Heat-resisting modified wire enamel and preparation method thereof
An enameled wire varnish, heat-resistant modification technology, applied in the field of heat-resistant varnish, can solve the problems of unguaranteed performance of enameled wire, limited environmental protection effect, difficult control of coated wire surface, etc., achieves low viscosity, excellent reworkability, Effect of improving heat resistance and electrical properties
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0023] A heat-resistant modified enameled wire varnish, comprising the following raw materials: 100kg of polymethylphenyl silicone resin, 32kg of phenolic resin, 8kg of tetrabasic zinc chromate, 5kg of diethanolamine, 6kg of toluene diisocyanate, heat stabilizer two Salt base lead phosphite 4kg, drier manganese dioxide 5kg, 703 curing agent 7kg, colorant carbon black 5kg, acetonitrile 15kg, alcohol solvent 50kg. Among them, the polymethylphenyl silicone resin has a weight loss rate of less than 15% and a dielectric strength of 15-40Kv / mm at a temperature of 400-600°C.
[0024] The preparation method of the above-mentioned heat-resistant modified enameled wire varnish comprises the following steps:
[0025] (1) Weigh polymethylphenyl silicone resin, diethanolamine, toluene diisocyanate, acetonitrile, and alcohol solvents according to weight, mix and stir evenly, heat up to 136°C, stir for 45 minutes, and sonicate for 12 minutes to obtain a homogeneous solution.
[0026] (2) We...
Embodiment 2
[0029] A heat-resistant modified enameled wire varnish, comprising the following raw materials: polymethylphenyl silicone resin 87kg, phenolic resin 38kg, tetrabasic zinc chromate 6kg, diethanolamine 5kg, toluene diisocyanate 6kg, heat stabilizer hard Calcium fatty acid 4kg, drier lead naphthenate 5kg, 793 curing agent 10kg, colorant lead yellow 5kg, acetonitrile 14kg, alcohol solvent 48kg. Among them, the polymethylphenyl silicone resin has a weight loss rate of less than 15% and a dielectric strength of 15-40Kv / mm at a temperature of 400-600°C.
[0030] The preparation method of the above-mentioned heat-resistant modified enameled wire varnish comprises the following steps:
[0031] (1) Weigh polymethylphenyl silicone resin, diethanolamine, toluene diisocyanate, acetonitrile, and alcohol solvents by weight, mix and stir evenly, heat up to 136°C, stir for 45 minutes, and sonicate for 15 minutes to obtain a homogeneous solution.
[0032] (2) Weigh the phenolic resin, place it...
Embodiment 3
[0035] A heat-resistant modified wire enamel, including the following raw materials: 102kg of polymethylphenyl silicone resin, 24kg of phenolic resin, 5kg of tetrabasic zinc chromate, 7kg of diethanolamine, 5kg of toluene diisocyanate, heat stabilizer three Basic lead sulfate 8kg, drier manganese naphthenate 6kg, curing agent 2-ethyl-4-methylimidazole 10kg, colorant chrome green 4kg, acetonitrile 15kg, alcohol solvent 56kg. Among them, the polymethylphenyl silicone resin has a weight loss rate of less than 15% and a dielectric strength of 15-40Kv / mm at a temperature of 400-600°C.
[0036] The preparation method of the above-mentioned heat-resistant modified enameled wire varnish comprises the following steps:
[0037] (1) Weigh polymethylphenyl silicone resin, diethanolamine, toluene diisocyanate, acetonitrile, and alcohol solvents by weight, mix and stir evenly, heat up to 140°C, stir for 40 minutes, and sonicate for 20 minutes to obtain a homogeneous solution.
[0038] (2) ...
PUM
Property | Measurement | Unit |
---|---|---|
dielectric strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com