Ultraviolet-cured conductive silver adhesive and preparation method thereof

A technology of conductive silver glue and ultraviolet light, which is applied in the field of conductive glue, can solve the problems of limited application range of curing methods and insufficient long-term stability of conductive silver glue, and achieve excellent pollution resistance, simple operation steps, and high bonding strength. high effect

Inactive Publication Date: 2017-05-17
成都科愿慧希科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The long-term stability of the existing conductive silver glue is insufficient, and the single curing method limits its scope of application. Therefore, it is particularly necessary to study a conductive silver glue with high stability and good conductivity.

Method used

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  • Ultraviolet-cured conductive silver adhesive and preparation method thereof
  • Ultraviolet-cured conductive silver adhesive and preparation method thereof
  • Ultraviolet-cured conductive silver adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] An ultraviolet light-curable conductive silver glue is prepared from the following components in parts by weight: 50 parts of base resin, 38 parts of conductive filler, 30 parts of reactive diluent, 5 parts of photoinitiator, 10 parts of stabilizer, functional 11 parts of auxiliary agent, 3 parts of leveling agent, 1 part of conduction accelerator and 1 part of coupling agent. The base resin is polyacrylate modified polyurethane resin and bisphenol A epoxy resin in a mass ratio of 1:1; the conductive filler is nano silver powder with a particle size of 50nm. The curing agent is polyamide or trimellitic anhydride; the reactive diluent is furfuryl alcohol glycidyl ether; and the photoinitiator is α-hydroxyalkyl phenone. The stabilizer is a liquid rare earth stabilizer; the functional additives are pollution-resistant additives and salt-spray-resistant additives, the pollution-resistant additive is SRC-220, and the salt-spray-resistant additive is HALOX515. The leveling a...

Embodiment 2

[0018] An ultraviolet light-curable conductive silver glue is prepared from the following components in parts by weight: 60 parts of base resin, 45 parts of conductive filler, 40 parts of reactive diluent, 9 parts of photoinitiator, 13 parts of stabilizer, functional 15 parts of auxiliary agent, 7 parts of leveling agent, 5 parts of conduction accelerator and 5 parts of coupling agent. The base resin is polyacrylate modified polyurethane resin and bisphenol A epoxy resin with a mass ratio of 1:3; the conductive filler is nano silver powder with a particle size of 10nm. The curing agent is polyamide or trimellitic anhydride; the reactive diluent is ethylene glycol diglycidyl ether; and the photoinitiator is α-aminoalkyl phenone. The stabilizer is a liquid rare earth stabilizer; the functional additives are pollution-resistant additives and salt-spray-resistant additives, the pollution-resistant additive is SRC-220, and the salt-spray-resistant additive is HALOX515. The levelin...

Embodiment 3

[0020] An ultraviolet light-curable conductive silver glue is prepared from the following components in parts by weight: 52 parts of base resin, 39 parts of conductive filler, 36 parts of reactive diluent, 8 parts of photoinitiator, 12 parts of stabilizer, fluid 5 parts of leveling agent, 12 parts of functional auxiliary agent, 2 parts of conduction accelerator and 3 parts of coupling agent. The base resin is polyacrylate modified polyurethane resin and bisphenol A epoxy resin with a mass ratio of 1:2; the conductive filler is nano silver powder with a particle size of 25nm. The curing agent is polyamide or trimellitic anhydride; the reactive diluent is neopentyl glycol diglycidyl ether; and the photoinitiator is α-hydroxyalkyl phenone and α-aminoalkyl phenone. The stabilizer is a liquid rare earth stabilizer; the functional additives are pollution-resistant additives and salt-spray-resistant additives, the pollution-resistant additive is SRC-220, and the salt-spray-resistant ...

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Abstract

The invention discloses an ultraviolet-cured conductive silver adhesive. The ultraviolet-cured conductive silver adhesive is prepared from the following components in parts by weight: 50-60 parts of substrate resin, 30-35 parts of a curing agent, 38-45 parts of conductive filler, 30-40 parts of a reactive diluent, 5-9 parts of a photoinitiator, 10-13 parts of a stabilizing agent, 11-15 parts of a functional additive, 3-7 parts of a flatting agent, 1-5 parts of a conductive accelerator and 1-5 parts of a coupling agent. The invention also discloses a preparation method of the ultraviolet-cured conductive silver adhesive. The ultraviolet-cured conductive silver adhesive provided by the invention is cured by means of ultraviolet light; compared with commercially available products, the ultraviolet-cured conductive silver adhesive is short in curing time, low in volume resistivity and high in bonding strength. After a product is placed in the outdoor environment for a long time, the performance of the product is not influenced, so that the product shows excellent weather resistance. The ultraviolet-cured conductive silver adhesive is high in stability and can be used for a long time. The volume resistivity and bonding strength of a system are basically not influenced by hot and cold impact. The product can tolerate iodine wipe, thus showing good resistance to contamination.

Description

technical field [0001] The invention relates to an ultraviolet light curing conductive silver glue and a preparation method thereof, specifically belonging to the technical field of conductive glue. Background technique [0002] Today, the consumer electronics industry is one of the largest industries in the world. There are many places in the electronics industry that involve creating a conductive path between two objects. At present, the methods for constructing conductive paths mainly include: welding and conductive glue. Among them, welding is still the most commonly used method. But welding can produce heavy metal pollution. Most importantly, the high temperature required for soldering can damage the components of electronic products such as mobile phones and tablets. In order to avoid this problem, people have invented conductive adhesives composed of organic matrix and conductive fillers. Among them, silver material is the most suitable conductive filler in condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J163/00C09J9/02C09J11/06
CPCC08K2201/011C09J9/02C09J11/06C09J163/00C09J175/14C08L63/00C08K13/02C08K2003/0806C08K5/09C08L75/14
Inventor 高慧俐涂铭旌
Owner 成都科愿慧希科技有限公司
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