High-heat-conductive and high-adhesion-strength organic silicon pouring sealant, preparation method thereof, and method therewith for sealing end portion of motor

A technology of silicone potting glue and high thermal conductivity, which is applied in the manufacture of motor generators, electromechanical devices, polymer adhesive additives, etc. It can solve the problems of unreachable use requirements, poor thermal conductivity, and poor mechanical properties. To achieve the effect of ensuring dispersion and wetting, good mechanical properties, and good self-defoaming performance

Active Publication Date: 2016-12-14
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the temperature resistance requirements of new motors for potting products are getting higher and higher, traditional epoxy potting compounds can no longer meet the temperature resistance requirements, while traditional addition-type silicone potting compounds can meet the application requirements in terms of temperature

Method used

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  • High-heat-conductive and high-adhesion-strength organic silicon pouring sealant, preparation method thereof, and method therewith for sealing end portion of motor
  • High-heat-conductive and high-adhesion-strength organic silicon pouring sealant, preparation method thereof, and method therewith for sealing end portion of motor
  • High-heat-conductive and high-adhesion-strength organic silicon pouring sealant, preparation method thereof, and method therewith for sealing end portion of motor

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Effect test

Embodiment 1

[0038] A silicone potting compound with high thermal conductivity and high bonding strength according to the present invention, comprising component A and component B with a mass ratio of 1:1, wherein component A is mainly prepared by mixing the following raw materials:

[0039] Vinyl silicone oil (the mass content of vinyl is 0.32%, viscosity is 1000mPa.S) 90g,

[0040] Hydrogen-containing silicone oil (the mass content of hydrogen is 0.5%) 10g,

[0041] Inhibitor (1-ethynylcyclohexanol) 0.1g,

[0042] MQ silicone resin (containing vinyl MQ silicone resin, M / Q is 0.5~1.5) 10g,

[0043] Silicone coupling agent (glycidyl ether oxypropyl trimethoxysilane) 1g,

[0044] Surfactant (FS-60) 1g,

[0045] Fumed silica 0.5g;

[0046] Thermally conductive filler (a mixture of spherical alumina with a particle size of 10-30um and spherical aluminum nitride with a particle size of 0.1-10um, wherein both spherical alumina and spherical aluminum nitride have been treated with a silane cou...

Embodiment 2

[0064] A silicone potting compound with high thermal conductivity and high bonding strength according to the present invention, comprising component A and component B with a mass ratio of 0.97:1, wherein component A is mainly prepared by mixing the following raw materials:

[0065] Vinyl silicone oil (the mass content of vinyl is 0.25%, viscosity is 3000Pa·S) 80g,

[0066] Hydrogen-containing silicone oil (the mass content of hydrogen is 0.18%) 15g,

[0067] Inhibitor (1-ethynyl cyclohexanol) 0.15g,

[0068] MQ silicone resin (containing vinyl MQ silicone resin, M / Q is 0.85) 10g,

[0069] Siloxane coupling agent (aminopropyltriethoxysilane) 1g,

[0070] Thermally conductive filler (a mixture of spherical alumina with a particle size of 10-30um and spherical aluminum nitride with a particle size of 0.1-10um, wherein both spherical alumina and spherical aluminum nitride have been treated with a silane coupling agent) 400g,

[0071] Surfactant (FS-60) 1g,

[0072] Fumed silic...

Embodiment 3

[0090] A silicone potting compound with high thermal conductivity and high bonding strength according to the present invention, comprising component A and component B with a mass ratio of 0.98:1, wherein component A is mainly prepared by mixing the following raw materials:

[0091] Vinyl silicone oil (the mass content of vinyl is 0.32%, viscosity is 1000mPa·S) 100g,

[0092] Hydrogen-containing silicone oil (the mass content of hydrogen is 0.18%) 25g,

[0093] Inhibitor (1-ethynyl cyclohexanol) 0.15g,

[0094] MQ silicone resin (containing vinyl MQ silicone resin, M / Q is 0.5) 15g,

[0095] Silicone coupling agent (glycidyl ether oxypropyl trimethoxysilane) 1g,

[0096] Thermally conductive filler (a mixture of spherical alumina with a particle size of 10-30um and spherical aluminum nitride with a particle size of 0.1-10um, wherein both spherical alumina and spherical aluminum nitride have been treated with a silane coupling agent) 400g;

[0097] Surfactant (FS-60) 1g

[00...

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Abstract

A high-heat-conductive and high-adhesion-strength organic silicon pouring sealant includes a component A and a component B, wherein the component A is mainly prepared by mixing the raw materials including, by weight, 50-150 parts of vinyl silicon oil, 0.1-10 parts of hydrogen-containing silicon oil, 0.1-1 part of an inhibitor, 1-30 parts of MQ silicone resin, 0.1-10 parts of a silane coupling agent, 0.1-10 parts of fumed silica, 0.1-10 parts of a surfactant, and 50-400 parts of a heat-conductive filler; and the component B is mainly prepared by mixing the raw materials including, by weight, 10-200 parts of vinyl silicon oil, 0.1-1 part of a catalyst, 0.1-10 parts of a tackifier, 0.1-10 parts of fumed silica, 0.1-10 parts of the surfactant, and 50-400 parts of the heat-conductive filler. The organic silicon pouring sealant has high adhesion strength, high heat conductivity, good mechanical performance and excellent electric performance.

Description

technical field [0001] The invention belongs to the technical field of preparation, and in particular relates to a silicone potting glue with high thermal conductivity and high bonding strength, a preparation method thereof, and a method for encapsulating the end of a motor. Background technique [0002] Silicone potting adhesive refers to a type of electronic potting adhesive made of silicone rubber, which has excellent temperature resistance, waterproof and electrical insulation properties. When it is potted with electronic components, it can play the role of moisture-proof, dust-proof, corrosion-proof and shock-proof, and improve the performance and stable parameters. In addition to the above excellent properties, the addition-type silicone potting compound also has the characteristics of no by-products during the vulcanization process, low shrinkage, deep vulcanization, and simple process. It is an ideal base material for potting compounds for electronic appliances. [...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06C09J11/08H02K15/12
CPCC08K2201/003C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J183/04H02K15/12C08L83/04C08K13/06C08K9/06C08K2003/2227C08K2003/282
Inventor 黎超华曾亮田宗芳侯海波李鸿岩姜其斌
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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