Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultra-thin resin dicing blade for QFN high-quality cutting and preparing method of ultra-thin resin dicing blade

A high-quality, resin-based technology, used in the manufacture of tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problem of low strength and hardness of ordinary metal powder, which is not suitable for making ultra-thin cutting discs, and ultra-thin cutting discs are easy to deform To achieve the effects of easy implementation, increasing self-sharpening ability and strengthening the characteristics of raw materials

Active Publication Date: 2017-02-08
苏州赛尔科技有限公司
View PDF6 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary metal powder has low strength and hardness, is easy to deform when preparing ultra-thin cutting sheets, has a very low pass rate, and is easy to break when used. It is not suitable for manufacturing ultra-thin cutting sheets below 50 microns, and cannot meet the requirements of industrial production.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: The composition of the ultra-thin resin dicing knife for QFN high-quality cutting provided in this example is as follows in terms of volume fraction: 12.5% ​​diamond, 52% resin binder (epoxy resin powder), 16% silicon carbide, Graphite 8% and chromium oxide 11.5%, the preparation method steps are as follows:

[0023] 1) Mixing: Diamond, resin bond, silicon carbide, graphite and chromium oxide, which are accurately weighed according to the predetermined volume fraction, are wetted with a wetting agent, passed through a 200# screen, and put into a container for molding spare material;

[0024] 2) Hot pressing molding: Slowly put the molding material in step 1) into the mold cavity, scrape it gently with a scraper, transfer the mold to the center of the hydraulic press platform with the temperature of the upper and lower heads both at 170°C, and apply a pressure of 500KN. Press in a vacuum environment, and obtain a semi-finished green body after hot pressing fo...

Embodiment 2

[0028] Embodiment 2: The composition of the ultra-thin resin dicing knife for QFN high-quality cutting provided by this embodiment is as follows in terms of volume fraction: 16.5% diamond, 40% resin binder (epoxy resin powder), 25% silicon carbide, Graphite 5% and chromium oxide 13.5%, the preparation method steps are as follows:

[0029] 1) Mixing: Diamond, resin bond, silicon carbide, graphite and chromium oxide, which are accurately weighed according to the predetermined volume fraction, are wetted with a wetting agent, passed through a 200# screen, and put into a container for molding spare material;

[0030] 2) Hot pressing molding: Slowly put the molding material in step 1) into the mold cavity, scrape it gently with a scraper, transfer the mold to the center of the hydraulic press platform with the temperature of the upper and lower heads at 200°C, and apply a pressure of 600KN. Press in a vacuum environment, and obtain a semi-finished green body after hot pressing for...

Embodiment 3

[0034] Embodiment 3: The composition of the ultra-thin resin dicing knife for QFN high-quality cutting provided by this embodiment is as follows in terms of volume fraction: 18.5% diamond, 50% resin binder (epoxy resin powder), 15% silicon carbide, Graphite 8% and chromium oxide 8%, the preparation method steps are as follows:

[0035] 1) Mixing: Diamond, resin bond, silicon carbide, graphite and chromium oxide, which are accurately weighed according to the predetermined volume fraction, are wetted with a wetting agent, passed through a 200# screen, and put into a container for molding spare material;

[0036] 2) Hot pressing molding: Slowly put the molding material in step 1) into the mold cavity, gently scrape it with a scraper, transfer the mold to the center of the hydraulic press platform with the temperature of the upper and lower heads both at 170°C, and apply a pressure of 520KN. Press in a vacuum environment, and obtain a semi-finished green body after hot pressing f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses an ultra-thin resin dicing blade for QFN high-quality cutting. Burdening of the ultra-thin resin dicing blade comprises a resin bond, diamond and inorganic filler, wherein the volume fraction of the diamond ranges from 12.5% to 30%, the grain size of the diamond ranges from 38 microns to 104 microns, and the volume fraction of the resin bond ranges from 35% to 55%. The inorganic filler is composed of silicon carbide, graphite and chromic oxide, the silicon carbide accounts for 6%-25% of the volume fraction of the total burdening, the graphite accounts for 3%-8% of the volume fraction of the total burdening, and the chromic oxide accounts for 5%-15% of the volume fraction of the total burdening. In the formula, the strength of the dicing blade can be greatly improved through the silicon carbide and the chromic oxide in the formula, meanwhile, the service life of the dicing blade is prolonged, a small amount of graphite is used for assistance, the self-sharpening capability of the blade can be improved, and good cutting quality and stability of the blade are kept. The invention further discloses a preparing method of the above dicing blade. The preparing method comprises the steps that raw materials are mixed through a wetting agent, and hot pressing, secondary curing and machining are conducted. The process is simple, the characters of the raw materials can be brought into full play, and the efficient, high-quality and ultra-thin resin dicing blade suitable for QFN cutting is prepared.

Description

technical field [0001] The invention relates to an ultra-thin resin scribing knife for QFN high-quality cutting and a preparation method thereof. Background technique [0002] The known ultra-thin resin scribing knife is mainly made of resin binder and artificial diamond particles mixed by hot pressing and sintering, in addition to having the characteristics of diamond (high hardness, high compressive strength, good wear resistance) In addition, it also has high cutting ability unique to resin bond, and has high precision cutting ability. Uses: Used for processing high-load and difficult-to-cut materials; used for processing various materials in the electronics industry and electronic information industry, becoming an ideal tool for cutting hard and brittle semiconductor materials and hard alloys. [0003] In the prior art, the resin-based diamond cutting discs prepared with resin powder as the matrix have shortcomings such as short life, insufficient precision, slow cuttin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28B24D3/34B24D5/12B24D18/00
Inventor 冉隆光王丽萍李威
Owner 苏州赛尔科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com