Solid flux for automatic soldering of soldering tin and preparation method thereof

A soft soldering and automatic welding technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor mechanical and electrical properties of circuit boards, poor wetting performance, rough appearance of solder joints, etc., and achieve the goal of manufacturing The method is simple and reasonable, the welding reliability is good, and the effect of wetting is good

Inactive Publication Date: 2017-01-04
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, when the automatic soldering machine solders delicate electronic products such as circuit boards, the existing fluxes often have low activity and poor wetting effect. When applied to solder wire, there are the following disadvantages: rough appearance of solder jo

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0020] Embodiment 1: The solid flux for automatic soldering provided in this embodiment includes the following components by weight percentage: 80% deionized water, 10% cosolvent, 7% active agent, and non-ionic surface Active agent 1.2%, film former 1.4%, corrosion inhibitor 0.4%. Non-ionic surfactants are alkylphenol polyoxyethylene ether 0.3% and fatty alcohol polyoxyethylene ether 0.9%, which have high stability and are not easily affected by the presence of strong electrolytes, and are not easily affected by acids and alkalis. They are in water It has good solubility in organic solvents and high stability in solution. Non-ionic surfactants have good hard water resistance, low foaming, dispersion, emulsification, wetting, and solubilization. The base phenol polyoxyethylene ether is preferably OP-10, that is, nonylphenol polyoxyethylene ether nonionic surfactant, which is easily soluble in water, with a PH value of 6-7, good wetting performance, and good cleaning and wetting....

Example Embodiment

[0025] Embodiment 2: The solid flux for automatic soldering and its preparation method provided in this embodiment are basically the same as Embodiment 1, except that:

[0026] The solid flux used for automatic soldering of the present embodiment is calculated by weight percentage and includes the following components: 83% deionized water, 9% cosolvent, 6.5% active agent, 0.4% non-ionic surfactant, Film agent 0.9%, corrosion inhibitor 0.2%. Among them, the non-ionic surfactant is 0.2% of alkylphenol polyoxyethylene ether and 0.2% of fatty alcohol polyoxyethylene ether AEO; the co-solvent is composed of the following components by weight percentage: ethanol 6%, 1,2-di Hydroxypropane 0.4%, triethanolamine 1%, N-(2-hydroxyethyl)ethylenediamine 0.5%, tetrahydroxyethylethylenediamine 1.1%; the active agent is composed of the following components by weight percentage: 2-hydroxyl Propionic acid 0.4%, 1,2-ethane dicarboxylic acid 1.1%, 1,3-acetone dicarboxylic acid 0.6%, undecane dicarb...

Example Embodiment

[0029] Embodiment 3: The solid flux for automatic soldering and its preparation method provided in this embodiment are basically the same as Embodiment 1, except that:

[0030] The solid flux used for automatic soldering of the present embodiment is calculated by weight percentage and includes the following components: deionized water 82.7%, cosolvent 9.1%, active agent 5.5%, non-ionic surfactant 1.2%, composition Film agent 1.2%, corrosion inhibitor 0.3%. Among them, non-ionic surfactants are alkylphenol polyoxyethylene ether 0.5% and fatty alcohol polyoxyethylene ether 0.7%; the co-solvent is composed of the following components by weight percentage: ethanol 5%, 1,2-di Hydroxypropane 1.1%, triethanolamine 0.8%, N-(2-hydroxyethyl)ethylenediamine 1%, tetrahydroxyethylethylenediamine 1.4%; the active agent is composed of the following components by weight percentage: 2-hydroxyl Propionic acid 0.5%, 1,2-ethane dicarboxylic acid 0.9%, 1,3-acetone dicarboxylic acid 0.5%, undecane di...

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Abstract

The invention discloses a solid flux for automatic soldering of soldering tin, prepared from the following components by weight percent: 80-86% of deionized water, 4.5-10% of co-solvents, 4-7% of active agents, 0.4-1.2% of nonionic surfactants, 0.9-1.4% of film-forming agents and 0.2-0.4% of corrosion inhibitors. The active agents are prepared from the following components: 0.3-0.7% of 2-hydroxypropanoic acid, 0.7-1.3% of 1,2-ethane dicarboxylic acid, 0.4-0.8% of 1,3-acetone dicarboxylic acid, 0.6-1% of undecanedioic acid, 0.5-0.8% of malonic acid, 1-1.8% of polyethylene glycol PEG-200 and 0.5-1% of succinimide. Compared with the prior art, the solid flux is a water-based flux used for solving problems of no continuous soldering or pinholes of tin soldering of precision circuit boards, has the advantages of good soldering firmness, environmental protection performance and safety, high activity, excellent wettability, low corrosion and low cost, is simple and convenient to prepare, can be operated at room temperature, has low requirements for equipment and has a good application prospect.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a solid flux for automatic soldering and a preparation method thereof. Background technique [0002] The automatic soldering machine is more and more favored by consumers because of its high level of automation, no loss of materials, replacement of manual soldering, soldering at any angle without dead ends, and low power consumption of the equipment. The performance of the flux selected for soldering (also known as soldering) directly affects the efficiency and quality of soldering. At present, when the automatic soldering machine solders delicate electronic products such as circuit boards, the existing fluxes often have low activity and poor wetting effect. When applied to solder wire, there are the following disadvantages: rough appearance of solder joints, small expansion rate, and large wetting angle. , Spreading is not open, it is easy to produce cracks, pinholes, soldering, e...

Claims

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Application Information

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IPC IPC(8): B23K35/363
CPCB23K35/362B23K35/3612
Inventor 黄守友叶桥生黄义荣林成在曹建平黄信元袁小刚
Owner THOUSAND ISLAND METAL FOIL
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