Method for preparing polycrystalline ultra-thin metal film and two-dimensional nano pattern

Abstract

The invention relates to a method for preparing a polycrystalline ultra-thin metal film and two-dimensional nano pattern. The method comprises a step of preparing a two-dimensional array structure formed by units with special morphology by using UV photolithographic process, and forming a polymer mask, a step of realizing the dense self-assembly of a monodisperse silver nano plate at a substrate through an ascorbic acid AA modified high yield silver nano plate solution, a step of removing the polymer mask through a developer, and forming a patterned self-assembled silver nano plate array on the substrate, a step of removing a silver nano plate coating on the substrate through a physical or chemical method, and a step of forming a (quasi) continuous polycrystalline ultra-thin metal film and two-dimensional nano pattern through continued growth. According to the method, the large-scale preparation of special plane structure sub wavelength devices is realized, the key problem of large area metal thin film optoelectronic device application is solved, the loss of the device is reduced greatly, the performance of the device is improved, the preparation of an ultra-thin continued metal film with the minimum of 10 nm is realized, and the method is a breakthrough of existing preparation technology.

Description

technical field [0001] The invention relates to the fields of nanometer materials, thin film devices and waveguides, in particular to a preparation method of polycrystalline ultrathin metal films and two-dimensional nanographs. Background technique [0002] Two-dimensional metallic subwavelength optoelectronic devices with surface plasmon properties. Under the condition of light, the incident photons interact with the free electrons on the metal surface, and the field distribution is highly localized in the direction perpendicular to the interface, and the pattern spot formed is much smaller than the traditional dielectric waveguide, which breaks through the diffraction limit and can be Propagates in a direction parallel to the surface. Therefore, it can be fabricated into two-dimensional sub-wavelength optoelectronic devices, greatly reducing the size and facilitating integration. However, due to the large loss of the device material (usually metal), the signal attenuates...

AI Technical Summary

Problems solved by technology

This kind of process not only has high cost, complex process, long production cycle, and low yield; moreover, the processed film has an amorphous structure and has a large loss

The two-dimensional nanoplate structure synthesized by chemical methods can only reach a maximum of 200 microns, so it is impossible to form a large-area uniform film; and the nanoplate with a size of more than 10 microns is generally more than 200 nanometers in thickness, and it is difficult to prepare a thickness less than 20 nanometers ultra-thin continuous film of

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