Environment-friendly waterborne soldering flux for tin plating

Abstract

The invention discloses environment-friendly water-borne soldering flux for tin plating. The environment-friendly water-borne soldering flux comprises raw materials including, by mass percent, 1.3%-1.5% of aluminum chloride, 0.3%-0.35% of ammonium chloride, 1.3%-1.35% of a surface active agent, 0.1%-0.15% of highly-silicified triethanolamine, 2.5%-3% of hydrochloric acid and deionized water which is added to 100%. According to the soldering flux, a tin coating can be even and compact, the performance is good, no pungent smell exists and no toxic matter is discharged in the welding process, environment friendliness is achieved, cleanliness is achieved after welding, no residue exists, and cleaning is avoided; and in addition, the configuration method is simple, and the production cost is low.

Description

technical field [0001] The invention relates to the technical field of hot-dip tinning process, in particular to an environment-friendly water-based flux for tinning. Background technique [0002] At present, the circuit boards of most electronic products, including the leads of electronic components, mostly use hot-dip tinned copper wires. However, this technology needs to use flux to assist in providing soldering quality. Many common fluxes can be applied to the hot-dip tinning process, but the effect is not good, and the solder gloss, roundness, and high density cannot be fully achieved, and the surface of the finished product has pitting , black spots, exposed copper, and rough and loose crystal defects, which are prone to more defects such as sharpening and unsatisfactory solder layer. During the soldering process, there are more oxides, oxidized slag, white and black oil stains on the surface of the tin liquid . Not only that, the shelf life of the finished product a...

AI Technical Summary

Problems solved by technology

However, this technology needs to use flux to assist in providing soldering quality. Many common fluxes can be applied to the hot-dip tinning process, but the effect is not good, and the solder gloss, roundness, and high density cannot be fully achieved, and the surface of the finished product has pitting , black spots, exposed copper, and rough and loose crystal defects, which are prone to more defects such as sharpening and unsatisfactory solder layer. During the soldering process, there are more oxides, oxidized slag, white and black oil stains on the surface of the tin liquid

Not only that, the shelf life of the finished product after tinning with ordinary flux is short, easy to oxidize, yellow, discolor, and dark, and it cannot achieve the intended effect when producing fine and ultra-fine lines, and the fluidity and surface activation performance of tin liquid are not good. , prone to mold blockage, disconnection and other phenomena

[0003] More importantly, ordinary fluxes are usually a mixture of rosin, resins, halide-containing activators, additives, and organic solvents. Although this type of flux has good solderability and low cost, it has solid residues after soldering. Therefore, the residue must be cleaned, which will not only increase the production cost, but also commonly used cleaning agents contain trioxyethylene, fluorine and chlorine compounds, which seriously pollute the environment. banned substances