Heat-conductive and temperature-resistant silicone foam material and preparation method thereof
A heat-conducting filler and foam technology, which is applied in the field of heat-conducting and temperature-resistant silicon foam materials and its preparation, can solve problems such as difficult control, general heat-conducting and temperature-resistant performance, thermal stability, and poor environmental resistance, and achieve simple process operation methods, Improve thermal conductivity and temperature resistance, good effect of cushioning resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0025] (1) Mix 25 parts of methyl silicone rubber, 20 parts of methyl phenyl silicone resin, and 10 parts of fumed silica in an open mill at room temperature for 20 minutes.
[0026] (2) Then add 3 parts of silicon carbide, 2 parts of thermally conductive carbon powder, 5 parts of 2,4-dichlorobenzoyl peroxide, and 10 parts of foaming agent (AC+ZNO+triethanolamine), and continue to knead and mix evenly.
[0027] (3) The homogeneous mixture kneaded in step (2) is pressed into a sheet with a certain thickness using a hot-pressing device, the hot-pressing temperature is 80-120° C., and the hot-pressing time is 5-10 minutes.
[0028] (4) Heat the sheet in step (3) in an oven at 180° C. for 3-5 minutes to completely foam the sheet.
[0029] (5) Forming and calendering the foamed material in step (4) in a calendering device to prepare a heat-conducting and temperature-resistant silicon foam material with a thickness of 1 mm.
Embodiment 2
[0031] (1) Mix 20 parts of methyl phenyl vinyl silicone rubber, 25 parts of methyl MQ silicone resin, and 8 parts of fumed silica in an open mill at room temperature for 20 minutes.
[0032] (2) Then add 3 parts of silicon carbide, 2 parts of thermally conductive carbon powder, 5 parts of 2,4-dichlorobenzoyl peroxide, and 10 parts of foaming agent (AC+ZNO+OBSH), and continue to knead and mix evenly.
[0033] (3) The homogeneous mixture kneaded in step (2) is pressed into a sheet with a certain thickness using a hot-pressing device, the hot-pressing temperature is 80-120° C., and the hot-pressing time is 5-10 minutes.
[0034] (4) Heat the sheet in step (3) in an oven at 180° C. for 3-5 minutes to completely foam the sheet.
[0035] (5) Forming and calendering the foamed material in step (4) in a calendering device to obtain a heat-conducting and temperature-resistant silicon foam material with a thickness of 1.5 mm.
Embodiment 3
[0037] (1) Mix 20 parts of vinyl silicone rubber, 25 parts of methylphenyl vinyl silicone rubber, and 8 parts of fumed silica in an open mill at room temperature for 20 minutes.
[0038] (2) Then add 3 parts of silicon carbide, 2 parts of thermally conductive carbon powder, 5 parts of 2,4-dichlorobenzoyl peroxide, and 10 parts of foaming agent (AC+ZNO+OBSH), and continue to knead and mix evenly.
[0039] (3) The homogeneous mixture kneaded in step (2) is pressed into a sheet with a certain thickness using a hot-pressing device, the hot-pressing temperature is 80-120° C., and the hot-pressing time is 5-10 minutes.
[0040] (4) Heat the sheet in step (3) in an oven at 180° C. for 3-5 minutes to completely foam the sheet.
[0041] (5) Forming and calendering the foamed material in step (4) in a calendering device to prepare a heat-conducting and temperature-resistant silicon foam material with a thickness of 0.5 mm.
[0042] The performance of table 1 silicon foam material of th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com