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A kind of organosilicon ternary encapsulation material and preparation method thereof

A packaging material and organosilicon technology, applied in the field of preparation of organosilicon packaging materials, can solve problems such as being unfavorable for large-scale promotion and industrialized production, low refractive index and thermal conductivity, and high cost of laser sintering process, and achieve compatibility. The effect of improving the property and bonding degree, increasing the cross-linking density, and small filling amount

Active Publication Date: 2018-10-16
SHENZHEN GUOHUA OPTOELECTRONICS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its adhesion is poor, and it is easy to peel off from the external sealant, substrate, chip and other components under high temperature or alternating cold and hot conditions, forming a partial vacuum layer and causing the brightness to decay sharply.
In addition, the price of silicone is very expensive, and the cost of the laser sintering process used in packaging is also extremely high, which is not conducive to large-scale promotion and industrial production
[0005] Since the above three packaging materials all have obvious defects of low refractive index and low thermal conductivity

Method used

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  • A kind of organosilicon ternary encapsulation material and preparation method thereof
  • A kind of organosilicon ternary encapsulation material and preparation method thereof
  • A kind of organosilicon ternary encapsulation material and preparation method thereof

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preparation example Construction

[0035] The invention provides a method for preparing an organosilicon ternary packaging material, comprising the following steps: S1: Surface modification of the micro-nano silicon dioxide material: uniformly dispersing the micro-nano silicon dioxide material in benzyl alcohol, pressurized and heated to react , cooled, and centrifuged to obtain a surface-modified micro-nano silica material; S2: the surface-modified micro-nano silica material prepared in S1 is miscible with epoxy-based organosilicon monomers, emulsified and dispersed , centrifugally dispersed to obtain a transparent solution, which was concentrated into solution A under dry inert gas conditions; S3: under the action of a catalyst, the silicon glycol crosslinking agent, the solution A and vinyl organosilicon monomer synthesized the first intermediate, silicon Diol crosslinking agent, the solution A and pure silicone monomers are synthesized to obtain the second intermediate, wherein the vinyl silicone monomers in...

Embodiment 1

[0041] Weigh 2g (0.0333moL), 3.33g (0.555mol), 5g (0.833mol), 6.66g (1.11mol), 8.325g (1.39mol), 9.99g (1.665mol) of micron quartz powder in 30mL freshly steamed Evenly dispersed in benzyl alcohol, then poured into a 45mL stainless steel pressure reactor and heated at 240°C for 96 hours, and then centrifuged after cooling to room temperature. Repeat the operation at least 2 times to ensure the surface treatment of the quartz particles is complete. Next, take 0.0315g and 9uL of γ-(2,3-glycidoxy)propyltrimethoxysilane and dissolve them in 20mL of freshly distilled tetrahydrofuran (THF), and ultrasonically emulsify and disperse at room temperature for more than 30 minutes , using the condensation reaction of some hydroxyl groups on the surface of micron-sized quartz with trimethoxysilane to achieve the effect of surface modification. Then, it was centrifuged to obtain a transparent solution A, which was dried and concentrated under dry nitrogen to obtain 5 mL of solution B.

[...

Embodiment 2

[0050] After 2g of micron quartz (0.0333moL) was treated by benzyl alcohol reprecipitation as described in Example 1, 0.0945g and 27uL of γ-(2,3-glycidoxy)propyltrimethoxy Silane was miscible in 30 mL of freshly distilled tetrahydrofuran and ultrasonically emulsified and dispersed at room temperature for more than 30 minutes, and then centrifuged to obtain a transparent solution C. Blow dry under dry nitrogen to obtain 5 mL of solution D.

[0051] Synthesize diphenylsilanediol and solution D with vinyltrimethoxysilane and methyldiethoxysilane respectively under the action of a catalyst to obtain a first intermediate and a second intermediate. The ratio of vinyltrimethoxysilane to methylphenylsilanediol is 1:1, and the ratio of methyldiethoxysilane to diphenylsilanediol is 1:1.5. Put the first intermediate and the second intermediate above into a vacuum oven and dry at 45° C. for 4 hours.

[0052] Intermediates The first intermediate and the second intermediate were stirred f...

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Abstract

The invention discloses an organic-silicon ternary packaging material and a preparation method thereof. The method comprises the steps that the surface of a micro-nano silica material is grafted with a phenyl group through benzyl alcohol to enhance intermiscibility of the micro-nano silica material and an organic medium; the surface-modified micro-nano silica material and epoxy-based organic silicon monomers are mixed, emulsifying dispersion and centrifugal dispersion are conducted, a transparent solution is obtained and concentrated into a solution A under the inert gas condition, and hydroxyl groups on the surface of micro-nano silica and the organic silicon monomers are subjected to a condensation reaction; synthesis is conducted on the solution A and vinyl organic silicon monomers and pure organic silicon monomers respectively, and a first intermediate and a second intermediate are obtained respectively; synthesis is conducted on the first intermediate and the second intermediate, and the packaging material is obtained. The micro-nano silica composite organic-silicon ternary packaging material is suitable for packaging of conventional optoelectronic devices and particularly suitable for packaging of optoelectronic display devices which have high requirements on the heat conductivity coefficient, refractive index, transparency and the like.

Description

technical field [0001] The invention relates to a preparation method of an organic silicon packaging material, in particular to an organic silicon ternary packaging material and a preparation method thereof. Background technique [0002] Among the mainstream packaging materials in the market, epoxy resin is used the most. It has excellent electrical insulation properties, good adhesion, dielectric properties, transparency and cohesion, low shrinkage, good storage stability, flexible formulations, and Low curing conditions and easy operation. However, after curing, it has high cross-linking density, large internal stress, high brittleness, poor impact resistance, and the service temperature generally cannot exceed 150 °C. Moreover, its aging resistance, including its anti-ultraviolet light performance, is obviously insufficient, and its water vapor transmission rate is relatively high. In addition, from the perspective of the packaging process, the curing time of the epoxy ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/20C08G77/18C08G77/14C08G77/16C08K9/04C08K3/36
CPCC08G77/14C08G77/16C08G77/18C08G77/20C08K3/36C08K9/04C08K2201/003
Inventor 李皓王效李恩周国富
Owner SHENZHEN GUOHUA OPTOELECTRONICS
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