: adding the components of the heat dissipation composition into the organic solvent.

[0047] Wherein, the components of the heat dissipation composition may include nano-silicon carbide and nano-titanium nitride, may also include nano-silicon carbide, nano-titanium nitride and nano-titanium dioxide, and may also include a coupling agent while including the aforementioned inorganic nanoparticles.

[0048] Each component is added in the organic solvent, can be divided into two kinds of situations:

[0049] One case is that for a heat dissipation composition that does not contain a coupling agent and only includes inorganic nanoparticles, it can be that all components are added together in an organic solvent, for example, adding nano-silicon carbide and nano-titanium nitride to an organic solvent together In, or nano...

Embodiment 3

[0080] The embodiment of the present invention provides the application of the heat dissipation composition described in the first embodiment in the preparation of heat dissipation paint, heat dissipation glue or heat dissipation plastic.

[0081] By filling the heat dissipation composition provided in Example 1 of the present invention as an inorganic filler into corresponding product raw materials (or matrix materials), corresponding composite materials can be obtained, namely heat dissipation paint, heat dissipation glue or heat dissipation plastic. When filling, the mass ratio of the heat dissipation composition to the matrix material can be set according to actual needs. In the preferred embodiment of the present invention, the mass fraction of the heat dissipation composition in the composite material ranges from 0.5% to 15%.

[0082] Specifically, the heat-dissipating coating is prepared by filling the heat-dissipating composition into a binder. Wherein, the adhesive he...

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Abstract

The embodiment of the invention discloses a heat dissipation composition as well as a preparation method and application thereof, relating to the technical field of heat dissipation materials. The heat dissipation composition can achieve the effect of increasing the normal emittance of product raw materials. The heat dissipation composition comprises nano silicon carbide and nano titanium nitride, wherein the grain sizes of nano silicon carbide and nano titanium nitride are 10-900nm. The heat dissipation composition can be filled in various product raw materials to improve the heat dissipation properties of the product raw materials.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials, in particular to a heat dissipation composition and its preparation method and application. Background technique [0002] With the rapid development of science and technology, the density and miniaturization of integrated circuits is getting higher and higher, and electronic components become smaller and run at higher speeds, making their requirements for heat dissipation increasingly higher. In order to dissipate the heat from the heat source as soon as possible, there are two common methods in the industry at present: one is to increase the heat dissipation area, and its typical disadvantage is that it will lead to excessive volume and greatly affect the shape of the product; the other is to increase the heat dissipation area. Auxiliary heat dissipation equipment such as cooling fans are installed near the heat source, but this method will increase energy consumption on the o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K13/02C08K3/34C08K3/28C08K3/22C09D7/61C09D1/00C09D175/04C09D133/00C09J11/04C09J133/00C08L55/02C08L27/06C08L25/06C09K5/14
CPCC08K3/22C08K3/28C08K3/34C08K13/02C08K2003/2241C08K2201/003C08K2201/006C08K2201/011C09D1/00C09D7/63C09D7/67C09D7/68C09D133/00C09D175/04C09J11/04C09J133/00C09K5/14C08L55/02C08L27/06C08L25/06
Inventor 邢哲
Owner HISENSE
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