Intelligent control system and control method of fitted packaging of LED by organic silicone resin light conversion body based on rolling

Abstract

The invention relates to an intelligent control system of fitted packaging of an LED by an organic silicone resin light conversion body based on rolling. The system is characterized in that the system at least comprises process detection units used for a rolling fitted molding process, a curing molding process, and a finished product cutting process of rolling fitted packaging of the LED by the organic silicone resin light conversion body, a central control device, and process driving units; and the central control device is connected with the process detection units and the process driving units in a signal manner, and used for receiving state information of each process detection unit in real time and processing operation information for real-time regulation and control of the process driving units. The system is advantageous in that the process of rolling fitted packaging of the LEDs can be detected and controlled, the requirement of the process and an equipment system applicable to fitted packaging of the LEDs by the organic silicone resin light conversion body can be met, and the production efficiency and the yield of industrial and batch packaging of the LEDs are increased.

Description

technical field [0001] The invention belongs to the technical field of intelligent control of LEDs encapsulated by light conversion bodies, and in particular relates to an intelligent control system and control method based on a rolling type organic silicon resin light conversion body vacuum bonding and packaging LEDs. Background technique [0002] LED has the advantages of high brightness, low heat, long life, environmental protection, renewable utilization, etc., and is called the most promising new generation of green lighting source in the 21st century. At present, although the theoretical life of LEDs can reach more than 100,000 hours, in actual use, due to the constraints of various factors such as chip failure, packaging failure, thermal overstress failure, electrical overstress failure or / and assembly failure, among them Package failure is particularly prominent, which makes LEDs prematurely experience light decay or light failure, which will hinder the progress of L...

AI Technical Summary

Problems solved by technology

Although this method improves the uniformity of the coating thickness of the light conversion body through the screen printing process, and improves the uniformity of the phosphor particle distribution, so as to achieve the purpose of improving the yield; but there are still the following obvious deficiencies: one is that the screen printing The light converter of silicone resin is coated on the surface of the LED chip, and then due to the influence of thermal overstress during the baking and curing process, it will still cause local bubbles to form on the coating surface of the light converter coating and the LED chip to form unevenness The second is to fill the sealing mold or the lens cover with silica gel and package the LED chip coated with the light conversion body, and then the overall structure is baked and cured due to the influence of thermal overstress, which will still cause cracks in the sealing mold or lens cover. Bubbles are generated locally on the silicone surface layer to form uneven defects

The purpose of this method is to provide light converters uniformly arranged around the LED to prevent damage, so as to obtain an LED covered with a light converter layer and an LED device with the LED covered with a light converter layer; but there are also the following obvious Disadvantages: First, during the curing process of the fluorescent resin composition of the light conversion body, due to the influence of thermal overstress, it will still cause local bubbles to form on the surface layer of the light conversion body to form uneven defects; LEDs will still be affected by thermal overstress, resulting in a decrease in light efficiency during use of the LED; third, the process in the entire packaging process is relatively cumbersome, and the production efficiency of the packaged LED is not high; The displacement of the chip, and there is no intelligent control system for precise control, will inevitably lead to a decrease in the yield rate

Although the purpose of the invention of this solution is to improve the color and brightness uniformity, ease of manufacture, and degree of freedom of design of the semiconductor light-emitting element attached with the resin layer containing the light conversion body through the resin sheet laminate, But there are still the following obvious deficiencies: one is that the light conversion body resin sheet used is a cured light conversion body resin sheet, which will not be able to effectively eliminate the possible residual pores, unevenness or other processing defects; In the process, pressing the pressure tool from the side of the semiconductor light-emitting element will damage the semiconductor light-emitting element; the third is to use the adhesive bonding process in the resin layer of the light conversion body, which is difficult to remove the bonded semiconductor. Residues in the light-emitting element, the bonding process is prone to produce pores, which will reduce the yield rate. At the same time, the existence of the adhesive layer also reduces the light-emitting efficiency of the LED element; the fourth is the light conversion of the light-emitting surface of the semiconductor light-emitting element. The base material of the bulk resin sheet is not peeled off, which directly affects the light efficiency of the semiconductor light-emitting element; fifth, the light-converting resin layer is presented in a manner in which multiple blocks are repeatedly arranged in rows in the length direction, but to realize the light conversion The configuration of multiple blocks of the bulk resin layer, the actual operation procedure is cumbersome, will affect the packaging efficiency of the entire component, and the layout error of multiple blocks will directly affect the accuracy of subsequent bonding with the light-emitting element, while If the size and thickness of multiple blocks cannot meet the consistency requirements, it may cause serious product consistency problems

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