Preparation method and preparation technology of efficient PERC crystalline silicon solar cell
A solar cell and preparation technology, applied in sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems affecting battery efficiency, leakage, etc., to improve appearance, increase minority carrier life, and reduce electronic effects Effect
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Embodiment 1
[0028] Embodiment 1: Take 800pcs polysilicon wafers, adopt liquid volume ratio to be HNO 3 : The rich nitric acid system of HF=4:1 prepares suede with a weight reduction of 0.3-0.4g; the volume ratio of the solution is HNO 3 : The rich nitric acid system of HF=10:1 carries out acid polishing to make the reflectivity of the back surface reach 27-35%; when diffusing, take 400pcs respectively for single-sided diffusion and double-sided diffusion, and use POCl 3 As a phosphorus source, a two-step diffusion method is adopted, the deposition and advancement time are 15min and 13min respectively, and the diffusion temperature is about 830°C; the volume ratio of the solution after mixing is HNO 3 : HF = 10:1 etching groove to remove the PN junction on the edge and the back; through atomic layer deposition (ALD) aluminum oxide film on the back, the deposition thickness is about 10nm; and then PECVD silicon nitride on the back, the deposition thickness is 70-90nm; Then laser grooved, t...
Embodiment 2
[0029] Example 2: Take 800pcs of monocrystalline silicon wafers, pass through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, make texture for 1100s, and a temperature of 80°C to prepare a textured surface with a weight reduction of 0.4-0.8g; The volume ratio of dosing solution is HNO 3 : The rich nitric acid system of HF=10:1 carries out acid polishing to make the reflectivity of the back surface reach 27-35%; when diffusing, take 400pcs respectively for single-sided diffusion and double-sided diffusion, and use POCl 3 As a phosphorus source, a two-step diffusion method is adopted, the deposition and advancement time are 15min and 13min respectively, and the diffusion temperature is about 830°C; the volume ratio of the solution after mixing is HNO 3 : HF = 10:1 etching groove to remove the PN junction on the edge and the back; through atomic layer deposition (ALD) aluminum oxide film on the back, the deposition thickness is about 10nm; and then PECVD silicon n...
Embodiment 3
[0030]Example 3: Take 800pcs of monocrystalline silicon wafers, prepare a textured surface with a weight removal of 0.4-0.8g through an alkali tank with a liquid volume ratio of NaOH:Addition=4:1, a texturing time of 1100s, and a temperature of 80°C; After the PE mask, carry out alkali polishing to make the reflectivity of the back surface reach 30-40%, and remove the mask through the HF tank; when diffusing, take 400pcs for single-sided diffusion and double-sided diffusion respectively, and use POCl 3 As a phosphorus source, a two-step diffusion method is adopted, the deposition and advancement time are 15min and 13min respectively, and the diffusion temperature is about 830°C; the volume ratio of the solution after mixing is HNO 3 : HF = 10:1 etching groove to remove the PN junction on the edge and the back; through atomic layer deposition (ALD) aluminum oxide film on the back, the deposition thickness is about 10nm; and then PECVD silicon nitride on the back, the deposition ...
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