Surface blackening treatment method for rolled copper foil

A technology for rolling copper foil and a treatment method, which is applied in the field of surface treatment of rolled copper foil, can solve the problems that the appearance color, peeling resistance, etching property, and solderability cannot meet the requirements of PDP production, and achieve good matting effect, good The effect of acid resistance

Inactive Publication Date: 2016-12-07
中铜(上海)铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The reddish (copper plating) or graying (galvanized) treatment of rolled copper foil is basically the treatment method of electrolytic copper foil. Both performance and solderability cannot meet the production requirements of PDP

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The black surface treatment process of rolled copper foil includes the following steps in sequence:

[0052] Electrochemical degreasing, water washing, electrochemical degreasing, water washing, electrochemical degreasing, water washing, pickling, water washing, roughening treatment, water washing, secondary roughening treatment, water washing, curing treatment, water washing, secondary curing treatment, Water washing, nickel-cobalt plating, water washing, galvanizing, water washing, passivation, water washing, coating with silane coupling agent, drying, winding and off-line.

[0053] in:

[0054] The electrochemical degreasing solution used is sodium hydroxide aqueous solution, in which OH - The concentration is 35g / L, the temperature is normal temperature, and the current density of electrochemical degreasing is 3A / dm 2 ;

[0055] The pickling solution used is sulfuric acid, where H + The concentration is 30g / L, and the temperature is normal temperature;

[0056]...

Embodiment 2

[0069] Compared with Embodiment 1, this embodiment differs from:

[0070] The electrochemical degreasing solution used is sodium hydroxide aqueous solution, in which OH - The concentration is 40g / L, the temperature is normal temperature, and the current density of electrochemical degreasing is 4A / dm 2 ;

[0071] The pickling solution used in is sulfuric acid, where H + The concentration is 35g / L, and the temperature is normal temperature;

[0072] The primary roughening solution used, where Cu 2+ 26g / L, H 2 SO 4 125g / L, temperature is 30℃, current density is 18A / dm 2 ;

[0073] The secondary roughening solution used, where Cu 2+ 36g / L, H 2 SO 4 135g / L, temperature is 30℃, current density is 38A / dm 2 ;

[0074] The primary curing solution used, where Cu 2+ 36g / L, H 2 SO 4 95g / L, temperature is 40℃, current density is 17A / dm 2 ;

[0075] The secondary curing solution used, where Cu 2+ 40g / L, H 2 SO 4 95g / L, temperature is 40℃, current density is 10A / dm 2...

Embodiment 3

[0084] Compared with Embodiment 2, the present embodiment differs from:

[0085] The degreasing solution used is sodium hydroxide aqueous solution, in which OH - The concentration is 45g / L, the temperature is normal temperature, and the current density of electrochemical degreasing is 5A / dm 2 ;

[0086] The pickling solution used is sulfuric acid, where H + The concentration is 40g / L, and the temperature is normal temperature;

[0087] The primary roughening solution used, where Cu 2+ 26g / L, H 2 SO 4 120g / L, temperature is 30℃, current density is 16A / dm 2 ;

[0088] The secondary roughening solution used, where Cu 2+ 34g / L, H 2 SO 4 130g / L, temperature is 30℃, current density is 37A / dm 2 ;

[0089] The primary curing solution used, where Cu 2+ 40g / L, H 2 SO 4 90g / L, temperature is 40℃, current density is 16.2A / dm 2 ;

[0090] The secondary curing solution used, where Cu 2+35g / L,H 2 SO 4 90g / L, temperature is 40℃, current density is 9.4A / dm 2 ;

[0091...

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Abstract

The invention discloses a surface blackening treatment method for a rolled copper foil. The surface blackening treatment method orderly comprises the following steps: (1) electrochemical oil removal, (2) coarsening treatment, (3) solidification treatment, (4) nickel-cobalt plating treatment, (5) zinc plating treatment, (6) passivation, (7) silicone coupling agent coating treatment, and (8) drying treatment, and obtaining the product. Current is applied in step (1) to step (6). The surface blackening treatment method for a rolled copper foil provided by the present invention has the advantage that the black appearance of the copper foil obtained after various electric plating steps meets FPC requirements. Through determination, the copper foil has a surface color blackness value of less than 30, surface roughness Ra of less than or equal to 1.0 micron and Rz of less than or equal to 2.0 microns, peel strength of more than 1.4 N/mm, and folding endurance MIT of more than 800; the copper foil has favorable acid resistance, alkali resistance, soldering resistance, and etching performance. With the blackness value RAL7016, a good extinction effect is achieved.

Description

technical field [0001] The invention relates to a surface treatment method of rolled copper foil, in particular to a surface blackening method of rolled copper foil. Background technique [0002] Copper foil is one of the main raw materials of FCCL (the processing substrate of flexible printed circuit boards). According to different production methods, copper foil can be divided into two categories, namely rolled copper foil and electrolytic copper foil. [0003] The calendered copper foil is formed by repeated rolling-annealing process of copper ingots by using the principle of plastic processing. Its internal structure is a flaky crystal structure, and the calendered copper foil product has good ductility and flexibility. , low roughness and high folding resistance, has become the basic material of flexible printed circuit boards. At this stage, rolled copper foil is mainly used in flexible circuit boards and high-frequency circuit boards. [0004] Recently, the plasma d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25F1/04C25F3/02C25D3/56C25D3/22C25D5/12C25D11/38C23C28/00
CPCC25F1/04C23C28/321C23C2222/20C25D3/22C25D3/562C25D5/12C25D11/38C25F3/02
Inventor 江幼平刘平高克李向宇刘新宽邵胜忠陈小红许春张宇
Owner 中铜(上海)铜业有限公司
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