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A silicon wafer cutting fluid

A silicon wafer cutting fluid, integer technology, applied in lubricating compositions, petroleum industry, etc., can solve the problems of mortar deposition, silicon wafer surface damage, high energy consumption, etc. Effect

Active Publication Date: 2020-01-14
HANGZHOU TRANSFAR FINE CHEM CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of high energy consumption in the existing wire cutting process and the surface damage of silicon wafers, mortar deposition and thermal stress in the cutting process, the present invention provides a cutting fluid with low viscosity, high lubricity and high dispersibility. It is used for multi-wire cutting of crystalline silicon, which can significantly reduce energy consumption, improve the yield of silicon wafers, and maintain the stability of the cutting process

Method used

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  • A silicon wafer cutting fluid
  • A silicon wafer cutting fluid
  • A silicon wafer cutting fluid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Prepare 1000g of cutting fluid, and the ratio of each component is as follows: block polyether (R is methoxy, n=20, m+q=10) 300g, comb structure dispersant (R 1 , R 2 , R 3 , R 4 for -H,R 5 for -CH 3 , n=10, a=5, b=5, c=5, d=5) 200g, JFC-6100g, ascorbic acid 20g, isothiazolone 20g, silicone defoamer 10g, deionized water 350g.

[0040] Add deionized water into the flask, start the stirrer at room temperature, slowly add the above-mentioned amount of block polyether, allyl polyoxyethylene ether-acrylic acid polymer, JFC-6, ascorbic acid, isothiazolinone, silicone defoaming agent, and continue to stir for 40 minutes to obtain cutting fluid No. 1. Its performance indicators are shown in the attached table.

Embodiment 2

[0042] Prepare 1000g of cutting fluid, and the ratio of each component is as follows: block polyether (R is ethoxy, n=50, m+q=40) 600g, comb structure dispersant (R 1 , R 2 , R 3 , R 4 for -CH 3 , R 5 for -CH 2 CH 3, n=50, a=30, b=30, c=30, d=30) 100g, sulfonated oil 40g, dibutylhydroxytoluene 1g, sodium benzoate 0.5g, polyether modified silicone oil defoamer 0.5g , Deionized water 258g.

[0043] Add deionized water into the flask, start the stirrer at room temperature, slowly add the above-mentioned amount of block polyether, methallyl polyoxyethylene ether-acrylic acid-methacrylate polymer, sulfonated oil, dibutyl hydroxytoluene, sodium benzoate, polyether modified silicone oil defoamer, and continue to stir for 40 minutes to obtain cutting fluid No. 2. Its performance indicators are shown in the attached table.

Embodiment 3

[0045] Prepare 1000g of cutting fluid, and the ratio of each component is as follows: block polyether (R is propoxy, n=80, m+q=70) 500g, comb structure dispersant (R 1 , R 2 for -H,R 3 , R 4 for -CH 3 , R 5 for -CH 3 , n=30, a=18, b=18, c=18, d=18) 150g, fast penetrating agent T 70g, tea polyphenol 10g, potassium sorbate 10g, higher alcohol defoamer 5g, deionized water 255g.

[0046] Add deionized water into the flask, start the stirrer at room temperature, and slowly add the above-mentioned amount of block polyether, allyl polyoxyethylene ether-methacrylic acid-acrylamide polymer, rapid penetrant T, tea polyphenol , potassium sorbate, and high-carbon alcohol defoamer, and continued to stir for 40 minutes to obtain cutting fluid No. 3. Its performance indicators are shown in the attached table.

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Abstract

The invention discloses a silicon wafer cutting fluid. The existing low-viscosity cutting fluid has the defects of poor lubricating property and poor dispersity, has low cutting stability due to high frictional heat and great mortar viscosity fluctuations in the silicon slicing process, and can not be applied to high-load cutting equipment. The cutting fluid comprises the following components in percentage by mass: 30-60% of PO-EO-PO-structure block polyether, 10-20% of dispersing agent, 4.0-10% of wetting agent, 1.0-3.0% of antioxidant, 0.05-2.0% of preservative, 0.05-2.0% of defoaming agent and the balance of deionized water. The dispersing and lubricating capacities of the cutting fluid are enhanced to implement the feasibility of silicon wafer cutting of the high-power slicer by using the low-viscosity fluid; and the silicon wafer cutting fluid is applicable to high-load cutting equipment.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to a silicon wafer cutting fluid for multi-wire cutting of crystalline silicon. Background technique [0002] In recent years, the development of China's solar photovoltaic industry has experienced a roller coaster-like crazy development model. From the era of high-return profiteering to the wave of closures caused by overcapacity, and then to the support and subsidies of national policies, the current photovoltaic industry has basically returned to rationality, but Still have to rely on subsidies to make profits. With the introduction of the 13th Five-Year Plan, photovoltaic subsidies will be canceled year by year from the second half of 2016. This requires photovoltaic enterprises to transform and upgrade to improve efficiency, or lean production to reduce costs, in order to survive in the fierce market environment Survive. At present, the production of monocrystalline silicon wafers in the sil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M173/00C10N30/02C10N30/04C10N30/06
CPCC10M173/00C10M2207/02C10M2207/024C10M2207/026C10M2207/141C10M2207/289C10M2209/04C10M2209/084C10M2209/104C10M2209/105C10M2217/024C10M2219/044C10M2219/104C10M2219/108C10M2227/00C10M2229/02C10N2030/02C10N2030/04C10N2030/06
Inventor 陈同军牛树怀赵琦琦
Owner HANGZHOU TRANSFAR FINE CHEM CO LTD
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