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Polyvalent Alkyne Compound, Method For Producing The Same And Use Thereof

A compound and multi-component technology, applied in the fields of aldehyde/ketone condensation polymer adhesives, organic chemistry, electrical components, etc., can solve problems such as difficult to obtain heat-cured products with sufficient heat resistance, and achieve excellent heat resistance.

Active Publication Date: 2017-07-04
AIR WATER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its use temperature also reaches 200°C or higher, so it is difficult to obtain a thermosetting product with sufficient heat resistance by using a thermosetting resin composition containing an epoxy-based material mainly composed of a conventional epoxy resin.

Method used

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  • Polyvalent Alkyne Compound, Method For Producing The Same And Use Thereof
  • Polyvalent Alkyne Compound, Method For Producing The Same And Use Thereof
  • Polyvalent Alkyne Compound, Method For Producing The Same And Use Thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] 79.1 g of a phenol aralkyl resin having a structure represented by formula (3) ("HE100C-30" manufactured by AIR WATER Corporation, hydroxyl equivalent 176 g / eq), 76.3 g of anhydrous potassium carbonate, 65.7 g of propargyl bromide, 460 g of acetone was charged into a 1 L autoclave, and kept at 90° C. for 15 hours while stirring. After cooling, the acetone solution was recovered by filtration, and the acetone was removed at 90° C. and 30 Torr to obtain 89.4 g of monomer A, namely X in formula (1). 1 Represented as a polyalkyne compound of formula (3).

[0077] The melt viscosity at 150° C. was measured with an ICI cone and plate viscometer (manufactured by MST Engineering Co., Ltd.), and it was 143 mPa·s. In addition, the hydroxyl equivalent calculated by the acetylation back titration method was 2962 g / eq, and the calculation result of the propargylation rate (the ratio of A in the formula (1) having the structure represented by the formula (2)) was 93%. That is, mono...

Embodiment 2

[0079] 94.6 g of phenol biphenyl aralkyl resin having a structure represented by formula (3) ("HE200C-10" manufactured by AIR WATER Co., Ltd., hydroxyl equivalent 206 g / eq), 76.3 g of anhydrous potassium carbonate, propargyl 65.7 g of bromide and 460 g of acetone were charged into a 1 L autoclave, and kept at 90° C. for 15 hours while stirring. After cooling, the acetone solution was recovered by filtration, and the acetone was removed at 90°C and 30 Torr to obtain 106.9 g of monomer B, namely X in formula (1). 1 Represented as a polyalkyne compound of formula (4).

[0080] The melt viscosity at 150° C. was measured by an ICI cone and plate viscometer, and the result was 33 mPa·s. In addition, the hydroxyl equivalent calculated by the acetylation back titration method was 3592 g / eq, and the calculation result of the propargylation ratio was 93%. That is, monomer B in which 93% of A in the polyalkyne compound represented by formula (1) has a structure represented by formula (...

Embodiment 3

[0082]Monomer A, which is a polyalkyne compound, and cobalt(III) acetylacetonate, which is a curing accelerator, were blended in the proportions shown in Table 1, and mixed and dispersed homogeneously to obtain a melt viscosity at 150°C (using ICI cone-plate viscosity A resin composition that is a thermosetting resin composition of 144 mPa·s. This was heated at 180° C. for 6 hours, and then heated at 230° C. for 6 hours to perform thermal curing to prepare a test sample as a thermosetting product of the thermosetting resin composition of the present invention. Using the test sample, the glass transition temperature and the 5% weight loss temperature were measured to evaluate the heat resistance of the thermosetting product. The results are shown in Table 1.

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Abstract

The present invention provides a polyvalent alkyne compound which is excellent in heat resistance, a heat convertible resin composition, a heat curing and an insulating material. The polyvalent alkyne compound represented by the following formula 1 contains the aromatic hydrocarbon atoms with a high proportion, so that the heat curing which is excellent in heat resistance is obtained by carrying out the heating curing on the heat convertible resin composition containing the polyvalent alkyne compound. In the formula 1, Ar1 is an aromatic hydrocarbon which can have 1 to 3 hydrocarbon substituent groups having 1 to 6 carbons and of which the carbon number is 6 to 30; X1 is an alkyl which has the aromatic hydrocarbon atoms of which the carbon number is 6 to 18 and of which the carbon number is 6 to 30, n is an integer of 1 to 10, A is a structure or the hydrogen represented by the formula 2, and more than 50% of the A has the structure represented by the formula 2.

Description

technical field [0001] The invention relates to a polyalkyne compound with good heat resistance, its preparation method and application. Background technique [0002] A thermosetting resin composition has fluidity before thermosetting and becomes firm after thermosetting, and can be used as an excellent molding material. Among them, epoxy resin has the advantages of high adhesiveness, variety, and comparatively low price, and thus has been widely used in various industries for many years as a representative thermosetting resin composition. [0003] Nowadays, in various industries, from the viewpoint of environmental protection and the like, in order to meet these demands, it is inevitable to improve the heat resistance of thermosetting resin compositions used as molding materials. Epoxy resins that have been used as suitable thermosetting resins for molding materials in various industries have the following characteristics: the glycidyl group is an important cause of the de...

Claims

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Application Information

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IPC IPC(8): C08G14/12C08K5/07C08K5/3415C08K5/50C08L61/34C09J161/34
CPCC08G14/12C08K5/07C08K5/3415C08K5/50C08L2201/08C08L2203/20C09J161/34C08L61/34C07C43/215C08K5/0025C08L61/04C08L63/00H01B3/307
Inventor 高桥航村田清贵
Owner AIR WATER INC
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