Tinned carbon nanomaterial reinforced compound solder alloy and solder paste thereof

A technology of carbon nanomaterials and enhanced compounding, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve the problem of non-wetting between carbon nanomaterials and solder matrix

Active Publication Date: 2017-02-01
YIK SHING TAT SOLDER MFR KUNSHAN +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above technical problems, the present invention discloses a tin-plated carbon nanomaterial reinforced composite solder alloy and its solder paste, which improves the creep resistance of the tin-based solder alloy and its solder paste; its preparation method adopts ultrasonic action at low temperature The local tin coating on the surface of carbon nanomaterials can be realized, and the problem of non-wetting between the carbon nanomaterials and the solder matrix is ​​solved. The carbon nanomaterials in the prepared solder paste are evenly distributed, and the process is simple, reliable, strong adaptability and low cost.

Method used

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  • Tinned carbon nanomaterial reinforced compound solder alloy and solder paste thereof
  • Tinned carbon nanomaterial reinforced compound solder alloy and solder paste thereof
  • Tinned carbon nanomaterial reinforced compound solder alloy and solder paste thereof

Examples

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Embodiment 1

[0055] The material composition of the tin-plated carbon nanomaterial reinforced composite solder paste of the present embodiment comprises tin-based solder powder of commercially available No. 5 Sn52Bi, multi-walled carbon nanotubes, and rosin-type flux composition, and the total mass is 50g; wherein, the tin The particle size of the base solder powder is 15-25 μm, the inner diameter of the multi-walled carbon nanotube is 3-5nm, the outer diameter is 8-15nm, and the length is 3-12um; the components of the tinned carbon nanomaterial reinforced composite solder paste are calculated as :

[0056] Tin-based solder powder 89.95%

[0057] Multi-walled carbon nanotubes 0.05%

[0058] Rosin type flux 10%

[0059] Adopt following preparation method to prepare:

[0060] (1) Place the multi-walled carbon nanotubes in acetone and apply ultrasonic cleaning for 10 minutes, and repeat 5 times.

[0061] (2) The cleaned multi-walled carbon nanotubes were uniformly mixed with tin-based sol...

Embodiment 2

[0067] The tinned carbon nanomaterial-reinforced composite solder paste of this embodiment is composed of commercially available No. 3 Sn64Bi35Ag1 tin-based solder powder, single-walled carbon nanotubes, graphene, and rosin-type flux, with a total mass of 50 g. Wherein, the commercially available No. 3 Sn64Bi35Ag1 tin-based solder powder has a particle size of 25-45 μm, and the single-walled carbon nanotubes have an inner diameter of 0.8-1.6 nm, an outer diameter of 1-2 nm, and a length of 1-2 um. The components of the tin-plated carbon nanomaterial reinforced composite solder paste are calculated by mass fraction as:

[0068]

[0069] Adopt following preparation method to prepare:

[0070] (1) Mix single-walled carbon nanotubes and graphene uniformly according to the mass ratio of 1:1 to obtain mixed carbon nanomaterials, place the mixed carbon nanomaterials in alcohol and apply ultrasonic cleaning for 8 minutes, and repeat 3 times.

[0071] (2) The cleaned carbon nanomat...

Embodiment 3

[0077] The tin-plated carbon nanomaterial reinforced composite solder paste of this embodiment is composed of tin-based solder powder, graphene, and rosin-type flux of commercially available No. 4 Sn0.7Cu, with a total mass of 50g, wherein commercially available No. 4 Sn0. The particle size of 7Cu tin-based solder powder is 20-28μm. The components of the tin-plated carbon nanomaterial reinforced composite solder paste are calculated by mass fraction as:

[0078]Tin-based solder powder 90.18%

[0079] Graphene 0.018%

[0080] Rosin type flux 9.80%

[0081] Adopt following preparation method to prepare:

[0082] (1) Place the graphene in acetone and apply ultrasound to clean it. The ultrasonic cleaning time is 5 minutes, and it is repeated 4 times.

[0083] (2) The cleaned graphene was uniformly mixed with tin-based solder powder at a mass ratio of 1:7 by mechanical stirring, and the composite solder powder was placed in a crucible and rapidly heated to 260°C, and left to st...

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Abstract

The invention provides tinned carbon nanomaterial reinforced compound solder alloy and solder paste thereof. The tinned carbon nanomaterial reinforced compound solder alloy comprises, by weight, 84-95 parts of tin-based solder, 0.01-0.2 part of carbon nanomaterials and 5-15 parts of soldering flux. By the adoption of the technical scheme, the creep resistance, electrical conductivity and thermal aging resistance of soldered dots generated by the tinned carbon nanomaterial reinforced compound solder alloy and the solder paste thereof are improved. The carbon nanomaterials in the prepared solder paste are uniform in distribution, the process is simple and reliable, adaptability is high, and cost is low.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to a tinned carbon nanometer material reinforced composite solder alloy and its solder paste. Background technique [0002] In recent years, semiconductor devices have gradually developed towards the direction of miniaturization, high density, and high power. Especially, the application of third-generation semiconductor materials represented by SiC and GaN has gradually matured, making the use temperature of semiconductor devices higher and higher. The operating temperature of the third-generation semiconductor devices can reach up to 150-200°C, which poses a severe challenge to the packaging materials of semiconductor devices. New thermal interface materials such as nano-silver paste, nano-copper paste and other materials have their own defects, and their applications are not yet mature. At present, the thermal interface material used in most fields is still ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/3601B23K35/40
Inventor 肖勇杨明吴建新吴建雄苏培燕
Owner YIK SHING TAT SOLDER MFR KUNSHAN
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