Non-oxidized nano copper soldering paste for high-power chip packaging and preparation method of soldering paste

Abstract

The invention provides non-oxidized nano copper soldering paste for high-power chip packaging and a preparation method of the soldering paste. Copper nanoparticles with the non-oxidized surfaces with the particle size being 30-60 mu m and an organic solvent are mixed in the mass ratio of 2:1-5:1, mechanical stirring and planet type gravity stirring are performed, and the nano copper soldering paste is obtained. The invention further provides the preparation method of the copper nanoparticles with the non-oxidized surfaces. The non-oxidized nano copper soldering paste prepared with the method has higher conductivity and better mechanical properties than common nano copper soldering paste and tin-lead solder. The preparation method is simple and practical and causes no environmental pollution and industrial popularization and application can be realized.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging and interconnection materials, and relates to an oxidation-free nano-copper solder paste used for high-power chip packaging and a preparation method thereof. Background technique [0002] Microelectronic packaging provides interconnects, physical protection and mechanical support for semiconductor devices, enabling them to function under specific conditions. Therefore, packaging interconnect materials, which serve as a bridge between the chip and the rest of the system, play an important role in ensuring the continuity of device operation. In view of the operating temperature below 300°C, tin-based solder and conductive adhesive are often widely used in the packaging and interconnection of electronic components. However, in some special occasions such as automotive electronics, oil well drilling, and aerospace fields, the use temperature of devices is as high as 350°C. At this time, ...

AI Technical Summary

Problems solved by technology

Although gold and silver have excellent electrical conductivity, due to the high cost of raw materials, it is difficult to popularize and apply them on a large scale, while copper not only has better electrical conductivity, but also has low cost, which is more suitable for huge electronic industry clusters

The problem is that the chemical properties of copper are lively and easy to oxidize. On the one hand, the existence of oxidation increases the sintering temperature of copper nanoparticles, which narrows the scope of application of nano-copper solder paste; on the other hand, it will make the electrical properties of nano-copper sintered Difference

Therefore, the existing nano-copper solder pastes all have the problems of high sintering temperature and poor conductivity, and the mechanical properties of the formed connection structure also need to be improved.

Images