Preparation method of high thermal conductivity encapsulated phase change material with uniform particle size

A technology of phase-change microcapsules and high thermal conductivity, which is applied in the direction of microcapsule preparation, microsphere preparation, chemical instruments and methods, etc., can solve the problems of poor heat transfer performance and large particle size distribution of phase-change microcapsules, and achieve improved storage capacity. Energy efficiency, improved heat transfer coefficient, and simple equipment

Inactive Publication Date: 2017-08-08
GUANGDONG UNIV OF TECH +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the shortcomings of large particle size distribution and poor heat transfer performance of the phase change microcapsules prepared by the existing preparation method, the present invention proposes t...

Method used

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  • Preparation method of high thermal conductivity encapsulated phase change material with uniform particle size

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Experimental program
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Effect test

Embodiment 1

[0047] (1) Take 4ml of heptadecane mixed solution with a 5ml syringe, take 15ml of aqueous solution with a 20ml syringe, fix the syringe on the precision syringe pump, and connect it with the sharp-nosed round capillary and cone core of the microfluidic chip through the Teflon catheter. The centrifuge tube is connected to the catheter.

[0048] (2) Adjust the flow rates of the continuous phase and the dispersed phase of the coaxial flow microchip to 10 μml min, respectively -1 and 20μml·min -1 . The continuous phase is introduced first, followed by the dispersed phase.

[0049] (3) Collect the microemulsion flowing out from the outlet section of the microchip, and place it in an incubator at 45° C. for 10 hours for curing reaction of the capsule wall.

[0050] (4) Filtrate the solidified suspension, wash it several times with deionized water, and freeze-dry to obtain phase-change microcapsules doped with nano-titanium dioxide with a particle size of 100 μm and a polydispers...

Embodiment 2

[0052] Step (1), (3) are the same as implementation example 1.

[0053] In step (2), the flow rates of the continuous phase and the dispersed phase of the coaxial flow microchip were 15 μml min -1 and 20μml·min -1 . The continuous phase is introduced first, followed by the dispersed phase.

[0054] Step (4) is the same as that of Example 1, but the particle size is 150 μm, and the phase-change microcapsules doped with nano-titanium dioxide with a polydispersity of less than 3% are obtained.

Embodiment 3

[0056] Step (1) Take 2ml of the mixed solution of paraffin and titanium dioxide TDI with a 5ml syringe, take 15ml of the mixed solution of water, sodium dodecylbenzenesulfonate and TEPA with a 20ml syringe, and connect the interfaces of the dispersed phase and the continuous phase respectively.

[0057] Steps (2), (3), (4) are the same as implementation example 1.

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Abstract

The invention provides a preparation method of an encapsulated phase change material with high thermal conductivity coefficient and uniform particle size. Metal particle doping and droplet microfluidic technologies are employed for a one-step emulsification and encapsulation process of a phase change material in a microfluidic chip. The phase change material in the capsule is doped with metal nanoparticles with high thermal conductivity coefficient, thus effectively increasing the thermal conductivity coefficient of the capsule and strengthening the heat transfer performance of the encapsulated phase change material. At the same time, the latent heat of phase change in the capsule has little reduction, and the practical value of the capsule is increased. The method provided by the invention uses droplet microfluidic technology to prepare a phase change material microemulsion, and uses a high precision injection pump to precisely control the emulsification process of droplets, thus obtaining a monodisperse phase change material microemulsion with narrow particle size distribution. The preparation process has the advantages of simple equipment, easy operation, little waste of raw materials, easy control of particle size, no noise pollution, and low energy consumption, etc., and is suitable for popularization and application in scientific research and industrial production of encapsulated phase change materials.

Description

technical field [0001] The invention belongs to the technical field of phase change microcapsule material preparation. Specifically relates to a preparation method of high thermal conductivity phase change microcapsules with uniform particle size. Background technique [0002] Phase change microcapsules (encapsμlate phase change materials, MEPCMS) refer to micron-sized capsules with phase change materials inside. Phase change microcapsules are generally divided into two parts: a capsule core composed of phase change materials and a polymer or inorganic shell called the capsule wall. Capsules generally have a uniform regular or irregular shape, and the shape of the capsule generally depends on the shape of the capsule core and the forming process of the shell. The capsule core is composed of one or more substances. The capsule wall is usually made of polymer materials or inorganic substances, and the capsule wall can be divided into single layer and multilayer. The encaps...

Claims

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Application Information

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IPC IPC(8): B01J13/02C09K5/06
CPCB01J13/02C09K5/063
Inventor 陈颖李俊李亦昂林刚贾莉斯成正东
Owner GUANGDONG UNIV OF TECH
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