Silicon-based microshell resonator and production method thereof

Abstract

The invention discloses a silicon-based microshell resonator and a production method thereof. The silicon-based microshell resonator includes a microshell harmonic oscillator and a substrate having a plurality of driving detection electrodes; the microshell harmonic oscillator is formed by a shell part, a flat plate shell part and a pillar; the flat plate part of the microshell harmonic oscillator, close to the pillar, is provided with grooves; the substrate is formed by two layers of highly conductive silicon substrates, the two layers of highly conductive silicon substrates are electrically isolated by an oxidation layer, and the plurality of driving detection electrodes formed through doping are arranged in the upper highly conductive silicon substrate; the number of the driving detection electrodes is a multiple of 4, and the driving detection electrodes include an even number of driving electrodes and an even number of detection electrodes; and the microshell harmonic oscillator is electrically connected with the lower highly conductive silicon substrate through the pillar. The diameter dimension of the microshell harmonic oscillator is 100 [mu]m to 4 mm. The silicon-based microshell resonator reduces the surface loss of the harmonic oscillator and improves the Q value of the harmonic oscillator.

Description

technical field [0001] The invention relates to a three-dimensional micro-shell resonator in the field of micro-electromechanical systems (MEMS), in particular to a silicon-based micro-shell resonator and a preparation method thereof. Background technique [0002] Compared with optical gyroscopes (such as ring laser gyroscopes and fiber optic gyroscopes), Gothic vibrating gyroscopes are simpler in structure and have certain advantages in miniaturization. According to the structure, Gothic vibrating top can be divided into vibrating beam type, tuning fork type, shell type, vibrating plate type, etc. Its core components can be processed by traditional macroscopic machinery or MEMS technology. According to the structure, the shell resonant gyroscope can be divided into hemisphere, ring, cylinder and other shell forms. Among them, the hemispherical resonant gyroscope is the most successful high-performance gyroscope among Gothic vibrating gyroscopes, and has been successfully us...

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Problems solved by technology

[0006] In order to realize the high-performance micro-shell resonant gyroscope, Southeast University has patented "a two-piece integrated silicon-based ultra-thin micro-hemispherical resonant gyroscope and its preparation method" (patent number: ZL2013101769365) and "a three-piece assembled resonant gyroscope" in China. Silicon-based ultra-thin micro-hemispherical resonant gyroscope and its preparation method" (Patent No.: ZL2013101770080) proposed the use of SF 6 The hemispherical cavity is prepared by isotropic dry etching, but the surface roughness of the cavity prepared by this dry etching process is very high, and errors are prone to occur during the assembly process of the electrode and the resonator, and the distance between the electrode and the resonator Capacitance is relatively small

Northwestern Polytechnical University proposed in the Chinese patent "Miniature Hemispherical Resonant Gyroscope and Its Preparation Method" (patent number: ZL 2013100221461) to prepare a hemispherical cavity by isotropic dry etching. The surface roughness of the cavity prepared by this process is also very high. High, affecting the surface roughness of the subsequently deposited polysilicon resonator, resulting in large surface loss, and the capacitance between the prepared electrode and the resonator is relatively small

Northrop Grumman of the United States proposed in the United States patent "MICRO HEMISPHERIC RESONATOR GYRO" (patent number: US8109145) to deposit low-stress silicon nitride by plasma-enhanced chemical vapor deposition (PECVD) to prepare micro-hemispherical resonators. The situation is that the stress of silicon nitride deposited by PECVD silicon nitride or other deposition methods is large, especially for the preparation of 3mm diameter silicon nitride micro-hemispherical resonators. It is very easy to break; (DRIE), this process easily leads to inconsistent areas between each electrode and the resonator, resulting in uneven capacitance

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