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Heat-conductive and temperature-resistant silicone foam material and preparation method thereof

A heat-conducting filler and foam technology, which is applied in the field of heat-conducting and temperature-resistant silicon foam materials and its preparation, can solve problems such as difficult control, general heat-conducting and temperature-resistant performance, thermal stability, and poor environmental resistance, and achieve simple process operation methods, Improve thermal conductivity and temperature resistance, good effect of cushioning resistance

Inactive Publication Date: 2017-09-08
CHANGZHOU CHIKE PHOTOELECTRICITY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, there has been a lot of research on this type of foaming mechanism silicone rubber foam material, such as a low-density silicone rubber sponge and its preparation method disclosed in patent CN10523861A, patent CN1028112A discloses a foamed silicone rubber, and patent CN104530712A discloses a A small-pore silicone rubber sponge and its preparation method. The silicone rubber foam materials disclosed in the above-mentioned patents are all foamed by a hydrosilicon addition reaction system. Poor environmental resistance, can only be used at -60~159°C
[0004] With the rapid development of industries such as electronics, aerospace, automobiles, and new energy, the requirements for the thickness, thermal conductivity, temperature resistance, and buffer resistance of silicon foam materials are getting higher and higher. Ordinary silicone rubber foam materials cannot meet the growing demand. Require
Patent 200610021076.8 discloses a closed-cell silicone rubber foam material foamed by radiation crosslinking mechanism and its preparation method. Patent 200510096572.5 discloses a silicone rubber foam characterized by immersing polyurethane foam in rubber solution and its manufacturing method. The above-mentioned patents are obtained Silicone rubber foam material has average thermal conductivity and temperature resistance, and it is difficult to make thin silicon foam material by using the above-mentioned patented preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Mix 25 parts of methyl silicone rubber, 20 parts of methyl phenyl silicone resin, and 10 parts of fumed silica in an open mill at room temperature for 20 minutes.

[0026] (2) Then add 3 parts of silicon carbide, 2 parts of thermally conductive carbon powder, 5 parts of 2,4-dichlorobenzoyl peroxide, and 10 parts of foaming agent (AC+ZNO+triethanolamine), and continue to knead and mix evenly.

[0027] (3) The homogeneous mixture kneaded in step (2) is pressed into a sheet with a certain thickness using a hot-pressing device, the hot-pressing temperature is 80-120° C., and the hot-pressing time is 5-10 minutes.

[0028] (4) Heat the sheet in step (3) in an oven at 180° C. for 3-5 minutes to completely foam the sheet.

[0029] (5) Forming and calendering the foamed material in step (4) in a calendering device to prepare a heat-conducting and temperature-resistant silicon foam material with a thickness of 1 mm.

Embodiment 2

[0031] (1) Mix 20 parts of methyl phenyl vinyl silicone rubber, 25 parts of methyl MQ silicone resin, and 8 parts of fumed silica in an open mill at room temperature for 20 minutes.

[0032] (2) Then add 3 parts of silicon carbide, 2 parts of thermally conductive carbon powder, 5 parts of 2,4-dichlorobenzoyl peroxide, and 10 parts of foaming agent (AC+ZNO+OBSH), and continue to knead and mix evenly.

[0033] (3) The homogeneous mixture kneaded in step (2) is pressed into a sheet with a certain thickness using a hot-pressing device, the hot-pressing temperature is 80-120° C., and the hot-pressing time is 5-10 minutes.

[0034] (4) Heat the sheet in step (3) in an oven at 180° C. for 3-5 minutes to completely foam the sheet.

[0035] (5) Forming and calendering the foamed material in step (4) in a calendering device to obtain a heat-conducting and temperature-resistant silicon foam material with a thickness of 1.5 mm.

Embodiment 3

[0037] (1) Mix 20 parts of vinyl silicone rubber, 25 parts of methylphenyl vinyl silicone rubber, and 8 parts of fumed silica in an open mill at room temperature for 20 minutes.

[0038] (2) Then add 3 parts of silicon carbide, 2 parts of thermally conductive carbon powder, 5 parts of 2,4-dichlorobenzoyl peroxide, and 10 parts of foaming agent (AC+ZNO+OBSH), and continue to knead and mix evenly.

[0039] (3) The homogeneous mixture kneaded in step (2) is pressed into a sheet with a certain thickness using a hot-pressing device, the hot-pressing temperature is 80-120° C., and the hot-pressing time is 5-10 minutes.

[0040] (4) Heat the sheet in step (3) in an oven at 180° C. for 3-5 minutes to completely foam the sheet.

[0041] (5) Forming and calendering the foamed material in step (4) in a calendering device to prepare a heat-conducting and temperature-resistant silicon foam material with a thickness of 0.5 mm.

[0042] The performance of table 1 silicon foam material of th...

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PUM

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Abstract

The invention relates to a heat-conductive and temperature-resistant silicone foam material and a preparation method thereof. The preparation method of the heat-conductive and temperature-resistant silicone foam material comprises the following steps: performing open milling on 20-45 parts of silicon rubber, 10-25 parts of silicon resin and 5-15 parts of a reinforcing agent for 10-30 minutes at normal temperature in an open mill, then adding 0-1 part of pigment, 2-5 parts of a heat-conductive filler, 3-10 parts of a curing agent and 5-15 parts of a foaming agent, continuing performing open milling till a uniform state, pressing the open-milled material into a sheet with a certain thickness by using hot pressing equipment, heating the sheet in a 180 DEG C drying tunnel for 3-5 minutes to completely foam the sheet, and then performing moulding calendering treatment in calendering equipment to obtain the silicone foam with the thickness of 0.3-5 MM. The silicone foam prepared by the preparation method provided by the invention has high heat conductivity and buffer resistance, can resist the temperature from -60 DEG C to 260 DEG C, and can be applied to a hot pressing occasion with a relatively high buffer need.

Description

technical field [0001] The invention relates to a heat-conducting and temperature-resistant silicon foam material and a preparation method. Background technique [0002] Silicone rubber refers to a polymer whose main chain is formed by silicon-oxygen (Si-O-Si) bonds. There are usually two organic groups attached to the silicon atom. The foam material is made by foaming silicone rubber. Soft, good resilience, and excellent heat and cold resistance, so its application field is increasing. Foam silicone rubber is a kind of tape formed by foaming and vulcanizing at room temperature with condensed hydroxyl-terminated raw silicone rubber as the base material, hydroxyl hydrogen-containing silicone oil as the foaming agent, and vinyl platinum complex as the catalyst. Porous sponge-like elastomer. [0003] In recent years, there has been a lot of research on this type of foaming mechanism silicone rubber foam material, such as a low-density silicone rubber sponge and its preparatio...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/07C08K13/02C08K3/36C08K3/34C08K3/04C08K5/14C08J9/10C08J9/04C09K5/14
CPCC08J9/04C08J9/103C08J2203/04C08J2203/20C08J2383/04C08J2483/04C08L83/04C08L2201/08C08L2203/14C08L2205/025C09K5/14C08K13/02C08K3/36C08K3/34C08K3/04C08K5/14
Inventor 王学刚蔡秀娟
Owner CHANGZHOU CHIKE PHOTOELECTRICITY TECH CO LTD
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