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Ball milling-accumulative roll bonding method for circulating solidification of pure titanium machining chips

A chip and ball milling technology, applied in the field of metal material processing, can solve problems such as unsolved problems, grain coarsening, weakening of material strength, etc., to eliminate pore defects, inhibit grain coarsening, prevent continuous distribution and Aggregate effect

Inactive Publication Date: 2017-05-31
SHANGHAI DIANJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after BM treatment, subsequent processing procedures such as hot pressing sintering or powder extrusion / forging must be carried out to obtain bulk materials, and in these procedures, due to the influence of factors such as long heating (sintering) time and dynamic recrystallization, Grain coarsening will occur, weakening the strength of the material
These technical issues have not yet been well resolved

Method used

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  • Ball milling-accumulative roll bonding method for circulating solidification of pure titanium machining chips

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Embodiment Construction

[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with illustrations and specific embodiments.

[0030] Such as figure 1 As shown, the ball milling-cumulative rolling lamination method of a kind of pure titanium chips cyclically solidified that the present invention proposes, comprises the following steps:

[0031] Step (1)-Ti chip recovery pretreatment: use the chips generated by end milling Ti 2 (ASTM Grade 2) as raw materials, collect the chips, and use Inductively coupled plasma atomic emission spectroscopy (ICP for short) -AES) to analyze its chemical composition (mass percentage, wt.%), and the analysis results are shown in Table 1. It can be seen from Table 1 that the chemical composition (oxygen content) of the milled grade 2 Ti chips meets the ASTM standard range. At the same time, 99.9% ethanol is used to clean ...

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Abstract

The invention provides a ball milling-accumulative roll bonding method for circulating solidification of pure titanium machining chips. The ball milling-accumulative roll bonding method for circulating solidification of the pure titanium machining chips comprises the following steps of (1) recovering pretreatment of the Ti machining chips, specifically, the Ti machining chips are cleaned, and thus oil stains and impurities are removed; (2) BM treatment of the Ti machining chips, specifically, ball-milling is conducted on the Ti machining chips pretreated in the step (1); (3) wrapping and packaging of BM-Ti machining chips, specifically, the BM-Ti machining chips are placed into a cavity of a titanium cylinder and then compacted preliminarily through a hand press; (4) indoor-temperature cold-rolling of the wrapped and packaged BM-Ti machining chips, specifically, cold-rolling is conducted on the BM-Ti machining chips wrapped and packaged in the step (3), so that a cold-rolled Ti plate is prepared; (5) annealing treatment of the cold-rolled Ti plate, specifically, the cold-rolled Ti plate is heated to the temperature of 750-850 DEG C, maintained at the temperature for 30-40 minutes and then air-cooled; (6) high-temperature solidification of the Ti machining chips through ARB, specifically, two-pass roll-bonding is conducted on the Ti plate annealed in the step (5), and thus a blocky Ti material is prepared; and (7) quenching, specifically, the blocky Ti material obtained in the step (6) is quenched and cooled to the indoor temperature in a water cooling way.

Description

technical field [0001] The invention belongs to the field of metal material processing, and relates to solid-phase recycling and reuse of waste metal resources, especially for titanium resources with high smelting costs, and develops a new technology for efficient and clean titanium chip remanufacturing. In particular, it relates to a ball milling-cumulative rolling superimposition method for cyclic solidification of pure titanium chips. Background technique [0002] Titanium is a metal resource with high smelting costs. It has excellent biocompatibility, good corrosion resistance, and suitable mechanical properties. It is an important material for manufacturing medical devices, artificial joints, and large energy and chemical containers. However, in order to manufacture high-precision Ti structures, a large machining allowance needs to be designed, and a large amount of raw materials will be converted into waste chips. The traditional high-temperature melting and casting p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22F1/18
CPCC22F1/183
Inventor 罗蓬
Owner SHANGHAI DIANJI UNIV
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