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Passive circuit suitable for microwave and millimeter-wave integrated system

An integrated system and microwave circuit technology, applied in circuits, electrical components, waveguide-type devices, etc., can solve the problems that limit the application frequency and miniaturization development of multi-chip integrated packaging, and it is difficult to realize the integration and miniaturization of microwave and millimeter wave systems. Serious coupling problems, to achieve good signal interconnection effect, good signal isolation effect, good system function effect

Active Publication Date: 2017-01-25
合肥芯谷微电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since existing microwave integrated circuits and system packages mostly use open-cavity semi-open structures such as microstrips, coplanar waveguides, and gold wire bonding based on planar printed circuit board (PCB) technology,
When microwave signals are interconnected, the electromagnetic coupling is serious, the radiation loss is large, and the signal crosstalk is obvious, which seriously limits the application frequency and miniaturization development of multi-chip integrated packaging.
Therefore, it is difficult to realize the integration and miniaturization of microwave and millimeter wave systems with the signal interconnection technology of the existing planar process

Method used

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Examples

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Embodiment 1

[0085] Now in conjunction with example, accompanying drawing, the present invention will be further described. It should be understood that this example is only used to illustrate the present invention, but not to limit the applicable scope of the present invention. After reading the present invention, modifications to various equivalent forms of the present invention by those skilled in the art fall within the scope defined by the appended claims of the present application.

example 1

[0086] Example 1: Application design of vertical micro-coaxial structure in the field of 24GHz wireless communication-microwave integrated circuits

[0087] The present invention adopts the following technical solutions: the 24GHz integrated circuit has a multi-layer structure, the digital signal is in the middle layer circuit, and the microwave signal is in the uppermost layer and the lowermost layer, such as Figure 8 shown. The vertical micro-coaxial structure is used to longitudinally interconnect the microwave signal of the uppermost layer and the microwave signal of the lowermost layer, so that the microwave circuit layer can be superimposed vertically, which improves the integration of the circuit and optimizes the quality of signal transmission. In the design of microwave integrated circuits, the microwave signals of the upper and lower layers are introduced into the edge of each layer through horizontal micro-coaxial or other transmission lines, and the vertical micro...

Embodiment 2

[0090] Application Design of Micro-coaxial Power Divider Structure in 24GHz Wireless Communication Field-Microwave Integrated Circuit

[0091] The invention adopts the following technical scheme: on the microwave signal layer on the upper surface of the 24GHz integrated circuit, the input signal is divided into two channels of equal amplitude and in-phase power distribution by using a micro-coaxial power divider. The digital signal is in the middle layer circuit, and the microwave signal is in the uppermost layer and the lowermost layer, such as Figure 8 shown. The Y-shaped power divider is designed with appropriate inner and outer conductor sizes, so that the power divider has a good power distribution effect and impedance matching effect in the 24GHz frequency band. The power distribution efficiency is higher than 90%, and the amplitude and phase errors are less than 1%. High-efficiency distribution of microwave signals and good microwave signal shielding performance, the ...

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Abstract

Aiming at defects of an existing millimeter-wave circuit connection technology, the invention discloses a passive circuit suitable for a microwave and millimeter-wave integrated system. The passive circuit comprises a microwave circuit board, a microwave device and a microwave lead, wherein the working frequency of the microwave device is 30-60GHz, the impedance of the microwave lead is 40-60ohm, the loss of every millimeter unit of height of the microwave lead is smaller than 0.1dB, and the signal isolation degree is greater than 80dB. The microwave lead is a conductor for transmitting microwave and millimeter-wave signals. The microwave lead comprises vertical interconnected structure lines and a Y-type power divider. The passive circuit has the following beneficial effects: the passive circuit disclosed by the invention, based on a three-dimensional microwave and millimeter wave integrated circuit design, comprises a vertical coaxial structure and a micro coaxial power divider. The passive circuit disclosed by the invention has a good signal interconnection effect and a good signal isolation effect, the full-band signal interconnection insertion loss is smaller than 0.1dB / mm, the inter-chip signal isolation degree is greater than -65dB, and the electromagnetic energy leakage during signal transmission is smaller than -86dB.

Description

technical field [0001] The invention belongs to the field of microwave integrated circuits and systems, in particular to a passive circuit suitable for microwave and millimeter wave integrated systems. Background technique [0002] In recent years, the development of microwave and millimeter-wave circuit integrated chips has greatly promoted the multi-function and miniaturization of microwave systems, and at the same time put forward higher requirements for chip integration and system packaging (SIP). Microwave and millimeter-wave transmission lines and feeders require Higher frequency, lower loss, and higher isolation. However, in existing microwave integrated circuits and system packages, open-cavity semi-open structures such as microstrips, coplanar waveguides, and gold wire bonding based on planar printed circuit board (PCB) technology are often used. When microwave signals are interconnected, the electromagnetic coupling is serious, the radiation loss is large, and the...

Claims

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Application Information

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IPC IPC(8): H01P5/16
CPCH01P5/16
Inventor 桑磊徐余龙施雨芮金城李祥祥李佩戴跃飞马强
Owner 合肥芯谷微电子股份有限公司
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