A kind of cu-ni-co-sn-p copper alloy and preparation method thereof

A cu-ni-co-sn-p, copper alloy technology, applied in the field of Cu-Ni-Co-Sn-P copper alloy and its preparation, can solve the problem that cannot satisfy the development of VLSI strength and multi-pin Demand, affecting the industrialization and application of alloys, and complex production processes, etc., to achieve the effects of reducing macro and micro segregation, high strength, and solving pores

Active Publication Date: 2019-03-19
JIANGXI UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the copper-based lead frames in the domestic market mainly include several alloys such as C19210, C19400 and C70250. Among them, the conductivity of the C19210 alloy is greater than 80% IACS, but the strength is only about 400MPa, which cannot meet the strength requirements of large-scale integrated circuits and limits its Further use; while the conductivity of C19400 alloy is greater than 60% IACS, and the tensile strength reaches 450-600 MPa, it still cannot meet the strength of VLSI and the development needs of multi-pin, and it is mainly used in low-end lead frame materials; C70250 Alloy is a high-end lead frame material for integrated circuits, its electrical conductivity is about 45% IACS, and its tensile strength is greater than 600MPa. However, in the production process of this alloy, special quenching and aging procedures and equipment are required, and the production process is relatively complicated. , the production cost is high, and the current domestic products can only meet the requirements of low-end customers, which affects the industrialization and application of alloys

Method used

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  • A kind of cu-ni-co-sn-p copper alloy and preparation method thereof
  • A kind of cu-ni-co-sn-p copper alloy and preparation method thereof
  • A kind of cu-ni-co-sn-p copper alloy and preparation method thereof

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preparation example Construction

[0051] The preparation method of above-mentioned Cu-Ni-Co-Sn-P copper alloy specifically comprises the following steps:

[0052] (1) Melting and casting: alloys are prepared by smelting, degassing, removing inclusions, and electromagnetic stirring or mechanical stirring;

[0053] The melting temperature is 1200-1300°C, and the casting temperature is 1150-1250°C;

[0054] During the smelting process, the proportion of elements is precisely controlled, and the content of each element is tested online to supplement and adjust the proportion of alloy elements, and complete the entire casting process;

[0055] (2) Hot rolling: the hot rolling temperature is 800~950℃, and the hot rolling time is 4~8h;

[0056] (3) Spray treatment: the finishing temperature of hot rolling is kept above 700°C;

[0057] (4) Face milling: the milling amount of the upper knife is 0.4mm to 1mm, and the milling amount of the lower knife is 0.4mm to 1mm;

[0058] (5) Rough rolling: the reduction rate of ...

Embodiment 1

[0070] The alloy of the present invention adopts the following raw materials for smelting: electrolytic copper, pure nickel, pure tin, pure cobalt, and copper-phosphorus master alloy. The composition of the alloy is shown in Example 1 of Table 1.

[0071] (1) Melting and casting: (bright wire copper 30% + recycled copper 70%) + nickel + cobalt covering (calcined charcoal + electrode graphite powder) → melting + tin + 25% copper-phosphorus master alloy → slag removal → heating (1220°C )→degassing (10min)+75% copper-phosphorus master alloy+other trace elements (element Zr)→sampling analysis (temperature control at 1240±10°C)→composition adjustment→drawing (temperature control at 1215±10°C);

[0072] (2) Hot rolling: the hot rolling temperature is 900°C, and the holding time is 6h;

[0073] (3) Spray treatment: the finishing temperature of hot rolling is 710°C;

[0074] (4) Face milling: upper knife 0.5mm, lower knife 0.5mm;

[0075] (5) Rough rolling: the reduction rate is 60...

Embodiment 2

[0085] The alloy of the present invention adopts the following raw materials for smelting: electrolytic copper, pure nickel, pure tin, pure cobalt, and copper-phosphorus master alloy. The composition of the alloy is shown in Example 2 of Table 1.

[0086] (1) Melting and casting: (bright wire copper 30% + recycled copper 70%) + nickel + cobalt covering (calcined charcoal + electrode graphite powder) → melting + tin + 25% copper-phosphorus master alloy → slag removal → heating (1220°C )→degassing (10min)+75% copper-phosphorus master alloy+other trace elements (Mn)→sampling analysis (temperature control at 1250±10°C)→composition adjustment→drawing (temperature control at 1210±10°C);

[0087] (2) Hot rolling: the hot rolling temperature is 900°C, and the holding time is 6h;

[0088] (3) Spray treatment: the finishing temperature of hot rolling is 705°C;

[0089] (4) Face milling: upper knife 0.5mm, lower knife 0.5mm;

[0090] (5) Rough rolling: the reduction rate is 60%;

[0...

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Abstract

The application discloses a Cu-Ni-Co-Sn-P copper alloy which comprises the following components in percentage by weight: 0.2-1.0% of Ni, 0.5-1.5% of Sn, 0.2-1.0% of Co, 0.001-0.01% of P, and the balance of Cu. The tensile strengthsigma b of the copper alloy can reach 550-700MPa, the plastic elongation rate delta is 8-15%, the electric conductivity is 35-45% IACS, the anti-stress-relaxation property (120 DEG C, 1000h) is more than or equal to 95%, the soft-resistant performance (450 DEG C, 3 minutes) is more than or equal to 150HV, and the heat shrinkage rate (450 DEG C, 1 minute) is less than or equal to 0.01%. The invention discloses a preparation method of the Cu-Ni-Co-Sn-P copper alloy.

Description

technical field [0001] The invention relates to the technical field of copper alloy materials, in particular to a Cu-Ni-Co-Sn-P copper alloy and a preparation method thereof. Background technique [0002] With the rapid development of electronic communication and other related information industries, the demand for integrated circuits is increasing, and the requirements for them are also getting higher and higher. The core of modern electronic information technology is the integrated circuit, and the chip and the lead frame are packaged to form an integrated circuit. As the main structural material of integrated circuit packaging, lead frames play an important role in the circuit, such as carrying chips, connecting chips and external circuit board electrical signals, and mounting and fixing. Its main functions are: connecting external circuits and transmitting electrical signals; dissipating heat to the outside world to play a role in heat conduction; supporting and fixing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/06C22C9/02C22F1/08B22D11/114
CPCB22D11/114C22C9/02C22C9/06C22F1/08
Inventor 肖翔鹏梁琦明胡海军孙克斌田原晨张县委陈金水许海
Owner JIANGXI UNIV OF SCI & TECH
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