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Polyimide thin film and preparation method therefor

A technology of polyimide film and polyamic acid resin, applied in the field of insulating materials, can solve problems such as being unsuitable for large-scale production and complex process flow, and achieve good mechanical properties, improve interface bonding force, and excellent corona resistance performance. Effect

Active Publication Date: 2017-04-26
株洲时代华鑫新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has a complex process and is not suitable for large-scale production.

Method used

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  • Polyimide thin film and preparation method therefor

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Experimental program
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Effect test

Embodiment 1

[0042] The polyimide film described in this embodiment is prepared by the following method:

[0043] After mixing 0.5kg of γ-aminopropyltriethoxysilane, 0.5kg of n-octyltriethoxysilane, 1kg of alumina nanoparticles with a particle size of 15nm, and 8kg of N-methylpyrrolidone, at a temperature of 70°C The reaction was carried out for 5h under the conditions, and cooled to room temperature to obtain a dispersion of alumina; the dispersion of 10kg of alumina and 40kg of N-methylpyrrolidone were mixed, and then 7.8kg of pyromellitic dianhydride and 4,4'-dicarbonate were added. Amino diphenyl ether 7.2kg, the temperature of the reaction system was raised to 30°C, after the dianhydride and diamine were fully dissolved, the reaction was continued for 2 hours, and the reaction system was cooled to room temperature to obtain the polyamic acid resin; Transfer to the defoaming kettle and vacuumize the defoaming under the condition that the vacuum degree is -0.09MPa. The defoaming is comp...

Embodiment 2

[0046] The polyimide film described in this embodiment is prepared by the following method:

[0047] After mixing 0.4 kg of γ-mercaptopropyl triethoxysilane, 0.7 kg of octadecyl trimethoxysilane, 2 kg of silica nanoparticles with a particle size of 100 nm, and 10 kg of N-methylpyrrolidone, the mixture was heated at 60°C. Under temperature conditions, react for 6h, cool to room temperature, and obtain a dispersion of silica; mix 10kg of silica dispersion and 50kg of N-methylpyrrolidone, and then add 7.8kg of pyromellitic dianhydride and 4,4 '-diaminodiphenyl ether 7.2kg, the temperature of the reaction system was raised to 30 ℃, after the dianhydride and diamine were fully dissolved, the reaction was continued for 4h, and the reaction system was cooled to room temperature to obtain the polyamic acid resin; The amic acid resin is transferred to the defoaming kettle and vacuumized and defoamed under the condition of vacuum degree of -0.09MPa. The defoaming is completed when no bu...

Embodiment 3

[0050] The polyimide film described in this embodiment is prepared by the following method:

[0051] 0.8kg of γ-(2,3-glycidoxy)propyltrimethoxysilane, 0.5kg of octadecyltriethoxysilane, 2kg of titanium dioxide nanoparticles with a particle size of 200nm, N,N-dimethyl After mixing 12Kg of dimethylformamide, react at 80°C for 4h, and cool to room temperature to obtain a dispersion of titanium dioxide; mix 10kg of the dispersion of titanium dioxide and 60kg of N,N-dimethylformamide, and then add 3 , 15.5kg of 3',4,4'-benzophenone tetracarboxylic dianhydride and 9.5kg of 4,4'-diaminodiphenylmethane, the temperature of the reaction system was raised to 40°C, and the dianhydride and diamine were treated After fully dissolving, continue the reaction for 4 hours, and cool the reaction system to room temperature to obtain the polyamic acid resin; transfer the polyamic acid resin to the defoaming kettle and vacuumize and defoam under the condition that the vacuum degree is -0.09MPa, and...

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Abstract

The invention discloses a preparation method for a polyimide thin film. The preparation method comprises the steps of adding an inorganic filler dispersing liquid, the surface of which is modified by coupling agents, and dianhydride and diamine into a polarity organic solvent to be mixed, and performing condensation polymerization on the dianhydride and diamine to obtain polyamide acid resin; and performing de-foaming, curtain coating and imidization on the polyamide acid resin in sequence to obtain the polyimide thin film, wherein the coupling agents comprise a coupling agent A and a coupling agent B; the coupling agent A is selected from a silane coupling agent or a titanate coupling agent with any one reactive group of amino group, formyl group, epoxy group, isocyanato, anhydride group, sulfydryl group and the like; the coupling agent B is selected from the silane coupling agent or the titanate coupling agent comprising long-chain alkyl; and the molar ratio of the coupling agent A to the coupling agent B is 2:8-8:2. The polyimide thin film prepared by the preparation method is 165-180MPa in tensile strength, 48-60% in breaking elongation, 210-230MV / m in power frequency electric strength, and 60-80h in corona resistance service life.

Description

technical field [0001] The invention belongs to the technical field of insulating materials, and particularly relates to a preparation method of a polyimide film and a polyimide film prepared by the method. Background technique [0002] Polyimide film has outstanding heat resistance and cold resistance, excellent mechanical properties, electrical insulation properties, corrosion resistance and radiation resistance. It is the insulating film material with the best comprehensive performance in the world. It is widely used in traction Manufacture of motors, variable frequency motors, wind power generation equipment and high-voltage transformers. [0003] With the miniaturization of electric motors and the popularization and application of frequency conversion speed regulation technology, higher requirements are placed on insulating film materials. For example, high-frequency pulse waves and their transmission process are prone to high-frequency overvoltage. Corona discharge in...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08J5/18C08K9/06C08K3/36C08K3/22C08K3/28
CPCC08G73/1064C08G73/1067C08G73/1071C08J5/18C08J2379/08C08K3/22C08K3/28C08K3/36C08K9/06C08K2003/2227C08K2003/2241C08K2003/282C08K2201/003C08K2201/011C08L79/08
Inventor 陈颖张文祥刘佳音张步峰
Owner 株洲时代华鑫新材料技术有限公司
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