Superhigh temperature-resistant adhesive based on liquid polycarbosilane ceramic precursor and preparation method thereof

A technology of ceramic precursor and polycarbosilane, which is applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of poor bonding performance, material corrosion, poor thermal shock resistance, etc., and achieve good heat dissipation. Stability, high shear strength, and high temperature resistance

Inactive Publication Date: 2017-03-15
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inorganic adhesives mainly include silicates, phosphates, and aluminosilicates. These adhesives have excellent high temperature resistance and can be widely used in the range of 180-2900 °C, but they are more brittle and poor in thermal shock resistance. Corrosion of the material
Modified phenolic adhesives have many excellent properties and are widely used in aviation, aerospace and other fields. However, phenolic carbon-based adhesives have poor oxidation resistance and cannot meet the requirements of high-temperature aerobic environments.
The molecular main chain structure of silicone resin is composed of silicon-oxygen bonds with high bond energy, which is much higher in heat resistance than the molecular structure of carbon chains. poor junction performance

Method used

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  • Superhigh temperature-resistant adhesive based on liquid polycarbosilane ceramic precursor and preparation method thereof
  • Superhigh temperature-resistant adhesive based on liquid polycarbosilane ceramic precursor and preparation method thereof
  • Superhigh temperature-resistant adhesive based on liquid polycarbosilane ceramic precursor and preparation method thereof

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preparation example Construction

[0027] The liquid polycarbosilane ceramic precursor of the present invention can be synthesized according to the preparation method of the novel liquid polycarbosilane disclosed in the publication number CN104177621A, and the title of the invention is "a new type of liquid polycarbosilane and its preparation method and application", specifically May include the following steps:

[0028] (1) Add magnesium chips or magnesium powder to a dry ether solvent, and drop a small amount of chloromethylalkoxysilane or chloromethylalkoxysilane and chloromethyldimethoxysilane, methyl chloride methoxysilane and ether solvent, after the reaction is initiated, add chloromethylalkoxysilane or chloromethylalkoxysilane and chloromethyldimethoxysilane, chloromethyl-methoxysilane dropwise under stirring Mixed solution of base silane and ether solvent, react at 0~80℃ for 1~12h;

[0029] (2) Add dropwise Grignard reagents containing reactive groups or halogenated hydrocarbons or chloromethylsilane ...

Embodiment 1

[0039] Embodiment 1, preparation and application of adhesive

[0040] 1. Formula

[0041] In parts by weight, the adhesive of this embodiment consists of the following components:

[0042]

[0043] Wherein, the liquid polycarbosilane ceramic precursor includes two structural units in the following molar ratio:

[0044]

[0045] 2. Preparation method

[0046] (1) Preparation of liquid polycarbosilane ceramic precursor shown in formula 1

[0047] Prepare the liquid polycarbosilane ceramic precursor shown in Formula 1 as follows:

[0048] A dry 1L three-necked round-bottomed flask is connected with a mechanical stirrer, a reflux condenser, a constant pressure dropping funnel and a gas guiding device, and then evacuated to replace nitrogen three times, while baking with a heat gun to remove attached water vapor. Under a nitrogen atmosphere, add 5.0 g of magnesium chips into the reaction flask, then add 4 mL of tetrahydrofuran, and heat to 30°C. A mixed solution of 2.97 ...

Embodiment 2

[0059] Embodiment 2, preparation and application of adhesive

[0060] 1. Formula

[0061] In parts by weight, the adhesive of this embodiment consists of the following components:

[0062]

[0063]

[0064] Wherein, the liquid polycarbosilane ceramic precursor includes two structural units in the following molar ratio:

[0065]

[0066] 2. Preparation method

[0067] (1) Preparation of liquid polycarbosilane ceramic precursor shown in formula 2

[0068] Prepare the liquid polycarbosilane ceramic precursor shown in Formula 2 as follows:

[0069] A dry 1L three-necked round-bottomed flask is connected with a mechanical stirrer, a reflux condenser, a constant pressure dropping funnel and a gas guiding device, and then evacuated to replace nitrogen three times, while baking with a heat gun to remove attached water vapor. Under a nitrogen atmosphere, add 5.0 g of magnesium chips into the reaction flask, then add 4 mL of tetrahydrofuran, and heat to 30°C. A mixed solut...

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Abstract

100 parts of the liquid polycarbosilane ceramic precursor or modified polymer thereof, 0.5 to 5 parts of curing agent, 0 to 300 parts of solid filler, and 0 to 10 parts of chopped fiber. The superhigh temperature-resistant adhesive based on the liquid polycarbosilane ceramic precursor has the advantages that the temperature-resistant property is high, the shear intensity is still higher at the temperature of 1000 to 1700 DEG C, and the superhigh temperature-resistant adhesive can be applied to adhere ceramic and a composite material thereof and carbon-based composite materials, and also applied into oxidizing and inert atmospheres; better heat stability, mechanical property and adhering property are realized, and the temperature-resistant property is better than the temperature-resistant property of phenolic resin; compared with an inorganic adhesive, the toughness is better.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to an ultra-high temperature resistant adhesive based on a liquid polycarbosilane ceramic precursor and a preparation method thereof. Background technique [0002] With the development of high technology such as aviation and aerospace, such as the development of heavy rockets and high-speed aircraft, higher and higher requirements are placed on the temperature resistance of the materials involved. Adhesives, as important functional materials, also have The heat resistance level is also improved accordingly. At present, ultra-high temperature resistant adhesives include inorganic adhesives, silicone resins, modified phenolic resins, and the like. Inorganic adhesives mainly include silicates, phosphates, and aluminosilicates. These adhesives have excellent high temperature resistance and can be widely used in the range of 180-2900 °C, but they are more brittle and poor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/16C09J11/04
CPCC09J183/16C08K3/22C08K3/34C08K3/36C08K3/38C08K7/10C08K13/04C08K2003/2227C08K2201/014C09J11/04
Inventor 罗永明徐彩虹李永明张宗波曾凡
Owner INST OF CHEM CHINESE ACAD OF SCI
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