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Ferroferric oxide nanoparticle reinforced high thermal conductivity type epoxy resin composite material for LED bonding layer and preparation method thereof

A technology of ferroferric oxide and nanoparticles, which is applied in the field of composite materials, can solve problems such as insufficient thermal conductivity, and achieve excellent tensile strength, elongation at break, and excellent thermal conductivity

Inactive Publication Date: 2017-05-31
安徽中威光电材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is insufficient thermal conductivity

Method used

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Embodiment

[0024] A kind of high thermal conductivity type epoxy resin composite material reinforced by iron ferric oxide nanoparticles for an LED bonding layer, made from the following raw materials in parts by weight (g):

[0025] Bisphenol A type epoxy resin E-51 33, B 4 C powder 8, Al 2 o 3 11, 107 gum 3, dilaurate di

[0026] Butyl tin 3, tetraethyl orthosilicate 5, iron ferric oxide nanoparticles 3, dimercaptosuccinic acid 1, ethyl acetate 4, graphene oxide 6, ethylenediamine 3, PTS 7, multi-walled carbon nanotubes 9, Methyl hexahydrophthalic anhydride 8, emulsified silicone oil 2, appropriate amount of KH550, ethanol, distilled water, DMF, toluene, dimethyl sulfoxide.

[0027] A method for preparing a high thermal conductivity type epoxy resin composite material reinforced with ferroferric oxide nanoparticles for an LED adhesive layer, characterized in that the steps are as follows:

[0028] a. Al 2 o 3 , B 4 C powder is put into a drying oven and dried at 100-110°C for 2 h...

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Abstract

The invention discloses a ferroferric oxide nanoparticle reinforced high thermal conductivity type epoxy resin composite material for an LED bonding layer and a preparation method technology. The composite material is characterized in that bisphenol A type epoxy resin E-51, B4C powder, Al2O3, 107 glue, dibutyltin dilaurate, ethyl orthosilicate, ferroferric oxide nanoparticles, dimercaptosuccinic acid, ethyl acetate, graphene oxide, ethylenediamine, PTS, multiwalled carbon nanotubes, methylhexahydrophthalic anhydride and emulsified silicon oil are taken as raw materials. According to the preparation technology, B4C powder and Al2O3 are taken as fillers, and KH550 surface treated thermal conductive silicon rubber is prepared; amino modification is carried out on the graphene oxide with ethylenediamine; organic silicon modified epoxy resin is prepared from PTS by adopting a chemical modification method; and a carbon nanotube reinforced epoxy resin-based composite material is prepared, and mechanical properties are excellent.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a high thermal conductivity epoxy resin composite material reinforced with ferric oxide nanoparticles for an LED adhesive layer, and a preparation process thereof. Background technique [0002] The use of white LEDs for solid-state lighting is becoming more and more widespread. However, because the ambient temperature of the LED and the thermal resistance from the node to the environment have an important impact on its luminous efficiency and service life, high-power LEDs [0003] The problem of efficient and stable heat dissipation has become an important obstacle affecting its popularization and application. [0004] In his master's thesis "Effect of Epoxy Composite Bonding Layer on LED Junction Temperature", Ju Hongzong used the method of doping micron alumina and boron carbide to improve the thermal conductivity and bonding performance of epoxy resin. Epoxy resin composite...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L83/06C08L83/04C08K13/06C08K9/10C08K9/06C08K9/04C08K3/22C08K3/38C08K3/04C08K7/24C08G59/42C09K5/14
CPCC08G59/4215C08K2201/011C08L63/00C08L2201/08C08L2203/20C08L2205/02C08L2205/025C08L2205/035C09K5/14C08L83/06C08L83/04C08K13/06C08K9/10C08K9/06C08K9/04C08K2003/2227C08K2003/2275C08K3/38C08K3/04C08K7/24
Inventor 江豪童翔何月花
Owner 安徽中威光电材料有限公司
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