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a solder paste

A solder paste and solder powder technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of appearance, halogen residual appearance, temperature difference, etc., to reduce the amount of residual after welding, solder joints Transparent and beautiful appearance

Active Publication Date: 2019-11-08
苏州恩斯泰金属科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the problems existing in the prior art, the present invention provides a solder paste, which solves the problems of poor temperature resistance, halogen residue and beautiful appearance, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1 Solder Paste Components

[0027] Solder paste components include: alloy SAC305 (Sn96.5, Ag3.0, Cu0.5), powder diameter 20-38μm (T4), or powder diameter 25-45μm (T3), according to weight percentage: spherical solder powder 88.5%, flux 11.5%,

[0028] Among them, 11.5% of the flux contains by weight: 40% of polymerized rosin, 4.5% of acrylic modified rosin, 28% of diethylene glycol monohexyl ether, 12% of 2-ethyl-1,3-hexanediol , 5% thixotropic agent (composed of 2% beeswax, 3% stearic acid amide), 2% (4-cyanobenzoic acid), 6% succinic acid, 3% azelaic acid, 2.5% benzotriazole .

[0029] Wherein, the 40% polymerized rosin and 4.5% acrylic acid modified rosin can be replaced with any one of hydrogenated rosin, disproportionated rosin and synthetic resin or a combination thereof.

[0030] Wherein, the combination of 28% diethylene glycol monohexyl ether and 12% 2-ethyl-1,3-hexanediol can be replaced by diethylene glycol octyl ether, diethylene glycol butyl ethe...

Embodiment 2

[0033] Example 2 Solder Paste Components

[0034] The components of the solder paste include: alloy (Sn90 antimony 10, or Sn80 antimony 20), powder diameter 20-38μm (T4) or powder diameter 25-45μm (T3), by weight: spherical solder powder 89%, flux 11%,

[0035] Among them, 11% of flux components include by weight: 35% polymerized rosin, 4.5% acrylic modified rosin, 20% diethylene glycol monohexyl ether, 8% 2-ethyl-1,3-hexanediol , 10% thixotropic agent (composed of 4% beeswax, 6% stearic acid amide), 4% (2% 4-cyanobenzoic acid), 6% phthalic acid, 3% azelaic acid, 2.5% benzene Parallel triazole.

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PUM

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Abstract

The invention discloses soldering paste. According to the technical scheme of the invention, the soldering paste comprises the following components: soldering powder and soldering flux, wherein the mass ratio of the soldering powder to the soldering flux is (88-89):(11-12); the soldering flux comprises 30 to 50 percent by weight of rosin, 20 to 40 percent by weight of a solvent, 5 to 10 percent by weight of a thixotropic agent and 0 to 15 percent by weight of an active agent, and also comprises 0 to 5 percent by weight of additives. The soldering paste provided by the invention meets the requirements of the European Union RoHS and realizes the halogen-free requirement of the soldering flux; the problems that the ordinary halogen-free soldering pate has low temperature resistance and the active agent is easy to decompose are solved; the problem of residual yellowing caused by imidazole active agents is solved; the residual amount of the soldering flux after welding is reduced and a welding point has transparent and beautiful appearance.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a solder paste. Background technique [0002] With the development of electronic technology, surface mount technology plays an increasingly important role in electronic assembly technology, and solder paste is the most important auxiliary material that bears the brunt of the development of electronic technology, especially surface mount technology. one. Especially with the development of electronic technology in China in recent years, in the field of high-end and high-density assembly, such as: high-end mobile phones, precision instruments, military products, etc. in the printed circuit board manufacturing process, solder paste has changed from lead to lead-free, from lead-free. To halogen-free, domestic solder paste manufacturers have grown in cooperation and competition with international brands. Lead-free solder paste has broken through many bottlenecks in materia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3613
Inventor 凡青松
Owner 苏州恩斯泰金属科技有限公司
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