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Preparation method of coated filler slurry composition, prepreg comprising slurry composition, laminated board and printed circuit board

A coating type and composition technology, applied in the field of pressing plates, can solve the problems of poor compatibility and affect various properties of cured materials, and achieve the effect of increasing dispersion and fluidity, and increasing solid content

Active Publication Date: 2017-05-17
联瑞新材(连云港)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method uses water to prepare the slurry. Due to the poor compatibility of water and organic resins, it will affect various properties of the cured material, especially the insulation and dielectric properties, so it is not suitable for copper clad laminates.

Method used

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  • Preparation method of coated filler slurry composition, prepreg comprising slurry composition, laminated board and printed circuit board
  • Preparation method of coated filler slurry composition, prepreg comprising slurry composition, laminated board and printed circuit board
  • Preparation method of coated filler slurry composition, prepreg comprising slurry composition, laminated board and printed circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0068] In this embodiment, the coated filler slurry composition (referred to as slurry A) is prepared by the following method, the specific method is:

[0069] (1) Weigh 100g of master particle filler spherical silica powder (D50 is 0.3μm, D100 is 23μm), 1g butyl stearate (dispersant), 100g methyl ethyl ketone, silica powder, dispersant and butyl Ketone mixing, mechanical stirring to disperse evenly;

[0070] (2) further dispersing the mixed solution obtained in step (1) through a dispersing device to obtain a prefabricated silica slurry;

[0071] (3) Add 0.003g ammoniacal liquor to the prefabricated slurry prepared in step (2), mix well, and record it as liquid A;

[0072] (4) Take by weighing 0.25g methyl orthosilicate, be dissolved in 0.003g butanone, be made into mixed solution;

[0073] (5) Under mechanical stirring, liquid B is added to liquid A, and stirred to react to obtain a reaction mixed solution;

[0074] (6) Store the reaction mixed solution obtained in step (...

Embodiment 2

[0077] In this embodiment, the coated filler slurry composition (referred to as slurry B) is prepared by the following method, the specific method is:

[0078] (1) Take by weighing 100g parent particle filler angular silica micropowder (D50 is 5 μm, D100 is 20 μm), 0.1g sodium lauryl sulfate (dispersant), 70g acetone, silica micropowder, dispersant and acetone are mixed, Mechanical stirring to disperse evenly;

[0079] (2) further dispersing the mixed solution obtained in step (1) through a dispersing device to obtain a prefabricated silica slurry;

[0080] (3) Add 5g tetramethylammonium hydroxide to the prefabricated slurry prepared in step (2), mix homogeneously, and record it as liquid A;

[0081] (4) Take by weighing 17.34g ethyl orthosilicate, be dissolved in 30g acetone, be made into mixed solution;

[0082] (5) Under mechanical stirring, liquid B is added to liquid A, and stirred to react to obtain a reaction mixed solution;

[0083] (6) Store the reaction mixed solu...

Embodiment 3

[0086] In this embodiment, the coated filler slurry composition (referred to as slurry C) is prepared by the following method, the specific method is:

[0087] (1) Weigh 100g master particle filler talc powder (D50 is 10 μm, D100 is 29 μm), 0.12g sodium dodecylbenzenesulfonate (dispersant), 57.14g DMF, mix talc powder, dispersant and DMF, Mechanical stirring to disperse evenly;

[0088] (2) the mixed solution obtained in the step (1) is further dispersed by a dispersing device to obtain a talcum powder prefabricated slurry;

[0089] (3) Add 5g of dilute hydrochloric acid to the prefabricated slurry prepared in step (2), mix well, and record it as liquid A;

[0090] (4) Take by weighing 34.68g ethyl orthosilicate, dissolve in 80g DMF, be made into mixed solution;

[0091] (5) Under mechanical stirring, liquid B is added to liquid A, and stirred to react to obtain a reaction mixed solution;

[0092] (6) Store the reaction mixed solution obtained in step (5) at room temperatur...

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Abstract

The invention provides a preparation method of a coated filler slurry composition, a prepreg comprising the slurry composition, a laminated board and a printed circuit board. The preparation method comprises the following steps: mixing master batch filler with an organic solvent and a dispersant, mechanically stirring and uniformly dispersing the mixture, and further dispersing the mixed liquid through dispersing equipment to prepare prefabricated slurry; adding a catalyst into the prefabricated slurry, uniformly mixing the mixture, and marking the mixture as a liquid A; dissolving a coating agent in an organic solvent to prepare a solution, and marking the solution as a liquid B; adding the liquid B into the liquid A while stirring, and performing a reaction to obtain a reaction mixed solution; and storing the reaction mixed solution at normal temperature for 1-30 days to obtain the coated filler slurry composition. The coated filler slurry composition prepared by the invention can improve the dispersibility and flowability of the integral slurry composition and improve the resin flowability in a high filler filling state. The copper coated laminated board manufactured by the slurry composition has relatively good heat resistance and low coefficient of thermal expansion and good comprehensive performance.

Description

technical field [0001] The invention belongs to the technical field of pressing boards, and relates to a preparation method of a coated filler slurry composition, a prepreg containing the slurry composition, a laminate and a printed circuit board. Background technique [0002] With the development of information science and technology, integrated circuits are developing in the direction of high frequency, high speed, high density, high power, and multi-function. Therefore, the performance requirements for copper clad laminates are also getting higher and higher. In particular, the requirements for data transmission speed and transmission frequency are getting higher and higher, among which, the requirements for heat resistance and expansion rate of the board are particularly prominent. In order to improve the heat resistance of the board and reduce its expansion coefficient, the most effective method is to add as much filler as possible to the glue formula, such as silicon d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K7/18C08K7/00C08K3/36C08K3/34C08K3/22C08K3/38C08K7/14C08L63/00C08L79/04B32B15/14B32B17/04B32B27/04B32B33/00
Inventor 胡鹏柴颂刚杜翠鸣邢燕侠郝良鹏
Owner 联瑞新材(连云港)有限公司
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