Passive circuit suitable for microwave and millimeter-wave integrated system
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 合肥芯谷微电子股份有限公司
- Publication Date
- 2017-01-25
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Abstract
Description
technical field
[0001] The invention belongs to the field of microwave integrated circuits and systems, in particular to a passive circuit suitable for microwave and millimeter wave integrated systems. Background technique
[0002] In recent years, the development of microwave and millimeter-wave circuit integrated chips has greatly promoted the multi-function and miniaturization of microwave systems, and at the same time put forward higher requirements for chip integration and system packaging (SIP). Microwave and millimeter-wave transmission lines and feeders require Higher frequency, lower loss, and higher isolation. However, in existing microwave integrated circuits and system packages, open-cavity semi-open structures such as microstrips, coplanar waveguides, and gold wire bonding based on planar printed circuit board (PCB) technology are often used. When microwave signals are interconnected, the electromagnetic coupling is serious, the radiation loss is large, and the...