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A kind of preparation method of core-shell structure cuo/al nano energetic thin film material

A technology of thin-film material and core-shell structure, applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of low yield, high energy consumption of high temperature treatment, easy collapse of oxide skeleton structure, etc. Achieve the effect of reduced energy consumption and good repeatability

Active Publication Date: 2019-08-09
NANJING UNIV OF SCI & TECH
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Problems solved by technology

The core-shell structure CuO / Al nano energetic film prepared by this method has the advantages of close contact between components, high purity, adjustable size and high heat release, but the high temperature treatment at 450 °C in the preparation process brings the following two Main problems: First, due to the stress problem in the thermal oxidation process of Cu thin film, the CuO nanowire film is easy to fall off, and the yield is low; second, the high temperature treatment consumes a lot of energy and is not compatible with the back-end CMOS process
This method can be used to prepare a variety of nano energetic thin film thermites, but the oxide skeleton structure is easy to collapse during the preparation process, the preparation repeatability is difficult to ensure, and high temperature treatment is still required in the preparation process

Method used

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  • A kind of preparation method of core-shell structure cuo/al nano energetic thin film material
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preparation example Construction

[0025] combine figure 1 , a method for preparing a core-shell structure CuO / Al nano energy-containing film material of the present invention, the specific steps are as follows:

[0026] The first step is to prepare a Cr transition layer and a Cu thin film on the substrate by vacuum physical vapor deposition technology;

[0027] In the second step, the base plated with the Cr transition layer and the Cu thin film obtained in the first step is placed in a NaOH solution and (NH 4 ) 2 S 2 o 8 In the mixed solution composed of solution, Cu(OH) with one-dimensional nanostructure is obtained after surface oxidation treatment. 2 film material;

[0028] In the third step, the Cu(OH) with one-dimensional nanostructure obtained in the second step 2 The film material is placed in a muffle furnace and heat-treated at 180-200°C in an air atmosphere to obtain a CuO film material with a one-dimensional nanostructure;

[0029] The fourth step is to use the magnetron sputtering depositio...

Embodiment 1

[0031] Step 1: Deposit a 20nm-thick Cr transition layer and a 500nm-thick Cu film on the silicon substrate using magnetron sputtering technology;

[0032] In the second step, place the silicon substrate coated with a 20nm thick Cr transition layer and a 500nm thick Cu film obtained in the first step by 3mol / L NaOH solution and 0.15mol / L (NH 4 ) 2 S 2 o 8 In the mixed solution composed of solution, after 5min surface oxidation treatment, Cu(OH) with one-dimensional nanostructure was obtained 2 film material;

[0033] In the third step, the Cu(OH) with one-dimensional nanostructure obtained in the second step 2 The thin film material was placed in a muffle furnace, heated to 180 °C at a heating rate of 3 °C / min, and kept for 4 hours to obtain a CuO thin film material with a one-dimensional nanostructure. The surface micromorphology was characterized by SEM, and the results were as follows figure 2 shown;

[0034] The fourth step is to use the magnetron sputtering depositi...

Embodiment 2

[0036] Step 1: Deposit a 30nm-thick Cr transition layer and a 1000nm-thick Cu film on the glass substrate using electron beam evaporation technology;

[0037]In the second step, place the silicon substrate coated with a 30nm thick Cr transition layer and a 1000nm thick Cu film obtained in the first step by 4mol / L NaOH solution and 0.2mol / L (NH 4 ) 2 S 2 o 8 In the mixed solution composed of solution, after 10min surface oxidation treatment, Cu(OH) with one-dimensional nanostructure was obtained 2 film material;

[0038] In the third step, the Cu(OH) with one-dimensional nanostructure obtained in the second step 2 The film material is placed in a muffle furnace, heated to 200 °C at a heating rate of 5 °C / min, and kept for 6 hours to obtain a CuO film material with a one-dimensional nanostructure;

[0039] The fourth step is to use thermal evaporation technology to coat the Al thin film with a nominal thickness of 2 μm on the CuO thin film material with a one-dimensional na...

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Abstract

The invention discloses a preparation method of a core-shell structure CuO / Al nanometer energetic film material. The method comprises the following steps: firstly, preparing a Cr transition layer and a Cu film on a substrate by using a vacuum physical vapor deposition technique; placing the substrate into a mixed solution containing NaOH and (NH4)2S2O8 at room temperature to obtain a Cu(OH)2 film material with a one-dimensional nanostructure; then, performing heat treatment to obtain a CuO film material with a one-dimensional nanostructure; lastly, coating the CuO one-dimensional nanostructure with nanometer Al by using the physical vapor deposition technique to obtain the core-shell structure CuO / Al nanometer energetic film material. The temperature is limited at 200 DEG C or less in a preparation process, the energy consumption is significantly lowered compared with an existing high-temperature treatment process in which the temperature is more than or equal to 450 DEG C, the prepared core-shell structure CuO / Al nanometer energetic film material can be compatible with a back-end CMOS (Complementary Metal-Oxide-Semiconductor Transistor) process, and the preparation process has high repetitiveness.

Description

technical field [0001] The invention belongs to the technical field of nanocomposite materials, and relates to a preparation method of a CuO / Al nanometer energetic film material with a core-shell structure. Background technique [0002] Nano thermite is composed of nanoscale oxidizing agent and reducing agent, also known as metastable intermolecular complex. After the components are nanosized, the specific surface area increases significantly, the contact area between the oxidizing agent and the reducing agent increases, the distance of diffusion and mass transfer decreases, and the chemical reaction rate increases rapidly. In addition, the significant increase in the surface energy enhances the reactivity of the nano-thermite, reduces the activation energy of the reaction, and reduces the energy consumption during the reaction initiation process. The high volume energy density, high chemical reaction rate and other excellent properties of nano thermite make it have broad a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/18C23C14/58C23C14/30C23C14/35
CPCC23C14/18C23C14/30C23C14/35C23C14/5806C23C14/5846
Inventor 周翔姜炜柯香
Owner NANJING UNIV OF SCI & TECH
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