The invention relates to a chemical nickel-phosphorus alloy plating solution capable of obtaining a high-solderability plating layer. The solution comprises nickel sulfate, sodium hypophosphite, a complexing agent containing carboxylate radicals, bivalent tin ions and dimercaptosuccinic acid or dimercaptosuccinate, wherein, the complexing agent containing the carboxylate radicals is selected fromone or combination of a plurality of glycollic acid, lactic acid, malonic acid, succinic acid, malic acid, tartaric acid, citric acid, gluconic acid, acetic acid, propionic acid, aminoacetic acid or corresponding salts of various acids; and the pH value of the solution is adjusted to 4-7. By adopting the chemical nickel-phosphorus alloy plating solution capable of obtaining the high-solderabilityplating layer, the chemical nickel-phosphorus plating layer achieves better solderability and is not restricted by the phosphorus content in the plating layer, thus solving the solderability problem of the chemical nickel-phosphorus plating layer and lowering the cost.